• Proceedings of the KIPE Conference
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• 2014.07a
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• pp.95-96
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• 2014

450mm 반도체 CVD 장비 개발 및 300mm F-CVD (Flowable CVD) 공정 개발에 있어서 공정 마진 확보 및 막질 품질 개선을 위해 주파수 가변형 RF Generator가 필수적으로 요구되고 있다. 20nm이하 STI (Shallow Trench Isolation), PMD (Pre-metal Dielectric) & IMD (Inter-Metal Dielectric) 미세공정 gap fill에 많은 문제점이 도출되고 있으며, 이유로는 Generator 고정 주파수에서 Matching Time delay 또는 Shooting에 의한 산포의 한계로 파악되었으며, 주파수 가변에 의한 고속 Tune 기능이 요구되어진다. 따라서 400kHz 주파수 가변형 RF-Generator 개발을 진행하였으며 본 논문을 통해 개발되어진 장비의 성능과 시험 평가한 결과를 소개하고자 한다.

• Proceedings of the KAIS Fall Conference
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• 2010.11b
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• pp.555-558
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• 2010

차세대 반도체 산업은 제조공정의 미세화, 복잡화, 다단계화 등이 심화되고 이로 인해 제조원가의 절감을 위한 단위 Wafer당 보다 많은 칩을 생산할 수 있는 450mm 웨이퍼의 도입을 반드시 필요로 한다. 본 논문에서는 클러스터 툴을 주로 사용하는 450mm 웨이퍼 수율관리 개선 시스템의 구현방향과 상세 기능과 각 모듈에 대한 연구를 수행하였으며, 450mm 웨이퍼 생산체제 하에서 필요한 수율관리시스템인 RTFMD 시스템을 제안 하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.490-490
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• 2013

In semiconductor industry, it is expected that plasma process which use 450 mm source will be used at next generation. However, main obstacle of the large area plasma source is plasma uniformity from it. When electrode is enlarged, field difference between center area and side area reduces the plasma uniformity [1-3]. Therefore we investigate multi-electrode which diminish this field difference.We designed two multi-electrode models. One has two segments and the other has five segments. Each multi-electrode model is connected with two power generator and two matchers. One generator and one matcher is connected with center electrode part. The other one generator and the other one matcher is connected with side electrode part. The ion density is measured at 29 points by using floating harmonic method [4-6]. After measuring the data of each multi-electrode model, we discuss the difference of profile between two models' data.

• Korean Journal of Optics and Photonics
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• v.15 no.3
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• pp.241-247
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• 2004

The collimator is necessary for the assembly and evaluation of high resolution satellite telescope. Traditionally, the off-axis paraboloid has been used as a collimator. However, it has some disadvantages in that it can suffer from air turbulence when the focal length of a collimator is long, which may result in some error in the measurement. In contrast, since the Cassegrain type collimator folds the beam, it occupies smaller space compared to the off-axis paraboloid for the same focal length. This can reduce the air turbulence, which can improve the measurement accuracy. In this paper, we explain the process of design and manufacturing of a diameter 450 mm Cassegrain type collimator, to evaluate the diameter 300 mm satellite telescope. After assembly of primary and secondary mirrors, the final wavefront error of the collimator was 0.07λ(λ=633 nm), which is the diffraction limit.

• The Korean Journal of Malacology
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• v.29 no.3
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• pp.189-195
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• 2013

Experiments for net cage culture at sea were conducted in each $2.4{\times}2.4$ m in area and took the samples from four different densities: 150, 300, 450 and 600 per cross-sectional area ($m^2$) of shelter. The same stocking densities applied to indoor tank culture to investigate the growth and survival rate. The size of juvenile abalone sample was $36.14{\pm}2.28$ mm for net cage culture and $38.62{\pm}3.22$ mm or indoor tank. Feed such as raw brown sea mustard, raw kelp and dried kelp was sufficiently provided to the abalone. In net cage culture experiment, the growth of the spat of juvenile abalone was the fastest $60.53{\pm}5.75$ mm in the 150 abalone cage per square meter ($m^2$), followed by the 300 abalone cage at $54.01{\pm}5.17$ mm, 450 abalone cage at $51.48{\pm}5.37$ mm and 600 abalone cage at $51.09{\pm}4.96$ mm in order. In the meantime, in the indoor tank experiment, the 150 abalone indoor tank was the fastest $47.50{\pm}6.31$ mm per square meter, followed by the 300 abalone tank at $45.92{\pm}5.23$ mm, the 450 abalone tank at $44.24{\pm}5.59$ mm and the 600 abalone tank at $43.62{\pm}4.44$ mm in order. The survival rate was more than 97.9% in all the experiments, not showing a significant difference.

• Proceedings of the Optical Society of Korea Conference
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• 2004.07a
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• pp.234-235
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• 2004

• Proceedings of the Optical Society of Korea Conference
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• 2004.02a
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• pp.198-199
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• 2004

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.334-334
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• 2012

다음 세대 웨이퍼 공정인 450mm 웨이퍼 공정을 위한 이중 주파수 유도결합 플라즈마 소스를 이용하여 각각의 안테나에 파워를 인가하고, 이 때 방전되는 플라즈마의 특성을 Langmuir probe를 통하여 확인할 수 있었다. 또한 인가되는 파워를 조절하여 플라즈마 내의 전자에너지를 조절할 수 있다는 가능성을 확인할 수 있었다.

• Proceedings of the Korean Society of Applied Pharmacology
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• 1995.04a
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• pp.85-85
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• 1995

전년도에 ara-C 유도체 중에서 ara-CDP-DL-PTBA가 각종 암세포주에 대한 뛰어난 항암작용이 보고된바 있으며, 이후 시료의 대량확보, Bulk Formulation 및 전임상등의 세가지 분야에 관해 연구를 수행하였다. Ara-CDP-DL-PTBA를 수용액에 현탁, 초음파분쇄후 NICOMP Analysis에 의하여 micellar solution의 입자도를 알아 본 결과 fresh prepared micelles은 11,1mm size가 88.63%이며 50,5mm가 11.37%로 나타나 평균 19,0mm가 되고, Reconstructed micells은 10.9mm size가 99.87%이며 356.1mm가 0.13%로 나타나 평균 11.0mm가 된다. Ara-C와 Ara-CDP-DL-PTBA의 대사작용을 알아본 결과, ara-C는 투여 1시간째 2,850 $\pm$ 450 pmol, 4시간째 450$\pm$190 pmol, 24시간째 30 pmol 이하로 ara-CTP의 혈중 농도가 급격히 감소하는 반면에 ara-CDP-DL-PTBA는 1시간째 650$\pm$120 pmol, 2시간째 1,800$\pm$500 pmol, 24시간째 300$\pm$90 pmol으로 ara-CTP의 혈중 농도가 서서히 감소하였다.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.33 no.3
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• pp.184-191
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• 2010

In the environment of 450mm wafers production known as the next-generation semiconductor production process, one of the most significant features is the full automation over the whole manufacturing processes involved. The full automation system for 450mm wafer production will minimize the human workers' involvement in the manufacturing process as much as possible. In addition, since the importance of an individual wafer processing increases noticeably, it is necessary to develop more robust scheduling systems in the whole manufacturing process than so ever. The scheduling systems for the next-generation semiconductor production processes also should be capable of monitoring individual wafers and collecting useful data on them in real time. Based on the information gathered from these processes, the system should finally have a real-time scheduling functions controlling whole the semiconductor manufacturing processes. In this study, preliminary investigations on the requirements and needed functions for constructing the real time scheduling system and transforming manufacturing environments for 300mm wafers to those of 400mm are conducted and through which the next generation semiconductor processes for efficient scheduling in a clustered production system architecture of the scheduler is proposed. Our scheduling architecture is composed of the modules for real-time scheduling, the clustered production type supporting, the optimal scheduling and so on. The specifications of modules to define the major required functions, capabilities, and the relationship between them are presented.