• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.1
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• pp.6-14
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• 2012

For integrated complementary metal oxide semiconductor (CMOS) circuits, the lateral spread for two-dimensional (2-D) impurity distributions are very important for the analyzing the devices. The measured two-dimensional SEM data obtained using the chemical etching-method matched very well with the results of the Gauss model for boron implanted samples. But the profiles in boron implanted silicon were deviated from the Gauss model. The profiles in boron implanted silicon were shown a little bit steep profile in the deep region due to backscattering effect on the near surface from the bombardments of light boron ions. From the simulated 3-D data obtained using an analytical model, the 1-D and 2-D data were compared with the experimental data and could be verified the justification from the experimental data. The data of 3-D model were also shown good agreements with the experimental and the simulated data. It can be used in the 3-D chip design and the analysis of microelectro-mecanical system (MEMS) and special devices.

• Proceedings of the KWS Conference
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• 1995.10a
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• pp.145-148
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• 1995

To provide better understanding of a solder joint design criteria, mathematical models have been developed to calculate the shape of the solder fillets formed between the pad and lead. The effects of parameters such as solder volume and pad dimensions are described with this model. In this study, a systematic way to determine the design criteria of the SMT from the predicted 3D solder joint profile is proposed. The solder joint profile is calculated using the available 3D FEM code which minimizes the system energy due to the surface tension and gravity. The solder joint profiles of gullwing-type lead such as QFP and SOP are calculated for design parameters, and acceptable ranges are obtained. The result shows that the pad length is the most significant factor compared with the pad width and pad area.

• Journal of the Korean institute of surface engineering
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• v.50 no.6
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• pp.427-431
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• 2017

Anodic aluminum oxide (AAO) film has recently attracted much attention as a key material for the fabrication of various nanostructures. A control of anodizing voltage (U) was employed to render different anodic aluminum oxide (AAO) nanostructures with pore diameter ($D_p$) and interpore distance ($D_{int}$) in oxalic acid. In this work, we study the effect of stepwise modulation of anodizing voltages on the shape and dimension of porous structures along the vertical direction and demonstrate the fabrication of hierarchical layers of systematically controlled three-dimensional (3D) pore profile.

• Tunnel and Underground Space
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• v.21 no.6
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• pp.494-507
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• 2011

Rock joint surface roughness is one of the most important parameters in shear behavior analysis of rock joint surface. Until now, estimation of joint surface roughness has been conducted by various statistical methods with two-dimensional analysis. In this study, standard roughness profile suggested by Barton and Choubey (1977) was expanded into a 3D surface and its surface roughness was analyzed by surface angularity parameter. And the validity of quantification based on surface angularity was secured through comparison with $Z_2$ and Ai parameter. Also the surface angularity parameter was compared with shear strength by joint shear test using the replicated specimen.

• Journal of Korean Vacuum Science & Technology
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• v.6 no.1
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• pp.5-7
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• 2002

For quantitative N depth profiling, N profiles were measured in a～3 m Si oxynitride by low energy O$\sub$2+/sputtering and the result was calibrated with MEIS analysis of the N thickness and areal density. The quantitative depth profile of nitrogen showed the pileup of nitrogen atoms at the interface of ultrathin oxynitride films.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.4
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• pp.1-8
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• 2017

This paper concerns the possibility of 3D printing reverse idle gears for tractor transmission. For the purposes of this experiment, idle gears were manufactured using a SLA 3D printer, FDM 3D printer, and through machining. The accuracy of the idle gears produced in these three different ways were evaluated by the properties of their outer diameter, inner diameter, roundness, concentricity, parallelism, span, backlash, and gear grade. The tooth characteristics of the idle gears were evaluated by their profile, lead, and the pitch of the gears. The results of this experiment determined that the surface conditions created by the finishing process had a significant impact on the dimensional accuracy of the gears and the characteristics of their teeth.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.7
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• pp.532-539
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• 2018

A position estimation technique is presented for a missile using high-resolution range profiles obtained by three wideband radars. Radar measures a target range using a reflected signal from the surface of a missile. However, it is difficult to obtain the range between the radar and the origin of the missile. For this reason, the interior angle between the moving missile and tracking radar is calculated, and a compensated range between surface of the missile and its origin is added to the tracking range of the radar. Therefore, position estimation of a missile can be achieved by using three total ranges from each radar to the origin of the missile. To verify the position estimation of the missile, electromagnetic numerical analysis software was used to prove the compensated range according to the flight position. Moreover, a wideband radar operating at 500-MHz bandwidth was applied, and its range profile was used for the position estimation of a missile.

• Korean Journal of Optics and Photonics
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• v.14 no.5
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• pp.504-508
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• 2003

We present a new point-diffraction interferometer, which has been devised for the three-dimensional profile measurement of light scattering rough surfaces. The interferometer system has multiple sources of two-point-diffraction and a CCD camera composed of an array of two-dimensional photodetectors. Each diffraction source is an independent two-point-diffraction interferometer made of a pair of single-mode optical fibers, which are housed in a ceramic ferrule to emit two spherical wave fronts by means of diffraction at their free ends. The two spherical wave fronts then interfere with each other and subsequently generate a unique fringe pattern on the test surface. A He-Ne source provides coherent light to the two fibers through a 2${\times}$l optical coupler, and one of the fibers is elongated by use of a piezoelectric tube to produce phase shifting. The xyz coordinates of the target surface are determined by fitting the measured phase data into a global model of multilateration. Measurement has been performed for the warpage inspection of chip scale packages (CSPs) that are tape-mounted on ball grid arrays (BGAs) and backside profile of a silicon wafer in the middle of integrated-circuit fabrication process. When a diagonal profile is measured across the wafer, the maximum discrepancy turns out to be 5.6 ${\mu}{\textrm}{m}$ with a standard deviation of 1.5 ${\mu}{\textrm}{m}$.

• Journal of the Korean institute of surface engineering
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• v.29 no.6
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• pp.869-875
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• 1996

In this article the effects of process parameters of inductively coupled plasma etching with $SF_6$ /$N_2$/Ar mixture gas and mask materials on the etched profile of W were investigated. While the etched profile was improved by $N_2$-addition, low working presure, and reduced $SF_6$ flow rate, the etching selectity (W against SAL resist) was decreased. Due to the difficulty of W etching with single layer resist, sputter deposited $Al_2O_3$ film was used as a hardmask. Reduction of required EB resist thickness through $Al_2O_3$ mask application could reduce proximity effect during e-beam patterning, but the etch anisotropy was degraded by decreased sidewall passiviation effect.

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.6
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• pp.519-522
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• 2008

As industry of a semiconductor and LCD industry have been rapidly growing, precision technologies of machining such as etching and 3D measurement are required. Stylus has been important measuring method in traditional manufacturing process. However, its disadvantages are low measuring speed and damage possibility at contacting point. To overcome mentioned disadvantage, non-contacting measurement method is needed such as PMP(Phase Measuring Profilometry), WSI(white scanning interferometer) and Confocal Profilometry. Among above 3 well-known methods, WSI started to be applied to FPD(flat panel display) manufacturing process. Even though it overcomes 21t ambiguity of PMP method and can measure objects which has specular surface, the measuring speed and vibration coming from manufacturing machine are one of main issue to apply full automatic total inspection. In this study, We develop high speed WSI system and algorithm to reduce unknown noise. The developing WSI and algorithm are implemented to measure 3D surface of wafer. Experimental results revealed that the proposed system and algorithm are able to measure 3D surface profile of wafer with a good precision and high speed.