• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05d
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• pp.105-108
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• 2003

CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, We have studied the CMP (chemical mechanical polishing) characteristics of slurry by adding of raw alumina abrasive and annealed alumina abrasive. As a experimental results, we obtained the comparable slurry characteristics compared with original silica slurry in the view point of high removal rate and low non-uniformity. Therefore, we can reduce the cost of consumables(COC) of CMP process for ULSI applications.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1442-1447
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• 2004

A significant amount of labor hour is being spent for clean up spent abrasives after blasting. So, for improving the efficiency of abrasive(grit) recovery process which acts as the neck of a battle in preceding coating stage, it was established the theoretical background for pneumatic transport technology in the abrasive recovery system as well as experimentally evaluated the effect of design parameters such as flow pattern, saltation velocity and pressure drop on the efficiency of the abrasive recovery system. And, by optimizing the operating parameter such as the length and diameter of suction hose, specification of recovery device, recovery mouth and hose connection method, a method which can dramatical1y increase the efficiency of abrasive recovery system, is derived.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.27-33
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• 2004

Electro-theological fluid is recently used for the micro polishing of 3-dimensional micro-aspherical lens. It's also used for polishing small area defects on the wide flat wafer. Since ER fluid shows a behavior of viscosity changing under certain electric fields. micro polishing efficiency may be enhanced for certain cases. In this paper, a perfluorinated carbonyl fluoride oil based ER fluids was used to improve surface polishing rate and submicron-scale accuracy. As the polishing electrodes, micro size cylindrical tools had been used for maximizing the electric field. An experimental device, which was applied for micro polishing a number of wafers of 4inches in size and other workpiece. was made on a precision polishing system. It consisted of a steel electrode. a wafer fixture. l0㎃ current and DC 5㎸ power supply unit, and a controller unit. From the Experiments. the ER fluid is applicable for micro polishing of small parts.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.32-38
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• 2006

The magnetic fluid polishing technique can polish the tool of complex shape, because the polishing method which polishes as compress the workpiece by the magnetism abrasives to arrange to the linear according to the line of magnetic force. Therefore, we producted the magnetic fluid polishing device in order that mirror like finishing processes the tool surface. In order to a polishing condition selection, polishing characteristic was estimated by polishing conditions which are magnetic flux density, polishing speed, grain size, magnetic fluid. The tool was polished to the selected polishing condition. The result to evaluate the polished tool's performance with the cutting force and tool wear, the polished tool's performance was improved compared with the tool not to polish.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.964-967
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• 2002

An internal finishing process by the application of magnetic abrasive machining has been developed as a new technology to obtain a fine inner surface of pipe. In this paper, another method of magnetic abrasive machining in which the N and S magnetic poles are feed and a workpiece is rotated only is tried in a fine-pipe, and its finishing characteristics is experimently investigated by various effective factors such as feeding amplitude. From the experimental results, it is found that the feed effects of magnetic poles on the finishing characteristics are large in internal finishing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.3-8
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• 2002

An intelligent polishing robot automation system is developed. Automatic Tool Change System(A.T.C.), Tool Posture Angle Control, and Robot Program for Polishing Application are developed and integrated into a robotic system that consists of a robot, pneumatic finding tool, and finding abrasives (papers and special films). A.T.C. is specifically designed to exchange whole grinding tool set for complete unmanned operation. Tool Posture Angle Control is developed to give a certain skew angle rather than right angle to tools on the surface for best finishing results. A.T.C. and Tool Posture Angle Control is controlled by a PC and the robot controller. Also, there have been some considerations on enhancing the performance of the system. Some elastic material is inserted between the grinding pad and the holder for better grinding contact. The robot path data is generated automatically from the NC data of previous machining process.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.1 s.94
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• pp.18-25
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• 1999

Chipping is an unavoidable phenomenon in the slot grinding process of hard and brittle materials. However, it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished chipping-free grooves and obtained the clear ground surfaces on glass and WC.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.12
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• pp.37-43
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• 2004

The performance of magnetic abrasive finishing fur surface is evaluated by the characteristic curve. The characteristic curve is generated by experiment in surface finishing. For experiment, new magnetic inductor is designed and manufactured. 15 kinds of powders are provided to find the relationship between powder characteristic and finishing performance. As powder, Fe-TiC. Polymer-TiC and Fe-NbC are used with different size. The size of abrasives and location are also important factor for the performance. From characteristic curve, two index are obtained, which specify the initial finishing performance and endurance of finishing performance. It is proved that the performance index can be applied to select proper powder for efficient deburring. It is shown that the characteristic curve can be used as good tools for evaluating powder performance in surface finishing and deburring.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.622-625
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• 2004

The CMP monitoring system was newly developed by the aid of friction force measurement, resulting from installation of piezoelectric quartz sensor on R&D polisher. The correlation between friction and CMP results was investigated in terms of tribological aspects by using the monitoring system. Various friction signals were monitored and analyzed by the change of experimental conditions such as pressure, velocity, pad and slurry. First of all, the lubrication regimes were classified with Sommerfeld Number through measuring coefficient of friction in ILD CMP. And then, the removal mechanism of abrasives could be understood through the correlation with removal rate and coefficient of friction. Especially, the amount of material removal per unit sliding distance is directly proportional to the friction force. The uniformity of CMP performances was also deteriorated as coefficient of friction increased.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.5
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• pp.616-621
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• 2010

New type of the base material of the light-emitting diode requires copper wafer in view of heat and electrical conductance. Therefore, polishing process of the substrate level is needed to get a nanometer level of surface roughness as compared with pattern structure of nano-size in the semiconductor industry. In this paper, a series of lapping and polishing technique is shown for the rough and deflected copper substrate of thickness 3mm. Lapping by sand papers tried air cooling method. And two steps of polishing used the diamond abrasives and the $Al_2O_3$ slurry of size 100mm considering the residual scratch. White-light interferometer proved successfully a mirror-like surface roughness of Ra 6nm on the area of $0.56mm{\times}0.42mm$.