• Title/Summary/Keyword: 50nm

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High Performance 50 nm Metamorphic HEMTs for Millimeter-wave Applications (밀리미터파 응용을 위한 우수한 성능의 50 nm Metamorphic HEMTs)

  • Ryu, Keun-Kwan;Kim, Sung-Chan
    • Journal of IKEEE
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    • v.16 no.2
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    • pp.116-120
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    • 2012
  • We reported on a high performance InGaAs/InAlAs metamorphic HEMT with 50 nm gate length on a GaAs substrate. The fabricated $50nm{\times}60{\mu}m$ MHEMT showed good DC and RF characteristics. Typical drain current density of 740 mA/mm and extrinsic transconductance(gm) of 1.02 S/mm were obtained with our devices. The current gain cut-off frequency(fT) and maximum oscillation frequency(fmax) obtained for the fabricated MHEMT device were 430 GHz and 406 GHz, respectively.

Fabrication of Master for a Spiral Pattern in the Order of 50nm (50nm급 불연속 나선형 패턴의 마스터 제작)

  • Oh, Seung-Hun;Choi, Doo-Sun;Je, Tae-Jin;Jeong, Myung-Yung;Yoo, Yeong-Eun
    • Journal of the Korean Society for Precision Engineering
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    • v.25 no.4
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    • pp.134-139
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    • 2008
  • A spirally arrayed nano-pattern is designed as a model pattern for the next generation optical storage media. The pattern consists off types of embossed rectangular dot, which are 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The height of the dot is designed to be 50nm. The pitch of the spiral track of the pattern is 100nm. A ER(Electron resist) master for this pattern is fabricated by e-beam lithography process. The ER is first spin-coated to be 50nm thick on a Si wafer and then the model pattern is written on the coated ER layer by e-beam. After developing this pattern written wafer in the solution, a ER pattern master is fabricated. The most conventional e-beam machine can write patterns in orthogonal way, so we made our own pattern generator which can write the pattern in circular or spiral way. This program generates the patterns to be compatible with the e-beam machine from Raith(Raith 150). To fabricate 50nm pattern master precisely, a series of experiments were done including the design compensation for the pattern size, optimization of the dose, acceleration voltage, aperture size and developing. Through these experiments, we conclude that the higher accelerating voltages and smaller aperture size are better for mastering the nano pattern which is in order of 50nm. With the optimized e-beam lithography process, a spiral arrayed 50nm pattern master adopting PMMA resist was fabricated to have dimensional accuracy over 95% compared to the designed. Using this pattern master, a metal pattern stamp will be fabricated by Ni electro plating for injection molding of the patterned plastic substrate.

Characterisitics of RF/DC Sputter Grown-ITO/Ag/ITO Thin Films for Transparent Conducting Electrode (RF/DC 스퍼티 성장한 ITO/Ag/ITO 투명전극 박막의 특성 연구)

  • Lee, Youngjae;Kim, Jeha
    • Current Photovoltaic Research
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    • v.10 no.1
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    • pp.28-32
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    • 2022
  • We investigated the optical and electrical characteristics of ITO/Ag/ITO (IAI) 3-layer thin films prepared by using RF/DC sputtering. To measure the thickness of all thin film samples, we used scanning electron microscopy. As a function of Ag thickness we characterized the optical transmittance and sheet resistance of the IAI samples by using UV-Visible spectroscopy and Hall measurement system, respectively. While the thickness of both ITO thin films in the 3-layered IAI samples were fixed at 50 nm, we varied Ag layer thickness in the range of 0 nm to 11 nm. The optical transmittance and sheet resistance of the 3-layered IAI thin films were found to vary strongly with the thickness of Ag film in the ITO (50 nm)/Ag(t0)/ITO (50 nm) thin film. For the best transparent conducting oxide (TCO) electrode, we obtained a 3-layered ITO (50 nm)/Ag (t0 = 8.5 nm)/ITO (50 nm) that showed an avrage optical transmittance, AVT = 90.12% in the visible light region of 380 nm to 780 nm and the sheet resistance, R = 7.24 Ω/□.

Device Design of Vertical Nanowire MOSFET to Reduce Short Channel Effect (단채널 현상을 줄이기 위한 수직형 나노와이어 MOSFET 소자설계)

  • Kim, Hui-jin;Choi, Eun-ji;Shin, Kang-hyun;Park, Jong-tae
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2015.10a
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    • pp.879-882
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    • 2015
  • In this work, we have analyzed the characteristics of vertical nanowire GAA MOSFET according to channel width and the type of channel doping through the simulation. First, we compared and analyzed the characteristics of designed structures which have tilted shapes that ends of drains are fixed as 20nm and ends of sources are 30nm, 50nm, 80nm and 110nm. Second, we designed the rectangular structure which has uniform width of drain, channel and source as 50nm. We used it as a standard and designed trapezoidal structure which is tilted so that the end of drain became 20nm and reverse trapezoidal structure which is tilted so that the end of source became 20nm. We compared and analyzed the characteristic of above three structures. For the last, we used the rectangular structure, divided its channel as five parts and changed the type of the five parts of doping concentration variously. In the first simulation, when the channel width is the shortest, in the second, when the structure is trapezoid, in the third, when the center of channel is high doped show the best characteristics.

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IR Absorption Property in NaNo-thick Nickel Cobalt Composite Silicides (나노급 두께의 Ni50Co50 복합 실리사이드의 적외선 흡수 특성 연구)

  • Song, Oh Sung;Kim, Jong Ryul;Choi, Young Youn
    • Korean Journal of Metals and Materials
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    • v.46 no.2
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    • pp.88-96
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    • 2008
  • Thermal evaporated 10 nm-$Ni_{50}Co_{50}$/(70 nm-poly)Si films were deposited to examine the energy saving properties of silicides formed by rapid thermal annealing at temperature ranging from 500 to $1,100^{\circ}C$ for 40 seconds. Thermal evaporated 10 nm-Ni/(70 nm-poly)Si films were also deposited as a reference using the same method for depositing the 10 nm-$Ni_{50}Co_{50}$/(70 nm-poly)Si films. A four-point probe was used to examine the sheet resistance. Transmission electron microscopy (TEM) and X-ray diffraction XRD were used to determine cross sectional microstructure and phase changes, respectively. UV-VIS-NIR and FT-IR (Fourier transform infrared spectroscopy) were used to examine the near-infrared (NIR) and middle-infrared (MIR) absorbance. TEM analysis confirmed that the uniform nickel-cobalt composite silicide layers approximately 21 to 55 nm in thickness had formed on the single and polycrystalline silicon substrates as well as on the 25 to 100 nm thick nickel silicide layers. In particular, nickel-cobalt composite silicides showed a low sheet resistance, even after rapid annealing at $1,100^{\circ}C$. Nickel-cobalt composite silicide and nickel silicide films on the single silicon substrates showed similar absorbance in the near-IR region, while those on the polycrystalline silicon substrates showed excellent absorbance until the 1,750 nm region. Silicides on polycrystalline substrates showed high absorbance in the middle IR region. Nickel-cobalt composite silicides on the poly-Si substrates annealed at $1,000^{\circ}C$ superior IR absorption on both NIR and MIR region. These results suggest that the newly proposed $Ni_{50}Co_{50}$ composite silicides may be suitable for applications of IR absorption coatings.

A Study on the Fabrication of Ni Stamper for 50nm Class of Patterns (50nm급 패턴 니켈 스탬퍼 제작에 관한 연구)

  • Yoo, Yeong-Eun;Oh, Seung-Hun;Lee, Kwan-Hee;Kim, Seon-Gyeong;Youn, Jae-Sung;Choi, Doo-Sun
    • 한국금형공학회:학술대회논문집
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    • 2008.06a
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    • pp.35-38
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    • 2008
  • A pattern master and a Ni stamper for 50nm class of patterns are fabricated through e-beam lithography and Ni electroforming process. A model pattern set is designed, which is based on unit patterns of 50nm, 100nm, 150nm and 200nm in length and 50nm in width. The e-beam process is optimized to fabricate designed patterns with some parameters including dose, accelerating voltage, focal distance and developing time. For Ni electroforming to fabricate Ni stamper, a seed layer, a conducting layer, is deposited first on the pattern master fabricated by an e-beam lithography process. Ni, Ti/Ni and Cr are first tested to find optimal seed layer process. Currently the best result is obtained when adopting Cr deposited to be 100nm thick with continuous tilting motion of the master substrate during the deposition process.

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Fabrication of nano pattern using the injection molding (사출성형을 이용한 미세 패턴 성형)

  • Lee, Kwan-Hee;Yoo, Yeong-Eun;Kim, Sun-Kyoung;Kim, Tae-Hoon;Je, Tae-Jin;Choi, Doo-Sun
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.1532-1536
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    • 2007
  • A plastic substrate with tiny rectangular pillars less than 100nm is injection molded to study pattern replication in injection molding. The size of the substrate is 50mm ${\times}$ 50mm and 1mm thick. The substrate has 9 patterned areas of which size is 2mm ${\times}$ 2mm respectively. The lengths of the pillars are 50nm, 100nm, 150nm and 200nm and the width and height are 50nm and about 100nm respectively. A pattern master is fabricated by e-beam writing using positive PR(photo resist) and then a nickel stamper replicated from the PR master by nickel electro-plating. Cr is deposited on the PR pattern master before nickel electro-plating as a conducting layer. Using this nickel stamper, several injection molding experiments are done to investigate effects of the injection molding parameters such as mold temperature, injection rate, packing pressure or pattern location on the replication of the patterns under 100nm.

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Application of Generalized Scaling Theory for Nano Structure MOSFET (나노 구조 MOSFET에서의 일반화된 스케일링의 응용)

  • 김재홍;김근호;정학기;이종인
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2002.05a
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    • pp.275-278
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    • 2002
  • As the gate lengths of MOSFETs are scaled down to sub-50nm regime, there are key issues to be considered in the device design. In this paper, we have investigated the characteristics of threshold voltage for MOSFET device. We have simulated the MOSFETs with gate lengths from 100nm to 30nm using generalized scaling. Then, we have known the device scaling limits for nano structure MOSFET. We have determined the threshold voltages using LE(Linear Extraction) method.

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Replacement of Normal Maize with Quality Protein Maize on Performance, Immune Response and Carcass Characteristics of Broiler Chickens

  • Panda, A.K.;Raju, M.V.L.N.;Rao, S.V. Rama;Lavanya, G.;Reddy, E. Pradeep Kumar;Sunder, G. Shyam
    • Asian-Australasian Journal of Animal Sciences
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    • v.23 no.12
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    • pp.1626-1631
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    • 2010
  • An experiment was conducted to evaluate the effect of dietary replacement of normal maize (NM) with quality protein maize (QPM) on performance, immune response and carcass characteristics of broiler (Krishibro) chickens. Six experimental diets were prepared separately for starter and finisher phases. Diet 1 was a control diet formulated with NM and soybean meal. In diets 2-5, the NM was replaced with QPM at 25, 50, 75 and 100%, respectively. Diet 6 was the same as the control diet, but supplemented with synthetic lysine similar to the industry standard. Each test diet was fed to 8 replicates, each of 5 chicks, reared in stainless steel battery brooders. The AME content of QPM (3382 kcal/kg) was similar to that of NM (3,352 kcal/kg), but protein (9.91 vs. 8.94%), lysine (0.40 vs. 0.26%) and tryptophan (0.09 vs. 0.07%) contents of QPM were higher than NM. Dietary replacement of NM with 50% QPM significantly (p<0.05) improved body weight gain, feed conversion ratio, humoral immune response, relative bursa weight, and breast muscle yield and lowered abdominal fat content. No further improvement in these parameters was recorded by increasing the level of replacement of NM with QPM to either 75% or 100%. Further, the improvement noticed in the 50% QPM group was similar to the group fed the NM diet with lysine supplementation, and thus dietary replacement of NM with QPM at 50% did not need extra synthetic lysine supplementation. It is concluded that dietary replacement of NM with QPM at the 50% level resulted in optimum performance, higher breast muscle yield and higher immune response in broiler chickens.

Preparation of β-TCP/TiO2 Composite by Hot-Pressing (가압소결에 의한 β-TCP/TiO2복합체의 제조)

  • 정항철;이종국
    • Journal of the Korean Ceramic Society
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    • v.41 no.3
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    • pp.202-209
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    • 2004
  • Hydroxyapatite(HA)/TiO$_2$ composite powders were prepared by mixing of spherical TiO$_2$ (10-15 nm, 500 nm) and needle-shaped HA (50-70 nm, 120-250 nm) powders which had been synthesized through precipitation, sol-gel and hydrothermal methods. From the three types of starting composite powders (HA/TiO$_2$ wt% of 75/25, 50/50, and 25/75), dense $\beta$-TCP/TiO$_2$ composites were prepared by hot-pressing at 800-100$0^{\circ}C$ for 30 min under the pressure of 30 ㎫ in Af atmosphere. The $\beta$-TCP/TiO$_2$ composites showed different microstructures and sintering densities depending on their powder morphology, composition and sintering temperature. With increasing the sintering temperature and the content of TiO$_2$, sintered density was increased and microstructure became more homogeneous.