• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.11a
• /
• pp.93-94
• /
• 2006

나노급 CMOS 기술에서 high-k 물질을 이용하여 게이트 유전막을 형성하고자 하는 연구가 활발히 진행되고 있다. 본 논문에서는 high-k 물질인 $TiO_2$의 특성에 대한 연구를 수행하였다. $TiO_2$를 APCVD법으로 p-type 실리콘 기판에 $50{\AA}{\sim}300{\AA}$ 두께로 증착하였고, evaporator를 이용하여 $TiO_2$ 박막위에 Al을 증착하여 MIS소자를 제작하였다. 두께를 가변 하여 Capacitance-Voltage (C-V) 특성을 측정, 분석하였다.

• 한국전산유체공학회:학술대회논문집
• /
• 2010.05a
• /
• pp.567-570
• /
• 2010

With continuously increasing flat panel display size, uniformity of thin film deposition has been drawing more attentions and associated fabrication methodologies are being actively investigated. Since the convective flow field of mixture gas plays a significant role for deposition characteristics of thin film in an APCVD system, it is greatly important to maintain uniform distribution and consistent concentration of mixture gas species. In this paper, computational study has been performed for the improvement of flow uniformity of mixture gas in an APCVD reactor during thin film deposition process. A diffuser slit has bee designed to spread the locally concentrated gas flow exiting from the flow distributor. A uniform flow distributor has been developed which has less dependency on operating conditions for global flow uniformity

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2005.11a
• /
• pp.295-296
• /
• 2005

Poly-Silicon Thin Film Transistor 응용을 위한 $SiO_2$ 박막 성장에 관한 연구로서 기존의 ICP-CVD를 이용한 실험에서 $SiH_4$ 가스대신 유기 사일렌 반응물질인 TEOS(TetraethylOrthosilicate) Source를 이용하여 APCVD 법으로 성장시켰다. $SiO_2$ 박막은 반도체 및 디스플레이 분야에서 필드산화막, 보호막, 게이트 절연막 등으로 사용되며, 이러한 산화막 증착을 TEOS를 이용하였고, 빠른 증착과 더 좋은 특성을 갖는 박막 형성을 위하여 $O_2$ 반응가스를 이용하였고, Ellipsometor, XPS 등을 이용하여 계면 특성 분석을 하였다.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 1998.11a
• /
• pp.39-39
• /
• 1998

• Proceedings of the Korean Ceranic Society Conference
• /
• 2003.04a
• /
• pp.114.2-114
• /
• 2003

• 한국신재생에너지학회:학술대회논문집
• /
• 2009.06a
• /
• pp.65-68
• /
• 2009

본 연구에서는 eagle 2000 glass위에 APCVD(atmospheric CVD)증착법으로 $SnO_2$:F 박막을 제조하였다. 공정 온도, doping 농도, TTC(Tin tetrachloride)와 $H_2O$, $CH_3OH$의 조성비를 공정 변수로 두었으며, 각 변수에 대한 전기적, 광학적 특성 및 결정성을 확인하였다. hall measurement를 이용 제작된 박막의 전기적 특성을 확인 하였고, uv-VIS spectroscopy, hazemeer를 이용 박막의 광학적 특성을 확인 하였다. 또한 XRD, FESEM, AFM을 이용 박막의 결정성 및 표면 특성을 확인 하였다. 박막의 결정성을 결정짓는 증착 온도의 경우 $590^{\circ}C$에서 완벽한 Tetragonal rutile 형태의 결정성을 보였으며 $SnO_2$:F film $1{\mu}m$ thickness에서 $10({\Omega}/{\square})$ 내외의 우수한 면저항값과 $30(cm^2/Vs)$ 이상의 mobility값을 확인 하였으며, 가시광영역대 에서 높은 투과율과 우수한 haze값을 얻었다.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.22 no.2
• /
• pp.90-96
• /
• 1985

The properties of plasma-enhanced CVD phosphorous silicate glass (PECVD PSG) for passivation layer are studied . Phosphorous contentration was analyzed with X-ray fluores-cence. As a result, PECVD PSG has a limiting phosphors concentration of about 8 mole%. Curves relating to etcll rate, infrared absorption ratio, and sheet resistivity were adapted to monitor phosphorous concentration indirectly Dielectric properties, step coverage, crack resistance, and gettering effect are discussed in both of atmospheric pressure CVD (APCVO) and PECVD oxide. PECVD SiO2 film have density of about 2.4 g/㎤ at deposition rate of 450$\AA$/min, refractive index of about 1.53, and breakdown at fields of II-13 MV/cm. Crack resistance of PECVD oxide is greater than APCVD oxide. PECVD PSG films contained with 2 mole % phosphorous show good step coverage and gettering ability. The obtained results show more advantages in PECVD PSG than in APCVD PSG for device passivation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.19 no.4
• /
• pp.334-338
• /
• 2006

Poly silicon TFT requires high quality dielectric film; conventional method of growing silicon dioxide needs highly hazardous chemicals such as silane. We have grown high quality dielectric film of silicon dioxide using non-hazardous chemical such as TFOS and ozone as reaction gases by APCVD. The films grown were characterized through C-V curves of MOS structures. Conventional APCVD requires high temperature processing where as in the process of current study, we developed a low temperature process. Interface trap density was substantially decreased in the silicon surface coated with the silicon dioxide film after annealing in nitrogen ambient. The interface with such low trap density could be used for poly silicon TFT fabrication with cheaper cost and potentially less hazards.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.22 no.3
• /
• pp.235-238
• /
• 2009

This paper describes the mechanical properties of poly (Polycrystalline) 3C-SiC thin films with $N_2$ in-situ doping. In this work, the poly 3C-SiC film was deposited by APCVD (Atmospheric Pressure Chemical Vapor Deposition) method using single-precursor HMDS (Hexamethyildisilane: $Si_2(CH_3)_6)$ at $1200^{\circ}C$. The mechanical properties of doped poly 3C-SiC thin films were measured by nono-indentation according to the various $N_2$ flow rate. In the case of 0 sccm $N_2$ flow rate, Young's Modulus and hardness were obtained as 285 GPa and 35 GPa, respectively. Young's Modulus and hardness were decreased according to increase of $N_2$ flow rate. The crystallinity and surface roughness was also measured by XRD (X-Ray Diffraction) and AFM (Atomic Force Microscopy), respectively.

• Journal of Sensor Science and Technology
• /
• v.16 no.4
• /
• pp.319-323
• /
• 2007

This paper describes the mechanical characteristics of poly 3C-SiC thin films grown on Si wafers with thermal oxide. In this work, the poly 3C-SiC thin film was deposited by APCVD method using only Ar carrier gas and single precursor HMDS at $1100^{\circ}C$. The elastic modulus and hardness of poly 3C-SiC thin films were measured using nanoindentation. Also, the roughness of surface was investigated by AFM. The resulting values of elastic modulus E, hardness H and the roughness of the poly 3C-SiC film are 305 GPa, 26 GPa and 49.35 nm respectively. The mechanical properties of the grown poly 3C-SiC film are better than bulk Si wafers. Therefore, the poly 3C-SiC thin film is suitable for abrasion, high frequency and MEMS applications.