• 제목/요약/키워드: 4-ball test

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다열근 심부 및 표면 근섬유 두께에 대한 세 가지 요추안정화 운동의 효과 (Effects of Three Lumbar Stabilization Exercises on the Thickness of Deep and Superficial Fibers of the Lumbar Multifidus)

  • 김수정;하성민;박규남;정도헌;김태진;신헌석;권오윤
    • 한국전문물리치료학회지
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    • 제19권2호
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    • pp.20-28
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    • 2012
  • The lumbar multifidus muscle, which can be separated into deep fascicles (DM) and superficial fascicles (SM), is important for lumbar segmental stability. However, no previous studies have investigated the effect of lumbar stabilization exercises on the thickness of DM and SM. Thus, the purpose of this study was to assess DM thickness after three different lumbar segmental stabilization exercises. In total, 30 healthy male participants were recruited and randomly assigned to one of three exercise groups: hollowing in the quadruped position (H-Quad), contralateral arm and leg lift (CALL), and bilateral arm and leg lift (BALL). Each lumbar segmental stabilization exercise was conducted over 4 weeks. Ultrasonography was used to compare the DM and SM thickness before and after the 4 weeks of exercise. A mixed-model analysis of variance using Scheffe's post-hoc test was used for statistical analysis. The results showed a significant effect for the measurement time (before vs. after 4 weeks of exercise) in the DM (F=31.26, p<.05) and SM (F=4.56, p<.05). At the end of the 4 weeks, the DM thickness had increased significantly in the H-Quad exercise group, and the SM thickness had increased significantly in the CALL and BALL exercise groups. Also in the BALL exercise group, the SM thickness was greater compared with that in the H-Quad exercise group. These findings suggest that the thickness of the DM and SM were increased by different types of lumbar segmental stability exercise after 4 weeks.

다양한 UBM층상의 Sn0Ag0.5Cu 솔더 범프의 고속 전단특성에 미치는 전단속도의 영향 (Effect of Shearing Speed on High Speed Shear Properties of Sn1.0Ag0.5Cu Solder Bump on Various UBM's)

  • 이왕구;정재필
    • 대한금속재료학회지
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    • 제49권3호
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    • pp.237-242
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    • 2011
  • The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

질화규소 이층 층상재료에서 코팅층의 파괴에 관한 연구 : I. Elastic/Plastic Mismatch의 영향 (A Study on the Coating Fracture in Silicon Nitride Bilayer : I. Effect of Elastic/Plastic Mismatch)

  • 이기성;이승건;김도경
    • 한국세라믹학회지
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    • 제34권12호
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    • pp.1268-1274
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    • 1997
  • Effect of elastic/plastic mismatch on the fracture of Si3N4 coating in Si3N4/Si3N4 -BN bilayer was investigated by Hertzian indentation testing. A different amount of mismatch between two layers was induced by different BN addition in the substrate layer, and Hertizian cracks were induced by using WC ball indenter. As a result, as the elastic/plastic mismatch between coating and substrate layer increased, the coating fracture easily occurred. A bending stress induced by different elastic/plastic mismatch was main reason to cause the fracture of coating.

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Glass/Epoxy 적층 복합판의 충격 응답 및 충격 응력 (The Impact Response and Impact Stress of Glass/Epoxy Laminated Composite Plates)

  • 김문생;김남식
    • 한국정밀공학회지
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    • 제7권4호
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    • pp.29-39
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    • 1990
  • The purpose of this research is to analyze the impact behaviors of laminated composite plates subjected to the transverse low-velocity impact by the steel ball. A plate finite element model based on Whitney and Pagano's the first-order shear deformation theory (FSDT) in conjunction with experimental static contact laws is formulated and then compared with the results of the impact experiments. Because the input data and the output data printed at every integration time step are lots of amount, these are interactively poecessed by the developed pre-processor(PREPLOT) and postprecessor(POSTPLOT). All results from these procesors are automatically generated by CALCOMP plotter. Test materials are glass/expoxy composite materials. The specimens are composed of [$0^{\circ} /45^{\circ}/0^{\circ}/-45^{\circ}/0^{\circ}/]2s\ and \[90^{\circ}/45^{\circ}/90^{\circ}/-45^{\circ}/90^{\circ}/$]2s stacking sequences and have $4.5^t{\times}200^w{\times}200^l$(mm) and $4.5^t{\times}300^w{\times}300^l$(mm) dimensions.

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리플로우 솔더링 공정 조건에 따른 Sn-Bi-Ag와 Sn-Ag-Cu 복합 무연 솔더 접합부 특성 연구 (A Study on Properties of Pb-free Solder Joints Combined Sn-Bi-Ag with Sn-Ag-Cu by Conditions of Reflow Soldering Processes)

  • 김자현;천경영;김동진;박영배;고용호
    • 마이크로전자및패키징학회지
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    • 제29권3호
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    • pp.55-61
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    • 2022
  • 본 연구에서는 용융온도가 중온계 무연 솔더인 Sn-3.0Ag-0.5Cu(SAC305)와 저온계 무연 솔더인 Sn-57Bi-1Ag를 사용하여 형성된 복합 무연 솔더 접합부의 특성에 대하여 보고 하였다. SAC305 솔더볼이 형성된 ball grid array(BGA) 패키지와 Sn-57Bi-1Ag 솔더 페이스트가 도포된 flame retardant-4(FR-4) 인쇄회로기판(printed circuit board, PCB)을 리플로우 솔더링 공정을 이용하여 복합 무연 솔더 접합부를 형성 하였다. 공정 온도 프로파일을 두 가지 형태로 달리하여 리플로우 솔더링 공정을 진행하였으며 리플로우 솔더링 공정 조건에 따른 계면 반응, 금속간화합물(intermetallic compound, IMC)의 형성, Bi의 확산 거동 등 복합 무연 솔더 접합부 계면 특성을 비교 분석 하였다. 또한, 열 충격 시험을 통하여 리플로우 솔더링 공정에 따른 복합 무연 솔더 접합부의 신뢰성 특성을 비교하고 열 충격 시험 전후 전단 시험을 진행하여 접합부의 기계적 특성 변화를 분석하였다.

졸-겔 공정에 의한 유기변성 하이브리드 세라믹 물질의 미세 마찰마모 특성 (An Experimental Study on the Micro Friction and Wear Characteristics of Organically Modified Hybrid Ceramic Materials by A Sol-Gel Process)

  • 한흥구;공호성;윤의성;양승호
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 제35회 춘계학술대회
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    • pp.215-225
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    • 2002
  • In order to enhance the thermal stability of binder materials of bonded type solid lubricants, several combinations of metal-alkoxide based sol-gel materials such as methyltrimethoxysilane(MTMOS), $titaniumisopropoxide(Ti(Opr^{j})_{4})$, $zirconiumisopropoxide(Zr(Opr^{j})_{4})$ and $aluminumbutoxide(Al(Obu^{t})_{4})$ were chemically modified by epoxy-, acrylic- and fluoro-silane compounds, respectively, in this work. Friction and wear characteristics of these hybrid ceramic materials were tested with a micro tribe-tester where a reciprocating steel ball slid on a test material, and the tribological property was also evaluated with respect to both heat-curing temperature and tile time. Test results generally showed that hybrid ceramic materials modified by epoxy-silane compounds had a low friction compared to others. And the higher heat-curing temperature and the longer heat treatment time resulted in the higher friction and the lower wear. IR spectroscopic analyses revealed that it was caused mainly by the increased metal oxide content in hybrid ceramics when the heat-curing temperature was over $320^{\circ}C$.

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Sn-4.0wt%Ag-0.5wt%Cu 솔더 접합계면의 강도특성과 미세파괴거동에 대한 In-situ관찰 (In-situ Observation on Micro-Fractural Behavior and Strength Characteristics in Sn-4.0wt%Ag-0.5wt%Cu Solder Joint Interface)

  • 이경근;최은근;추용호;김진수;이병수;안행근
    • 한국재료학회지
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    • 제18권1호
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    • pp.38-44
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    • 2008
  • The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.

Development of Core Strength Training Equipment and Its Effect on the Performance and Stability of the Elderly in Activities of Daily Living

  • Koh, Kyung;Park, Yang Sun;Park, Da Won;Hong, Chun Ki;Shim, Jae Kun
    • 한국운동역학회지
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    • 제26권2호
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    • pp.229-236
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    • 2016
  • Objective: This study aimed, first, to develop core strength training equipment with elderly-friendly, easy-to-use features and, second, to investigate the effect of core strength training using the equipment on the performance and stability of the elderly in activities of daily living. Method: In this study, we developed training equipment with a stability ball that can be used for performing core strength exercises in the elderly. Twenty-three elderly subjects (age: $77.87{\pm}6.95years$, height: $149.78{\pm}6.95cm$, and weight: $60.57{\pm}7.21kg$) participated in this study. The subjects performed the core strength training exercise with 16 repetitions for 8 weeks (2 repetitions per week). Performance in activities of daily living was assessed by using the Short Physical Performance Battery (SPPB), a test of going up and down 4 stairs, and one-leg static balance test. Stability was quantified as changes in the center of pressure (COP) and C90 area. Results: With the core strength equipment, trunk core strength exercise could be performed by pulling or pushing a rope with 2 hands on the stability ball. During the task, the tension in the rope was manipulated by a motor connected to the rope and the COP of the subject was measured by 4 load cells mounted in the equipment. Our results showed that the SPPB score was significantly higher (p < .05), the time to complete the "going up and down 4 stairs" test was significantly shorter (p < .05), and one-leg static balance statistically improved under an eyes-open condition (p < .05) after as compared with before the core strength training. The changes in the COP in the anteroposterior and mediolateral directions, and C90 area were significantly lower in the posttest (p <. 05) than in the pretest. Conclusion: The core strength training exercise using the equipment developed in the present study improved the performance and stability of the elderly in activities of daily living.

미끄럼운동 시 TiN 코팅에 형성되는 산화막이 마찰 및 마멸 특성에 미치는 영향 (Effects of Oxide Layer Formed on TiN Coated Silicon Wafer on the Friction and Wear Characteristics in Sliding)

  • 조정우;이영제
    • Tribology and Lubricants
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    • 제18권4호
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    • pp.260-266
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    • 2002
  • In this study, the effects of oxide layer farmed on the wear tracks of TiN coated silicon wafer on friction and wear characteristics were investigated. Silicon wafer was used for the substrate of coated disk specimens, which were prepared by depositing TiN coating with 1 ${\mu}{\textrm}{m}$ in coating thickness. AISI 52100 steel ball was used fur the counterpart. The tests were performed both in air for forming oxide layer on the wear track and in nitrogen to avoid oxidation. This paper reports characterization of the oxide layer effects on friction and wear characteristics using X-ray diffraction(XRD), Auger electron spectroscopy(AES), scanning electron microscopy (SEM) and multi-mode atomic force microscope(AFM).

Defective Surface Analysis of Aluminum Bonding Pads for Au Wire Bonding

  • Son, Dong-Ju;Ji, Yong-Joo;Jeon, Yoon-Su;Soh, Dae-Wha;Hong, Sang-Jeen
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.4-4
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    • 2009
  • Surface analysis on defective wire-bonding pads are performed in flash memory assembly. Week wire bonding may cause a significant effect on the final product reliability, and the surface condition of the aluminum bond pads is critical in terms of product reliability. To find out possible week bonding on semiconductor interconnects, ball sheer test (BST) has been performed. On some defective or week bonded pads, we have investigated the surface contents, assuming that the week bonding is induced from the surface conditions. AES and XPS are employed for the quantitative surface analysis on defective dies.

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