• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.1
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• pp.80-85
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• 2022

ZnO-based transparent conductive films have been widely studied to achieve high performance optoelectronic devices such as next generation flexible and transparent display systems. In order to achieve a transparent flexible ZnO-based device, a low temperature growth technique using a flexible polymer substrate is required. In this work, high quality flexible ZnO films were grown on colorless polyimide substrate using atomic layer deposition (ALD). Transparent ZnO films grown from 80 to 200℃ were fabricated with a metal-semiconductor-metal structure photodetectors (PDs). As the growth temperature of ZnO film increases, the photocurrent of UV PDs increases, while the sensitivity of that decreases. In addition, it is found that the response times of the PDs become shorter as the growth temperature increases. Based on these results, we suggest that high-quality ZnO film can be grown below 200℃ in an atomic layer deposition system, and can be applied to transparent and flexible UV PDs with very fast response time and high photocurrent.

• Korean Journal of Materials Research
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• v.12 no.6
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• pp.493-498
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• 2002

$Al_2O_3$ is a promising gate dielectric because of its high dielectric constant, high resistivity and low leakage current. Since $OH^-$ radical in $Al_2O_3$ films deposited by ALD using TMA and $H_2O$ degrades the good properties of $Al_2O_3$, TMA and $O_3$ were used to deposite $Al_2O_3$ films and the effects of $O_3$ on the properties of the $Al_2O_3$ films were investigated. The growth rate of the $Al_2O_3$ film under the optimum condition was 0.85 $\AA$/cycle. According to the XPS analysis results the $OH^-$ concentration in the $Al_2O_3$ film deposited using $O_3$ is lower than that using $H_2O$. RBS analysis results indicate the chemical formula of the film is $Al_{2.2}O_{2.8}$. The carbon concentration in the film detected by AES is under 1 at%. SEM observation confirms that the step coverage of the $Al_2O_3$ film deposited by ALD using $O_3$ is nearly 100%.

• KIEE International Transactions on Electrophysics and Applications
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• v.2C no.6
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• pp.314-320
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• 2002

Three different ZnO nanomaterials (nanobelts, nanorods, and nanowires) were synthesized at 138$0^{\circ}C$ from ball-milled ZnO powders by a thermal evaporation procedure with an argon carrier gas without any catalysts. Transmission electron microscopy (TEM) revealed that the ZnO nanobelts are single crystalline with the growth direction perpendicular to the (010) lattice plane, and that the ZnO nanorods and nanowires are single crystalline with the growth directions perpendicular to the (001) and (110) lattice Planes, respectively. In cathodoluminescence (CL), the energy Position of the near band-edge (NBE) peak is 3.280 eV for the 100-, 250-, and 500-nm thick nanobelts, 3.262 eV for the 100- and 250-nm thick nanorods, and 3.237 eV for the 500-nm thick nanorods. The synthesized ZnO nanorods were coated conformally with aluminum oxide (Al$_2$O$_3$) material by atomic layer deposition (ALD). $Al_2$O$_3$films were then deposited on these ZnO nanorods by ALD at a substrate temperature of 300 $^{\circ}C$ using trimethylaluminum (TMA) and distilled water ($H_2O$). Transmission electron microscopy (TEM) images of the deposited ZnO nanorods revealed that 40nm-thick $Al_2$O$_3$ cylindrical shells surround the ZnO nanorods.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.381-381
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• 2009

염료감응형 태양전지의 효율 향상을 위한 다양한 방법들 중 $TiO_2$ 나노 파우더의 표면 개질 및 페이스트의 분산성 향상을 위한 연구가 활발하게 진행되고 있다. 기존 나노 파우더의 표면 개질법으로는 액상 공정인 졸겔법이 있으나 표면 처리 공정에서의 응집현상은 아직 해결해야 할 과제 중 하나이다. 이에 본 연구에서는 진공증착방법인 ALD법을 이용하여 염료감응형 태양전지용 $TiO_2$ 나노 파우더의 $SiO_2$ 산화물 표면처리를 통한 분산특성을 파악하였다. 기존 ALD법의 경우 reactor의 온도가 $300{\sim}500^{\circ}C$ 정도의 고온에서 공정이 이루어졌지만 본 실험에서는 2차 아민계촉매(pyridine)을 사용하여 reactor의 온도를 $30^{\circ}C$정도의 저온공정에서 $SiO_2$ 산화물을 코팅을 하였다. MO source로는 액체상태의 TEOS$(Si(OC_2H_5)_4)$를, 반응가스로는 $H_2O$를 사용하였고, 불활성 기체인 Ar 가스는 purge 가스로 각각 사용 하였다. ALD 공정에 의해 표면처리 된 $TiO_2$ 나노 파우더의 분산특성은 각 공정 cycle에 따라 FESEM을 통하여 입자의 형상 및 분산성을 확인하였으며 입도 분석기를 통하여 부피의 변화 및 분산 특성을 확인하였다. 공정 cycle 이 증가함에 따라 입자간의 응집현상이 개선되는 것을 확인 할 수 있었으며, 100cycles에서 응집현상이 가장 많이 감소하는 것을 확인할 수 있었다. 또한 표면 처리된 $SiO_2$ 산화막은 XRD를 통한 결정 분석 및 EDX를 통한 정성 분석을 통하여 확인하였다.

• Korean Journal of Materials Research
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• v.28 no.5
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• pp.268-272
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• 2018

An $Al_2O_3/AlN$ bilayer deposited on GaN by atomic layer deposition (ALD) is employed to prepare $Al_2O_3/AlN/GaN$ metal-insulator-semiconductor (MIS) diodes, and their interfacial properties are investigated using X-ray photoelectron spectroscopy (XPS) with sputter etch treatment and current-voltage (I-V) measurements. XPS analyses reveal that the native oxides on the GaN surface are reduced significantly during the early ALD stage, indicating that AlN deposition effectively clelans up the GaN surface. In addition, the suppression of Al-OH bonds is observed through the ALD process. This result may be related to the improved device performance because Al-OH bonds act as interface defects. Finally, temperature dependent I-V analyses show that the barrier height increases and the ideality factor decreases with an increase in temperature, which is associated with the barrier inhomogeneity. A Modified Richardson plot produces the Richardson constant of $A^{**}$ as $30.45Acm^{-2}K^{-2}$, which is similar to the theoretical value of $26.4Acm^{-2}K^{-2}$ for n-GaN. This indicates that the barrier inhomogeneity appropriately explains the forward current transport across the $Au/Al_2O_3/AlN/GaN$ interface.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.126-126
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• 2012

In past decades, the themal inkjet (TIJ) printer has been widely used as one of the most well-known digital printing technology due to its low cost, and high printing quality. Since the printing speed of TIJ printers are much slower than that of laser printers, however, there has been intensive efforts to raise the printing speed of TIJ printers. One of the most plausible methods to raise the printing speed of TIJ printers is to adopt a page-wide array TIJ printhead. To accomplish this goal, the high efficiency inkjet heating resistor films should be developed to settle the high power consumption problem of a page-wide array TIJ printhead. In this study, we investigated noble metal based multicomponent thin film resistor films prepared by atomic layer deposition (ALD) for a high efficiency inkjet printhead. Design concept, preparation, material properties of noble metal based multicomponent thin films will be discussed in terms of mutlfunctionality.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.76-76
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• 2011

투명 태양전지 구조 내에 선택적 투과막을 채용하여 태양전지의 성능 개선을 극대화할 수 있다. 금속 산화물 계의 선택적 투과막은 가시광선 대역은 투과시키고, 적외선 영역은 광흡수층으로 반사시키는 역할을 하므로 변환효율이 증가한다. 이제까지 Al 및 Ti 산화물 계의 선택적 투과막은 atomic layer deposition (ALD)을 이용하여 형성하여 왔다[1]. ALD 기술의 경우 정밀한 두께 조절성 및 우수한 conformality의 장점이 있지만, 증착속도가 느리기 때문에 상업적으로 이용하기에 제약이 있다. 따라서 본 연구에서는 Al/Ti 산화물 투과막을 기존의 ALD 공정이 아닌 스퍼터(sputter) 증착을 이용하여 형성하고, 광학적 특성을 평가하였다. 스퍼터 증착 공정을 이용하여 선택적 투과막을 형성함으로써 기존의 공정에 비하여 태양전지 제조 원가 절감의 효과가 있을 것이라 판단된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.8
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• pp.474-478
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• 2017

We report on thin-film transistors based on $TiO_x$ pre-annealed by femtosecond laser pulses. A 30-nm thick $TiO_x$ active channel layer was initially deposited by an ALD system. The $TiO_x$ semiconducting films were annealed by irradiation with a femtosecond laser (power: $3W/cm^2$) for 5, 25, and 50s. Atomic force microscopy images revealed that the surface of a $TiO_x$ film without femtosecond laser pre-annealing was relatively rough, while after annealing with femtosecond laser pulses, the surface of the $TiO_x$ films became smooth. With increasing radiation time, the surrounding gas atmosphere could have a larger impact on the $TiO_x$ surface; meanwhile, the thin-film roughness decreased. Thin-film transistors with $TiO_x$ active channels pre-annealed at 50s exhibited good transfer characteristics and an on-to-off current ratio of ${\sim}10^3$.

• Journal of Sensor Science and Technology
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• v.18 no.3
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• pp.239-244
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• 2009

We fabricated nano-templates by low temperature BCP(block copolymer) process at 180 $^{\circ}C$, then we deposited 10 nm-thick $TiO_2$ layers with ALD(atomic layer deposition) at low temperature of 150 $^{\circ}C$. Through FE-SEM analysis, we confirmed the successful formation of the groove-type(width of crest : 30 nm, width of trough : 18 nm) and the cylinder-type(diameter : 10 nm, distance between hole : 25 nm) templates. Moreover, after $TiO_2$-ALD processing, we confirmed the deposition of the uniform nano layers of $TiO_2$ on the nano-templates. Through AFM analysis, the pitches of the crest-through(in groove-type) and hole-hole(in cylinder-type) were the same before and after $TiO_2$-ALD processing. In addition, we indirectly determined the existence of the uniform $TiO_2$ layers on nano-templates as the surface roughness decreased drastically. We successfully fabricated nano-template at low temperature and confirmed that the three-dimensional nano-structure for sensor application could be achieved by $TiO_2$-ALD processing at extremely low temperature of 150 $^{\circ}C$.

• Korean Journal of Materials Research
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• v.18 no.10
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• pp.515-520
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• 2008

We fabricated 10 nm-$TiO_2$ thin films for DSSC (dye sensitized solar cell) electrode application using ALD (atomic layer deposition) method at the low temperatures of $150^{\circ}\;and\;250^{\circ}$. We characterized the crosssectional microstructure, phase, chemical binding energy, and absorption of the $TiO_2$ using TEM, HRXRD, XPS, and UV-VIS-NIR, respectively. TEM analysis showed a 10 nm-thick flat and uniform $TiO_2$ thin film regardless of the deposition temperatures. Through XPS analysis, it was found that the stoichiometric $TiO_2$ phase was formed and confirmed by measuring main characteristic peaks of Ti $2p^1$, Ti $2p^3$, and O 1s indicating the binding energy status. Through UV-VIS-NIR analysis, ALD-$TiO_2$ thin films were found to have a band gap of 3.4 eV resulting in the absorption edges at 360 nm, while the conventional $TiO_2$ films had a band gap of 3.0 eV (rutile)${\sim}$3.2 eV (anatase) with the absorption edges at 380 nm and 410 nm. Our results implied that the newly proposed nano-thick $TiO_2$ film using an ALD process at $150^{\circ}$ had almost the same properties as thsose of film at $250^{\circ}$. Therefore, we confirmed that the ALD-processed $TiO_2$ thin film with nano-thickness formed at low temperatures might be suitable for the electrode process of flexible devices.