• 제목/요약/키워드: AJM

검색결과 27건 처리시간 0.017초

전문 연구 중심의 존스 홉킨스 대학 수학과 설립 (1876-1883) (The Emergence of Research-oriented Department of Mathematics in Johns Hopkins University (1876-1883))

  • 정원
    • 한국수학사학회지
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    • 제33권1호
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    • pp.21-32
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    • 2020
  • Daniel Coit Gilman, the first president of Johns Hopkins University, aspired to build an ideal university focused on the competent faculty and their research. His plan was carried out through opening the first American graduate program, hiring professors with the highest-level research performances, assigning them less teaching burdens, and encouraging them to actively publish professional journals. He introduced Department of Mathematics as an initial model to put his plan into practice, and James Joseph Sylvester, a British mathematician invited as the first mathematics professor to Johns Hopkins University, made it possible in a short time. Their concerted efforts led to building the Department of Mathematics as a professional research institute for research, higher education, and expert training as well as to publishing American Journal of Mathematics.

제 1장. 연삭가공의 기초

  • 한국광학기기협회
    • 광학세계
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    • 통권105호
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    • pp.49-56
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    • 2006
  • 한국광학기기협회에서는‘한·일 광산업 기술협력’을 보다 효율적으로 추진하기 위하여 해마다 일본 연수기관 및 기업에 대한 현장연수를 실시하고 있는 가운데, 올해는 처음으로 지난 8월에 일본정밀공학회(JSPE)에서 주최하는‘차세대 초정밀광학부품 나노가공기술연수’를 실시했다. 연수기관은 일본 센다이 소재의 동북대학(Tohoku University)으로 구리야가와 츠네모토 교수가 교육을 담당했다. 주요 연수 내용으로는 마이크로 광학부품가공/초정밀 비구면 렌즈 가공/전기점성유체를 이용한 비구면 렌즈 코아 연마/특수광학렌즈 SPDT 가공/초고속 가공/마이크로 AJM 가공/마이크로 초음파가공이며 본 고에서는 직접 연수에 참가 못한 독자들을 위해 연수내용을 번역 게재하고자 한다. 이달에는 제1장 연삭가공의 기초 게재를 시작으로 11월호에 이어서 나머지 2,3,4장 교육과정내용을 게재할 예정이다.

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부분 대역 재밍 환경에서 SFH(Slow Frequency Hopping) 위성 통신 방식을 사용하는 A-NED(Adaptive NED) 알고리즘 항재밍 성능 분석 (A Study of Anti-Jamming Performance using A-NED(Adaptive NED) Algorithm of SFH(Slow Frequency Hopping) Satellite Communication Systems in PBNJ)

  • 김성호;신관호;김희중;김영재
    • 한국군사과학기술학회지
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    • 제13권1호
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    • pp.30-35
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    • 2010
  • As of today, Frequency Hopping techniques are widely used for over-channel interference and anti-jamming communication systems. In this paper, analysis the performance of robustness on the focus of some general jamming channel. In FH/SS systems, usually SFH(Slow Frequency Hopping) and FFH(Fast Frequency Hopping) are took up on many special communication systems, the SFH, FFH are also combined with a channel diversity algorithm likes NED(Normalized Envelop Detection), EGC(Equal Gain Combines) and Clipped Combines to overcome jammer's attack. This paper propose Adaptive-NED and shows A-NED will be worked well than the others in the some general jamming environments.

실험적 방법에 의한 파인세라믹스의 연삭성에 관한 연구 (A study on the Grindability of Fine Ceramics by Experimental Method)

  • 김성겸
    • 반도체디스플레이기술학회지
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    • 제10권3호
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    • pp.35-42
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    • 2011
  • This paper describes the characteristics of high speed grinding and the influence of wheel surface speed V and a grindability of the grinding materials. The various fine ceramics pieces was ground by metal and vitrified bonded diamond wheel. The surface roughness of fine ceramics(Zirconia($ZrO_2$), Silicon Carbide(SiC), Silicon Nitride($Si_3N_4$), Alumina($Al_2O_3$)) decreases from $0.05{\mu}m(R_{max})$ to $0.025{\mu}m(R_{max})$ when the wheel speed at grinding point increases the wheel speed. Relation between the temperature at grinding point and surface roughness was linear. Abrasive jet machining(AJM), a specialized from of shot blasting, is considered one of the most helpful micro machining methods for hard and brittle materials such as glasses and ceramics by constant pressure grinding.

입자연마가공에서의 압력 속도 및 유체점도의 영향에 대한 고찰 (A Study of the Effects of Pressure Velocity and Fluid Viscosity in Abrasive Machining Process)

  • 양우열;양지철;성인하
    • Tribology and Lubricants
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    • 제27권1호
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    • pp.7-12
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    • 2011
  • Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemical-mechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.

연삭기법을 이용한 패터닝 기술 (Grinding Technology for Surface Texturing)

  • 고태조;한두섭;구강;박종권
    • 한국정밀공학회지
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    • 제31권5호
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    • pp.367-373
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    • 2014
  • Surface texturing is a machining process on the surface to give engineering functions. The representative process of the surface texturing is lotus effect to give hydrophobic property by the lithography and chemical etching, which is the bio mimic from the nature. Surface texturing can be manufactured by a lot of processes, in particular using mechanical method such as a precise diamond turning, grinding, rolling, embossing, vibrorolling, and abrasive jet machining (AJM). Among them, the grinding process is notable in terms of the wide range of texturing area and fast processing time. The patterning by grinding is done by the grooved grinding wheel on the work piece. In this case, the pattern shape is determined by the grinding conditions as well as the wheel dressing conditions. In this paper, experimental study on the pattern shapes were done and provide the feasibility in use for the large area patterning.

선형구배 응력장에서 표층의 잔류응력 측정에 관한 연구 (A Study on the Measurements of Sub-surface Residual Stress in the Field of Linear Stress Gradient)

  • 최병길;전상윤;이택순
    • 대한기계학회논문집
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    • 제16권9호
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    • pp.1632-1642
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    • 1992
  • 본 연구에서는 방전가공(electric disharge machining, EDM) 또는 공기연마 분사기(air-abrasive jet machine, AJM) 가공에 의하여 인장 시험편 또는 외팔보 시험 편에 구멍깊이를 증가시켜 가면서 구멍을 뚫었다. 여기에서 방저가공(EDM)을 채택한 것은 구멍깊이를 직접 계측하는 것이 가능하여 구멍깊이 측정 오차에 기인하는 잔류응 력 측정오차를 최소화 할 수 있기 때문이며, 공기연마 분사기를 채택한 것은 구멍을 뚫는 동안 가공응력을 유발시키지 않기 때문이었다. 위 인장 시험편 또는 외팔보 시 험편을 이용하여 균일한 응력장과 두께 방향으로 변하는 선형적 구배응력장을 구현하 고, 이 때 각각 구멍깊이가 다른 원통형 막힘 구멍으로 부터 이완되는 스트레인을 계 측하였다. Schajer가 제안한 멱급수법과 최소장승법을 적용하여 균일응력장 또는 구 배 응력장에서 측정되는 스트레인을 잔류응력으로 환산하였으며, 환산된 잔류응력과 실제로 작용하는 응력을 비교하므로서 이론적으로 제시된 멱급수법과 최소자승법의 타 당성을 실험적으로 검토하는데 본 연구의 목적이 있다. 이 때 얕은 구멍깊이 (0.3∼ 1.2mm)에서 측정되는 스트레인을 이용하여 Schajer의 제안에 따라 잔류응력을 산정하 므로서, 잔류응력 계측 대상 구조물을 가급적 덜파괴시키며 잔류응력을 측정할 수 있 는지 여부를 실험적으로 검토하였다.