• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.1-12
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• 2021

3D printing, which designs product in three dimensions, draws attention as a technology that will lead the future for it dramatically shortens time for production without assembly, no matter how complex the structure is. The paper studies the latest researches of 3D-printed electronics and introduces papers studied electronics components, power supply, circuit interconnection and 3D-printed PCBs' applications. 3D-printed electronics showed possibility to simplify facilities and personalize electric devices by providing one-stop printing process of electronic components, soldering, stacking, and even encapsulation.

• Resources Recycling
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• v.21 no.3
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• pp.56-64
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• 2012

It is generally well known that PCB (Printed Circuit Board) is an electric component assembled by various metals mixed with plastics and ceramics. Accordingly, it is very important to extract metallic components from used PCBs from the point of view of recycling of used resources as well as an environmental protection. In this paper, patents and paper on the recycling technologies of PCB were analyzed. The range of search was limited in the open patents of USA (US), European Union (EP), Japan (JP), Korea (KR) and SCI journals from 1980 to 2011. Patents and journals were collected using key-words searching and filtered by filtering criteria. The trends of the patents and journals was analyzed by the years, countries, companies, and technologies.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.8
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• pp.73-80
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• 2020

The 3D printing of electronics has been a major application topics in additive manufacturing technology for a decade. In this paper, wireless power transfer (WPT) technology for 3D electronics is studied to supply electric power to its inner circuit. The principle of WPT is that electric power is induced at the recipient antenna coil under an alternating magnetic field. Importantly, the efficiency of WPT does rely on the design of the antenna coil shape. In 3D printed electronics, a flat antenna that can be placed on the printed plane within a layer of a 3D printed part is used, but provided a different antenna response compared to that of a conventional PCB antenna for NFC. This paper investigates the WPT response characteristics of a WPT antenna for 3D printed electronics associated with changes in its design elements. The effects of changing the antenna curvature and the gap between the wires were analyzed through experimental tests.

• Proceedings of the IEEK Conference
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• 2003.07e
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• pp.2375-2378
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• 2003

In manufacture of printed circuit boards, one important issue is precisely to measure the three-dimensional shape of the solder paste silk-screened prior to direct surface mounting of chips. This paper presents the 3D shape reconstruction of solder paste using the optical triangulation method based on structured light or slit beam and the measurement algorithm for height, volume. area, and coplanarity on component pads from the 3D range image. Futhermore, statistical process control function is incorporated for process capability analysis.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.341-344
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• 2000

Several new via structures in printed circuit boards are proposed, fabricated and characterized in RF regime. The new structure with a larger inductance component in the bottom layer shows 3㏈ improvement over the conventional structure. The ADS simulation with model parameters extracted from 3D fie]d solver matches with the characterization of these vias

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.10 no.1
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• pp.31-45
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• 2006

Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.

• Proceedings of the KIEE Conference
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• 2003.11b
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• pp.291-294
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• 2003

In this paper, 2D and 3D inspection algorithm for printed solder on PCB is introduced. The aim of inspection is the detection of error such as rich solder poor solder and missing solder. For Inspection, laser distance sensor is used. For 2D inspection, laser image that is created by normalizing laser data between 0 and 255 are used. Reference Image is made using gerber file. Image processing algorithm is used for 2D inspection. By adding thickness of metal stencil to laser image, volume for solder can be calculated and 3D inspection is carried out.

• Journal of Electrical Engineering and Technology
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• v.8 no.3
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• pp.603-609
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• 2013

In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was $69^{\circ}$, and its surface energy was 18.6 $mJ/m^2$. Also, the substrate temperature was set at $70^{\circ}C$. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of $60{\mu}m$. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.

• Journal of Electrical Engineering and Technology
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• v.7 no.5
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• pp.730-735
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• 2012

This paper presents a method to design the waveform of a back electromotive force (back EMF) of an axial flux permanent magnet (AFPM) motor using printed circuit board (PCB) windings. When the magnetization distribution of permanent magnet (PM) is given, the magnetic field in the air gap region is calculated by the quasi three dimensional (3D) space harmonic analysis (SHA) method. Once the flux density distribution in the winding region is determined, the required shape of the back EMF can be obtained by adjusting the winding distribution. This can be done by modifying the distance between patterns of PCB to control the harmonics in the winding distribution. The proposed method is verified by finite element analysis (FEA) results and it shows the usefulness of the method in eliminating a specific harmonic component in the back EMF waveform of a motor.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.664-670
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• 2018

In modern society, CCTV, which is the eye of surveillance, is being used to collect image data in various ways in daily life. CCTV is used not only for security, surveillance, and crime prevention but also in many fields such as automobile and black box. In this paper, we have developed a STM32F407 ARM chip based camera system for various applications. In order to develop camera system, modeling of camera system based on 3D structure was carried out in SolidWorks environment. The PCB board design was developed to extract the PCB parts from the camera system modeling files into iges files, convert them from the Altium Designer tool into 3D and 2D boards, After designing the camera system circuit and PCB, we have been studying the implementation of the stable system by using TRM (Thermal Risk Management) tool to cope with the heat simulation generated on the board.