• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2001.11b
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• pp.945-950
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• 2001

Floor impact noise has been evaluated by investigating the temporal and spectral characteristics of the noise. The noises generated by different impactors were analyzed to find out whether there is any correlation with the factors of ACF /IACF (Autocorrelation Function/Inter-aural Cross-correlation Function) [1] and Zwicker parameters [2]. Experiments were undertaken to compare the objective and subjective parameters of the floor impact noises generated by a bang/tapping machine, a rubber ball [3], and a walker. As a result, it was found that $\phi$ (0) and IACC extracted from ACF/IACF, and Loudness, Unbiased Annoyance from Zwicker parameters showed high correlation with subjective evaluations of loudness concerning floor impact noises. In addition, it was revealed that jumping is similar to the ball.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.661-665
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• 2006

This study investigates objective and subjective evaluations of refrigerator noise. To describe the fluctuations like a click, a rapid increase of sound level, a change of pitch, a transition into the stationary and ending phase, the psychoacoustical and autocorrelation function(ACF) parameters have been employed. First, subjective evaluation of the noisiness of 24 kinds of refrigerators was conducted. Then, the relationship between objective measures of the refrigerator noise on perceived noisiness was examined with multiple regression analyses. Sound Quality Indices using the psychoacoustical and ACF parameters were also developed. The important psychoacoustical parameters for evaluating noisiness are loudness and roughness of stationary phase. The relationship between the noisiness and the ACF parameters shows that sound energy ${\Phi}(0)$ and its fluctuations are important. Also, refrigerator sounds that had a fluctuation of pitch were rated as more annoying. The fluctuation of pitch is expressed by ${\tau}_1\;and\;{\Phi}_1$ defined by the delay time and the amplitude of the first peak of the ACF.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.666-670
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• 2006

It has been considered that scattered sounds have a positive effect on a hearing impression of a sound filed. This study investigates the degree and the quality of a scattered sound field by using the acoustical parameters and autocorrelation function(ACF) of impulse responses. The acoustical parameters and fine structure of the ACF of an impulse response were used for the evaluation of the scattered sound field. The relationship between the scattering coefficient of surfaces with various hemisphere diffuser configurations and the acoustical parameters and ACF parameters of impulse responses was investigated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.146-150
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• 2001

Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. S-parameters of on-chip and substrate were separately measured in the frequency range of 200 MHz to 20 GHz using a microwave network analyzer HP8510 and cascade probe. And the cascade transmission matrix conversion was performed. The same measurements and conversion techniques were conducted on the assembled test chip and substrate at the same frequency range. Then impedance values in ACF flip-chip interconnection were extracted from cascade transmission matrix. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of SiO$_2$filler to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. High frequency behavior of metal Au stud bumps was investigated. The resonance frequency of the metal stud bump interconnects is higher than that of ACF flip-chip interconnects and is not observed at the microwave frequency band. The extracted model parameters of adhesive flip chip interconnects were analyzed with the considerations of the characteristics of material and the design guideline of ACA flip chip for high frequency applications was provided.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.1442-1445
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• 2007

Just noticeable differences (jnds) of autocorrelation function (ACF) parameters - Phi (0), Tau 1 and Phi 1 - of household refrigerator noise were investigated by psychoacoustical analyses. Phi (0) of five refrigerators' noise was changed with equal (${\pm}$) interval level of 0.5-1.0 dB up to five intervals by manipulating sound pressure level of the noise. Tau 1 and Phi 1 were varied with equal (${\pm}$) interval of around 0.10 ms and 0.02, respectively. Pitch shifting and strengthen methods were applied for the Tau 1 and Phi 1 variations. As results of subjective evaluations, about 2.0 dB was shown as jnd of Phi (0). The values of 0.30 ms and 0.06 were found as jnds of Tau 1 and Phi 1, respectively. The jnd results of each ACF parameter can be applied to explain substantial amount of sound quality (SQ) enhancement in the SQ prediction indices which were proposed in the authors' previous study [Sato et al. (2007) J. Acoust. Soc. Am.].

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.9
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.987-990
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• 2007

The accuracy of sound strength (G) measurement method in ISO 3382 has been questioned. One of the main reason is the difficulty in measuring a reference sound level in an anechoic chamber with the same set-up which was applied for the actual hall measurements. In the present paper, an in-situ measurement method for G was proposed by investigating the present G measurement method shown in ISO 3382. In addition, the sound radiation characteristics of typical omnidirectional loudspeakers were investigated and Phi (O) of auto correlation function (ACF) parameters was also calculated from an actual music excerpt to characterize the sound energy distribution in concert halls.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• ETRI Journal
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• v.38 no.3
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• pp.425-434
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• 2016

A novel average magnitude difference function (AMDF)-based pitch detection scheme (PDS) is proposed to achieve better performance in speech quality. A performance evaluation of the proposed PDS is carried out through both a simulation and a real-time implementation of a speech analysis-synthesis system. The parameters used to compare the performance of the proposed PDS with that of PDSs that are based on either a cepstrum, an autocorrelation function (ACF), an AMDF, or circular AMDF (CAMDF) methods are as follows: percentage gross pitch error (%GPE); a subjective listening test; an objective speech quality assessment; a speech intelligibility test; a synthesized speech waveform; computation time; and memory consumption. The proposed PDS results in lower %GPE and better synthesized speech quality and intelligibility for different speech signals as compared to the cepstrum-, ACF-, AMDF-, and CAMDF-based PDSs. The computational time of the proposed PDS is also less than that for the cepstrum-, ACF-, and CAMDF-based PDSs. Moreover, the total memory consumed by the proposed PDS is less than that for the ACF- and cepstrum-based PDSs.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.26 no.1
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• pp.58-63
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• 2022

The daily number of confirmed cases of Coronavirus disease 2019(COVID-19) ranges between 1,000 and 2,000. Despite higher vaccination rates, the number of confirmed cases continues to increase. The Mu variant of COVID-19 reported in some countries by WHO has been identified in Korea. In this study, we predicted the number of confirmed COVID-19 cases in Korea using the SARIMA for the Covid-19 prevention strategy. Trends and seasonality were observed in the data, and the ADF Test and KPSS Test was used accordingly. Order determination of the SARIMA(p,d,q)(P, D, Q, S) model helped in extracting the values of p, d, q, P, D, and Q parameters. After deducing the p and q parameters using ACF and PACF, the data were transformed and schematized into stationary forms through difference, log transformation, and seasonality removal. If seasonality appears, first determine S, then SARIMA P, D, Q, and finally determine ARIMA p, d, q using ACF and PACF for the order excluding seasonality.