• Journal of Welding and Joining
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• v.18 no.6
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• pp.42-47
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• 2000

The object of this study is to estimate Sn-Ag-Bi-Ga solder alloy as a substitute for Sn-37Pb alloy. For Sn-Ag-Bi-Ga alloys, Ag, Bi and Ga contents are varied. (Ag : 1~5%, Ga : 3%, Bi : 3~6%) Comparing to Sn-37Pb alloy Sn-Ag-Bi-Ga alloys have wider melting temperature range up to max. $18.7^{\circ}C$. With increasing Ag, Bi contents, the wettability of the alloys increased up to max. 6.6 mN. The vickers hardness of the alloys was max. 46.4 Hv. The ultimate tensile stress of the alloys was max. 60.3 MPa and the elongation was max. 1.2%. The joint strength between circuit board and solder was max. 55.5 N and the joint strength between connector and solder was max. 176.1 N. There were no cracks in this alloys after thermal shock test.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.110-113
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• 2003

여러가지 Sn-Ag-Cu 솔더조성과 솔더링 후의 냉각속도에 따라 솔더링 접합부에서의 계면 미세조직의 다양한 변화를 관찰해 보았다. 현재까지 Sn-Ag-Cu 3원계 공정점에 대한 정확한 연구가 미흡하고, 상용으로 제품화되고 있는 Sn-Ag-Cu 합금계는 3원계 공정조성에서 약간 벗어난 조성들을 선택하고 있다고 할 수 있다. 따라서, 본 연구에서 사용한 Sn-Ag-Cu 합금 조성은 Sn-3.5Ag, Sn-3Ag-0.7Cu, Sn-3Ag-1.5Cu, Sn-3.7Ag-0.9Cu, Sn-6Ag-0.5Cu로 선택하였으며, 각 조성에서 Lap Shear Joint를 제조하였다. 사용한 Solder pad는 Cu pad와 Cu pad 위에 Au/Ni를 plating한 것을 이용하였다. 리플로우 솔더링 조건은 $250^{\circ}C$ 이상의 온도에서 60초 실시하였으며, 리플로우 솔더링 후의 냉각속도를 달리하여 냉각시켰다. 솔더링 후의 냉각속도가 느려질수록 계면 금속간화합물(IMC)의 두께가 더욱 증가하며, 조대화되었다. 또한 솔더 조성의 영향에서 Cu와 Ag의 함량이 높을수록 계면 IMC의 두께가 증가되었으며, 이는 솔더내부에 형성된 IMC 입자들이 조대화되어 계면 IMC층에 결합되어 나타났기 때문이다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.213-217
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• 2012

In this study, we have investigated the holographic grating formation on Ag-doped amorphous As-Ge-Se-S thin films. The dependence of diffraction efficiency as afunction of Ag layer thickness has been investigated in this amorphous chalcogenide films. Holographic gratings was formed using [P:P] polarized Diode Pumped Solid State laser (DPSS, 532.0 nm). The diffraction efficiency was obtained by +1st order intensity. The results were shown that the diffraction efficiency of Ag/AsGeSeS double layer thin films for the Ag thickness, the maximum grating diffraction efficiency using 60 nm Ag layer is 0.96%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.249-250
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• 2006

Bi-2212/Ag ROSAT용 와이어의 제작은 PIT법으로 제작된 단일 필라멘트가 사용되었다. 제작된 필라멘트를 압연하여 너비 8.6mm, 두께 2.15mm의 압연 테입을 제조한 후 4개씩 적층하여 3 부분의 마름모로 만들어 다시 내경 17.2mm의 Ag튜브에 적층하여 ROSAT 와이어를 약 150 mm로 제작하였다. 제작된 ROSAT 와이어는 산소분위기에서 약 60시간 동안 열처리 되었다. 이때 열처리 온도와 최고점에서의 유지시간에 따른 Bi-2212/Ag ROSAT 와이어의 전기적 특성을 평가 하였다. 기존의 Bi-2212/Ag 와이어에 비해 압연, 적층, 인발하여 제작된 동일한 크기의 ROSAT 와이어가 향상된 전기적 특성을 나타내었다.

• Korean Journal of Materials Research
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• v.9 no.7
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• pp.747-752
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• 1999

The interfacial reaction and joint properties of Sn-3.5Ag/Cu and Sn-3.5Ag-1Zn/Cu joint were studied. Modified double lap shear solder joints of Sn-3.5Ag and Sn-3.5Ag- lZn solder were aged for 60days at $100^{\circ}C$ and $150^{\circ}C$ and then loaded to failure in shear. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-lZn at the aging temperature of $150^{\circ}C$ Through the SEM/EDS analysis of solder joint, it was proved that intermatallic layer was $Cu_{6}Sn_5$ phase and aged specimens showed that intermatallic layer grew in proportion to $t_{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_{6}Sn_{5}$ phase formed at the side of substrate and $Cu_{5}Zn_{8}$ phase formed at the other side in double layer. The shear strength of the Sn-3.5Ag/Cu joint improved by addition of IZn. The strength of the joint increases with strain rate and decreases with aging temperature

• Journal of Powder Materials
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• v.25 no.3
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• pp.232-239
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• 2018

In this paper, the recovery and nanoparticle synthesis of Ag from low temperature co-fired ceramic (LTCC) by-products are studied. The effect of reaction behavior on Ag leaching conditions from the LTCC by-products is confirmed. The optimum leaching conditions are determined to be: 5 M $HNO_3$, a reaction temperature of $75^{\circ}C$, and a pulp density of 50 g/L at 60 min. For the selective recovery of Ag, the [Cl]/[Ag] equivalence ratio experiment is performed using added HCl; most of the Ag (more than 99%) is recovered. The XRD and MP-AES results confirm that the powder is AgCl and that impurities are at less than 1%. Ag nanoparticles are synthesized using a chemical reduction process for recycling, $NaBH_4$ and PVP are used as reducing agents and dispersion stabilizers. UV-vis and FE-SEM results show that AgCl powder is precipitated and that Ag nanoparticles are synthesized. Ag nanoparticles of 100% Ag are obtained under the chemical reaction conditions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.34 no.2
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• pp.115-120
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• 2021

In this study, composite transparent electrodes were fabricated either from a conductive polymer poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS) or silver nanowire (AgNW). Three transparent electrodes such as PEDOT:PSS, PEDOT:PSS and AgNW mixture, and AgNW were fabricated. As for a transparent electrode, measured sheet resistance values were 89.6, 60.6 and 28.6 Ω/sq, and the transmittance values were 80.2, 82.0 and 83.8% while surface roughness (Rq) values were 4.1, 8.1, 20.4 nm for PEDOT:PSS, PEDOT:PSS and AgNW mixture, and AgNW, respectively. To verify the overall performance of these composite electrodes, we applied these electrodes to the top electrode of the solution-processed organic solar cells (OSCs). PEDOT:PSS provided the best performance with a fill factor (FF) of 51.2% and a photoconversion efficiency (PCE) of 2.2%, while traditional metal top electrode OSC provided FF of 60.5% and PCE of 3.1%.

• Journal of the Korean Chemical Society
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• v.43 no.4
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• pp.407-411
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• 1999

Studies have been carried out on the fabrication of PPy/GC and PPy/Pt electrode modified with polypyrrole film and determination of Cr(VI) by using 3-electrode system with modified electrodes. Modified electrodes were able to easily fabricated by cyclic voltammetry scanned from +1.0V to -1.0V(vs. Ag/AgCl) at 50 mV/sec. Film thickness could be controlled at same condition by the number of cycling up to 26 times. Reduction behaviour of Cr(VI) at PPy/GC electrode could be seen at wide potential ranges from +0.6V to -0.5V(vs. Ag/AgCl), and maximum reduction peak potential of the ion was observed at -0.25V(vs.Ag/AgCl). Calibration graph at its potential was linear from 0.1 ppm to 80.O ppm. Slope factor and relative coefficient were 1.75 mA/ppm and 0.998, respectively. Reduction behaviour of Cr(VI) at PPy/Pt electrode was similar to PPy/GC electrode, Calibration graph was linear from l.0 ppm to 60.0 ppm. Slope factor and relative coefficient were 0.5mA/ppm and 0.923, respectively. But PPy/GC modified electrode had about 3 times higher sensitivity than PPy/Pt modified electrode. Reduction behaviour of Cu(II), As(IlI), Pb(II), and Cd(II) couldn't be seen at PPy/GC electrode,Its metals had not lnterfered with Cr (VI) determination.

• Resources Recycling
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• v.14 no.1
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• pp.26-32
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• 2005

A study on the preparation of Ag fine particles was performed through a reduction reaction using ascorbic acids as a reductant, which is one of the indispensable processes for the recycling of silver-bearing wastes. Silver nitrate solution in the range of 10~120 mmole/l was used and Tamol NN8906 or PVP was also used as a dispersant in the preparation of Ag fine particles size analyze, SEM, and TEM to determine the particle size and morphology of them. As a result, the reduction reaction of silver ions with ascorbic acid reached equilibrium within 10 min. It was found that about 60% excess of ascorbic acid was required in order to reduce completely silver ions in the solution. The particle size distribution of Ag particles prepared through the reduction reaction showed typically biomodal or trimodal distribution. Especially, initial Ag concentration in the solution, the type and amount of dispersant added during the reduction reaction played an important role in determining the mean particle size of Ag particles.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1997.10a
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• pp.27-31
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• 1997

액상법에 의한 단분산 ZnS입자의 합성을 60~9$0^{\circ}C$에서 행하여, 반응조건이 ZnS입자의 형태에 미치는 효과를 검토했다. ZnS입자의 형태는 반응 시간의 경과와 더불어 단분산으로부터 다분산 혹은 응집체로 변화하였다. 반응 온도 60~9$0^{\circ}C$에서 초기 농도적이 중간값이고, 반응시간이 짧을 경우 입경 0.2~0.8$\mu\textrm{m}$의 구상 단분산 입자를 얻었다. 또한 Ag$_2$NO$_3$, EtOH용액, $0^{\circ}C$에서, Ag$_2$S에 의한 ZnS의 균일 피복이 가능하였다.