• Title/Summary/Keyword: 3D-printed PCB

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Effects of Organic Additives on Residual Stress and Surface Roughness of Electroplated Copper for Flexible PCB

  • Kim, Jongsoo;Kim, Heesan
    • Corrosion Science and Technology
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    • v.6 no.4
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    • pp.154-158
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    • 2007
  • For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

Design of DVB-T/H SiP using IC-embedded PCB Process (IC-임베디드 PCB 공정을 사용한 DVB-T/H SiP 설계)

  • Lee, Tae-Heon;Lee, Jang-Hoon;Yoon, Young-Min;Choi, Seog-Moon;Kim, Chang-Gyun;Song, In-Chae;Kim, Boo-Gyoun;Wee, Jae-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.9
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    • pp.14-23
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    • 2010
  • This paper reports the fabrication of a DVB-T/H System in Package (SiP) that is able to receive and process the DVB-T/H signal. The DVB-T/H is the European telecommunication standard for Digital Video Broadcasting (DVB). An IC-embedded Printed Circuit Board (PCB) process, interpose a chip between PCB layers, has applied to the DVB-T/H SiP. The chip inserted in DVB-T/H SiP is the System on Chip (SoC) for mobile TV. It is comprised of a RF block for DVB-T/H RF signal and a digital block to convert received signal to digital signal for an application processor. To operate the DVB-T/H IC, a 3MHz DC-DC converter and LDO are on the DVB-T/H SiP. And a 38.4MHz crystal is used as a clock source. The fabricated DVB-T/H SiP form 4 layers which size is $8mm{\times}8mm$. The DVB-T/H IC is located between 2nd and 3rd layer. According to the result of simulation, the RF signal sensitivity is improved since the layout modification of the ground plane and via. And we confirmed the adjustment of LC value on power transmission is necessary to turn down the noise level in a SiP. Although the size of a DVB-T/H SiP is decreased over 70% than reference module, the power consumption and efficiency is on a par with reference module. The average power consumption is 297mW and the efficiency is 87%. But, the RF signal sensitivity is declined by average 3.8dB. This is caused by the decrease of the RF signal sensitivity which is 2.8dB, because of the noise from the DC-DC converter.

Double Square Patch Antenna with Inductive Bridges for WLAN Dual-Band (인덕티브 브릿지를 가진 WLAN 이중 대역 이중 사각 패치 안테나)

  • Yang, Chan-Woo;Jung, Chang-Won
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.10 no.10
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    • pp.2615-2618
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    • 2009
  • Double rectangular patch with 4-bridges is investigated for solution of IEEE 802.11b/g (2.4 GHz) and 802.11a (5.5 GHz). Rectangular patch for 5.5 GHz frequency band is printed on the PCB substrate and connected to another rectangular patch for 2.4 GHz frequency band with 4-bridges to obtain dual band operation in an antenna element. 4-bridges can modify the desired frequency band from its original frequency band by changing its width. Gain of 2.4 GHz patch is 5 dBi and 5.5 GHz patch is 3.7 dBi at ${\theta}=0^{\circ}$.

Design and Fabrication of Low Temperature Processed $BaTiO_3$ Embedded Capacitor for Low Cost Organic System-on-Package (SOP) Applications (저가형 유기 SOP 적용을 위한 저온 공정의 $BaTiO_3$ 임베디드 커페시터 설계 및 제작)

  • Lee, Seung-J.;Park, Jae-Y.;Ko, Yeong-J.
    • Proceedings of the KIEE Conference
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    • 2006.07c
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    • pp.1587-1588
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    • 2006
  • Tn this paper, PCB (Printed Circuit Board) embedded $BaTiO_3$ MIM capacitors were designed, fabricated, and characterized for low cost organic SOP applications by using 3-D EM simulator and low temperature processes. Size of electrodes and thickness of high dielectric films are optimized for improving the performance characteristics of the proposed embedded MIM capacitors at high frequency regime. The selected thicknesses of the $BaTiO_3$ film are $12{\mu}m$, $16{\mu}m$, and $20{\mu}m$. The fabricated MIM capacitor with dielectric constant of 30 and thickness of $12{\mu}m$ has capacitance density of $21.5p\;F/mm^2$ at 100MHz, maximum quality factor of 37.4 at 300 MHz, a quality factor of 30.9 at 1GHz, self resonant frequency of 5.4 GHz, respectively. The measured capacitances and quality factors are well matched with 3-D EM simulated ones. These embedded capacitors are promising for SOP based advanced electronic systems with various functionality, low cost, small size and volume.

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A Study on Properties of Pb-free Solder Joints Combined Sn-Bi-Ag with Sn-Ag-Cu by Conditions of Reflow Soldering Processes (리플로우 솔더링 공정 조건에 따른 Sn-Bi-Ag와 Sn-Ag-Cu 복합 무연 솔더 접합부 특성 연구)

  • Kim, Jahyeon;Cheon, Gyeongyeong;Kim, Dongjin;Park, Young-Bae;Ko, Yong-Ho
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.3
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    • pp.55-61
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    • 2022
  • In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

Wide Bandwidth PIFA Design Using Reactive Element (리액티브 소자를 이용한 광대역 PIFA 설계)

  • Jo, Ha-Seok;Moon, Sung-Jin;Park, Kyong-Nam;Lee, Jae-Seok;Kim, Hyeong-Dong
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.25 no.4
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    • pp.387-392
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    • 2014
  • In this paper, the broadband antenna design, which can be applied to USB Dongle, supporting Wibro(2.3~2.4 GHz), Wi-Fi(2.4~2.5 GHz) and LTE7(2.5~2.7 GHz) is proposed technique. The proposed antenna was designed similar to PIFA type antennas. Reactive elements were used to control the input impedance and wideband characteristics were achieved by controlling coupling between the feed structure and the radiator. As a result, the antenna printed on FR-4 PCB(${\epsilon}_r$ =4.4, tan ${\delta}$=0.02) occupying an area of $15{\times}5mm^2$ was able to achieve bandwidth of 1 GHz from 2.1 to 3.1 GHz under VSWR=2. Measured return loss characteristics, bandwidth and radiation patterns were in good agreement with the simulated results.

Design of High-Speed Multi-Layer PCB for Ultra High Definition Video Signals (UHD급 영상구현을 위한 다층인쇄회로기판의 특성 임피던스 분석에 관한 연구)

  • Jin, Jong-Ho;Son, Hui-Bae;Rhee, Young-Chul
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.19 no.7
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    • pp.1639-1645
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    • 2015
  • In UHD high-speed video transmission system, when a signal within certain frequency region coincides electrically and structurally, the system becomes unstable because the energy is concentrated, and signal flux is interfered and distorted. For the instability, power integrity analysis should be conducted. To remove the signal distortion for MLB, using a high-frequency design technique for EMI phenomenon, EMI which radiates electromagnetic energy fluxed into power layer was analyzed considering system stabilization. In this paper, we proposed an adaptive MLB design method which minimizes high-frequency noise in MLB structure, enhances signal integrity and power integrity, and suppresses EMI. The characteristic impedance for multi-layer circuit board proposed in this study were High-Speed Video Differential Signaling(HSVDS) line width w = 0.203, line gap d = 0.203, beta layer height h = 0.145, line thickness t = 0.0175, dielectric constant εr = 4.3, and characteristic impedance Zdiff = 100.186Ω. When high-speed video differential signal interface board was tested with optimized parameters, the magnitude of Eye diagram output was 672mV, jittering was 6.593ps, transmission frequency was 1.322GHz, signal to noise was 29.62dB showing transmission quality improvement of 10dB compared to previous system.

Design of mobile communication antenna for total monitoring of the security light (보안등의 통합 모니터링을 위한 이동통신용 안테나 설계)

  • Yoo, Jin-Ha;Cho, Dong-Kyun;Lee, Young-Soon
    • Journal of Advanced Navigation Technology
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    • v.17 no.5
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    • pp.491-496
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    • 2013
  • In this paper, a half-wavelength folded-slot antenna, which can be applied to RF module for 3G mobile communications by which security lights are monitored and controlled, is proposed. The proposed antenna can be regarded as modified folded-slot structure which has the size reduced to a half of conventional ${\lambda}g$ folded-slot antenna and can be placed at the ground plane edge. In spite of that, the proposed antenna still maintain the advantage of conventional folded-slot antenna that input impedance is close to $50{\Omega}$. The antenna is designed and fabricated within the upper space of $40.5{\times}10mm^2$ on $40.5{\times}62mm^2$ substrate for 3G mobile communication frequency band. The measured impedance bandwidth and antenna gain are 390 MHz and 2 dBi respectively.

Design and Fabrication of Dual-Band Patch Antenna with Bridge for WLAN Applications (WLAN용 이중대역 브리지 패치 안테나설계 및 제작)

  • Kim, Kab-Ki
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.14 no.3
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    • pp.547-551
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    • 2010
  • In this paper, Double rectangular patch with 4-bridges is investigated for solution of IEEE 802.11b/g(2.4GHz) and 802.11a(5.7GHz). Rectangular patch for 5.7GHz frequency band is printed on the PCB substrate and connected to another rectangular patch for 2.4GHz frequency band with 4-bridges to obtain dual band operation in a antenna element. The proposed antenna has a low profile and is fed by $50{\Omega}$ coaxial line. The dielectric constant of the designed antenna substrate is 3.27. Two rectangular patches have each resonance frequencies that are 2.4GHz and 5.7GHz. A dual-band characteristic is shown as connecting two rectangular patch using four bridges. Also, the proposed antenna is shown input return loss that is below -10dB at 2.4GHz and 5.7GHz of WLAN(Wireless LAN).

A Study on the Design of Meander Slot Antenna for the Zigbee Module and Improvement of Its Return Loss (지그비 모듈용 미앤더 슬롯 안테나 설계 및 반사손실 개선에 관한 연구)

  • Lee, Young-Soon;Kim, Ui-Jung;Kim, Byoung-Sam;Jang, Bong-Ki
    • Journal of Navigation and Port Research
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    • v.34 no.3
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    • pp.167-173
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    • 2010
  • In order to design small printed antenna restricted within narrow area of $30mm{\times}8mm$ for the Zigbee module and improve its return loss, meander slot antenna with a floating conductor as the parastic element has been proposed. The resonant frequency and bandwidth(VSWR${\leq}$2) of the antenna designed and fabricated in the present study is about 2.44GHz and 113MHz respectively. The radiation pattern is almost similar to that of dipole antenna within the operation frequency range. Also the radiation efficiency and gain of the proposed antenna is more than 60% and 2.7dBi respectively. It has been observed that the characteristics the proposed antenna mentioned above satisfy the specification required of the Zigbee application. In order to validate the proposed antenna, some simulated and measured results are presented and compared.