• Title/Summary/Keyword: 3D stacking

Search Result 209, Processing Time 0.022 seconds

Segmentation of Natural Fine Aggregates in Micro-CT Microstructures of Recycled Aggregates Using Unet-VGG16 (Unet-VGG16 모델을 활용한 순환골재 마이크로-CT 미세구조의 천연골재 분할)

  • Sung-Wook Hong;Deokgi Mun;Se-Yun Kim;Tong-Seok Han
    • Journal of the Computational Structural Engineering Institute of Korea
    • /
    • v.37 no.2
    • /
    • pp.143-149
    • /
    • 2024
  • Segmentation of material phases through image analysis is essential for analyzing the microstructure of materials. Micro-CT images exhibit variations in grayscale values depending on the phases constituting the material. Phase segmentation is generally achieved by comparing the grayscale values in the images. In the case of waste concrete used as a recycled aggregate, it is challenging to distinguish between hydrated cement paste and natural aggregates, as these components exhibit similar grayscale values in micro-CT images. In this study, we propose a method for automatically separating the aggregates in concrete, in micro-CT images. Utilizing the Unet-VGG16 deep-learning network, we introduce a technique for segmenting the 2D aggregate images and stacking them to obtain 3D aggregate images. Image filtering is employed to separate aggregate particles from the selected 3D aggregate images. The performance of aggregate segmentation is validated through accuracy, precision, recall, and F1-score assessments.

Energetics of adsorptions on fcc(111) and binary system; An application of the modified embedded atom method

  • Hy. Shin;J. Seo;Kim, J.S.
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 1999.07a
    • /
    • pp.188-188
    • /
    • 1999
  • The embedded atom method (EAM) of Daw and Baskes as a semiempirical method, has been successfully applied to the fcc or nearly filled d-band transition metals due to its computational feasibility and its methodological simplicity. Then Baskes modified the EAM (MEAM) to include directional bonding and applied it to metals, semiconductors, and diatomic gases, all of which have different types of bondings. Here, we present a detailed study of the energetics of adsorption on the fcc(111) surfaces and binary system within the framework of MEAM. In adsorption on fcc(111) surfaces, there are two energetically favored sites, so called, fcc site and hcp site, which may trigger stacking fault in the growth of films and might switch growth mode between 3D growth and layer by layer growth. We scrutinized the role of the hcp sites, which would offer dynamic growth pathways although the dynamics are not yet clear within the limited experimental resolution. Featuring these transient motions in the atomic level should contribute to the understanding the growth mechanisms on fcc(111) surface. And we also applied MEAM for initial stage energetics at the Cr coverage of sub- monolayer on W(110). We hope that recently observed extraordinary growth behavior at the Cr coverage of 0.7 monolayer, self- organized nano-scale lines, can be resolved in this MEAM binary system calculation.

  • PDF

Microstructural Analysis of STS316L Samples Manufactured by Powder Bed Fusion and Post-heat Treatments (Powder Bed Fusion 공정으로 제조한 STS 316L의 미세조직과 후속 열처리 특성)

  • Song, S.Y.;Lee, D.W.;Cong, D.V.;Kim, J.W.;Lee, S.M.;Joo, S.H.;Kim, Jin-Chun
    • Journal of Powder Materials
    • /
    • v.29 no.1
    • /
    • pp.14-21
    • /
    • 2022
  • In the powder bed fusion (PBF) process, a 3D shape is formed by the continuous stacking of very fine powder layers using computer-aided design (CAD) modeling data, following which laser irradiation can be used to fuse the layers forming the desired product. In this method, the main process parameters for manufacturing the desired 3D products are laser power, laser speed, powder form, powder size, laminated thickness, and laser diameter. Stainless steel (STS) 316L exhibits excellent strength at high temperatures, and is also corrosion resistant. Due to this, it is widely used in various additive manufacturing processes, and in the production of corrosion-resistant components with complicated shapes. In this study, rectangular specimens have been manufactured using STS 316L powder via the PBF process. Further, the effect of heat treatment at 800 ℃ on the microstructure and hardness has been investigated.

A Simplified Method for Determining Modal Strain Energy Release Rate of Free-Edge Delaminations in Laminated Composite (적층복합재의 자유단 박리에 대한 모드별 스트레인 에너지해방률의 간이계산법)

  • Kim, Taek-Hyun;Oh, Taek-Yul;Kim, In-Kweon
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.21 no.3
    • /
    • pp.423-429
    • /
    • 1997
  • A simplified method for determining the mode components of the strain energy release rate of free-edge delaminations in laminated composite is proposed. The interlaminar stresses are evaluated as an interface moment and interface shear forces that are obtained from the equilibrium equations at the interface between the adjacent layers. Deformation of an edge-delaminated laminate is calculated by using a generalized quasi-three dimensional classical laminated plate theory developed by the authors. The analysis provides closed-form expression for the three components of the strain energy release rate. Comparison of results with a finite element solution using the virtual crack closure technique shows good agreement. In the present study, laminated composite with stacking sequences of [30/-30/90]$_{s}$ were examined. The simple nature of the method makes it suitable for primary design analysis for the delaminations of laminated composite.e.

A 2-Gbps Simultaneous Bidirectional Inductively-Coupled Link (동시 양방향 통신이 가능한 2-Gbps 인덕터 결합 링크)

  • Jeon, Minki;Yoo, Changsik
    • Journal of the Institute of Electronics and Information Engineers
    • /
    • v.50 no.3
    • /
    • pp.42-49
    • /
    • 2013
  • A simultaneous bidirectional inductively-coupled link is presented. In the conventional inductively-coupled link, data can be bidirectionally transmitted through channel, however not simultaneously. We propose simultaneous bidirectional link for higher data rate with effective echo cancellation technique. Each chip performs TX-mode and RX-mode simultaneously. Instead chip stacking for test, similar test enviroment is realized in a single chip that is fabricated in a $0.13-{\mu}m$ standard CMOS technology.

A Two-dimensional Supramolecular Network Built through Unique π-πStacking: Synthesis and Characterization of [Cu(phen)2(μ-ID A)Cu(phen)·(NO3)](NO3)·4(H2O)

  • Lin, Jian-Guo;Qiu, Ling Qiu;Xu, Yan-Yan
    • Bulletin of the Korean Chemical Society
    • /
    • v.30 no.5
    • /
    • pp.1021-1025
    • /
    • 2009
  • A novel supramolecular network containing binuclear copper unit $[Cu(phen)_{2}({\mu}-ID\;A)Cu(phen){\cdot}(NO_{3})](NO_{3}){\cdot}4(H_{2}O)$ (1) was synthesized through the self-assembly of iminodiacetic acid ($H_2IDA$) and 1,10-phenanthroline (phen) in the condition of pH = 6. It has been characterized by the infrared (IR) spectroscopy, elemental analysis, single crystal X-ray diffraction, and thermogravimetric analysis (TGA). 1 shows a 2-D supramolecular structure assembled through strong and unique $\pi-\pi$ packing interactions. Density functional theory (DFT) calculations show that theoretical optimized structures can well reproduce the experimental structure. The TGA and powder X-ray diffraction (PXRD) curves indicate that the complex 1 can maintain the structural integrity even at the loss of free water molecules. The magnetic property is also reported in this paper.

돼지 난포란 복합체(PCOCs)의 체외성숙시 Plasminogen Activator의 생산에 관한 연구

  • 최선호;이장희;연성흠;박성재;이혜현;류일선;손동수;박춘근;김남형
    • Proceedings of the KSAR Conference
    • /
    • 2003.06a
    • /
    • pp.60-60
    • /
    • 2003
  • 소의 난포란과 난구세포의 체외배양시 plasminogen activators(PAs)의 생산을 보고하였다 (Choi 등, 1998). 따라서 본 연구는 돼지 난포란 및 난구세포의 체외성숙시 PAs의 생산을 SDS-PAGE와 Zymogram을 이용하여 조사하였다. PCOCs는 도축암퇘지의 난소로부터 채취하여, 난구세포가 충실한 것만 선별하였으며, 실험구에 사용될 난구세포는 pipetting에 의해 분리하여 이용하였다. 돼지 신선정액은 D-PBS로 1,500 rpm, 5분간 2회 원심분리하여 정장물질을 제거하고, 3회째는 5mM caffein이 함유된 BO(Brackett과 Oliphant, 1985) 배양액으로 세정하였다. 처리한 돼지 정액은 1$\times$$10^{8}$ cells/$m\ell$로 조정하여 20${\mu}\ell$씩 분주하고 0, 1, 2, 3 또는 4시간 동안 39$^{\circ}C$ 5% $CO_2$, 95% 공기인 배양기에서 수정능획득을 유도하였다. 배양이 완료된 정액은 20${\mu}\ell$의 sample buffer(5% SDS, 20% glycerol, 0.0025% bromophenol blue 그리고 0.125M Tris HC1 buffer)에 넣어 -7$0^{\circ}C$ 동결기에 보관하였다. 전기영동은 4% stacking gel과 10% separating gel로 분리하였으며, 20 mA에서 90분간 실시하였다. Zymogram은 Choi 등(1988)의 방법에 따라 실시하여 PAs의 생산을 확인하였으며, 이상의 실험은 3반복을 실시하였다. 시험구 전체에서 urokinase type plasminogen activator(uPA)가 확인되었으며, 체외수정능 획득시간에는 차이가 없었다. 두 종류의 고분자량의 uPA의존성 영역이 나타났으며, 분자량은 65kD과 62 kD이었다. 이러한 결과로 볼 때 Hart 등(1986)이 uPA의 경우 다양한 영역의 분자량 변이를 확인할 수 있었다고 한 것과 동일하였으며, 돼지 정자가 체외수정능 획득시 uPA를 생산하는 것을 확인할 수 있었다.

  • PDF

Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling (펄스-역펄스 전착법을 이용한 SiP용 via의 구리 충진에 관한 연구)

  • Bae J. S.;Chang G H.;Lee J. H.
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.12 no.2 s.35
    • /
    • pp.129-134
    • /
    • 2005
  • Electroplating copper is the important role in formation of 3D stacking interconnection in SiP (System in Package). The I-V characteristics curves are investigated at different electrolyte conditions. Inhibitor and accelerator are used simultaneously to investigate the effects of additives. Three different sizes of via are tested. All via were prepared with RIE (reactive ion etching) method. Via's diameter are 50, 75, $100{\mu}m$ and the height is $100{\mu}m$. Inside via, Ta was deposited for diffusion barrier and Cu was deposited fer seed layer using magnetron sputtering method. DC, pulse and pulse revere current are used in this study. With DC, via cannot be filled without defects. Pulse plating can improve the filling patterns however it cannot completely filled copper without defects. Via was filled completely without defects using pulse-reverse electroplating method.

  • PDF

Analysis on the Temperature of 3D Multi-core Processors according to Vertical Placement of Core and L2 Cache (코어와 L2 캐쉬의 수직적 배치 관계에 따른 3차원 멀티코어 프로세서의 온도 분석)

  • Son, Dong-Oh;Ahn, Jin-Woo;Park, Jae-Hyung;Kim, Jong-Myon;Kim, Cheol-Hong
    • Journal of the Korea Society of Computer and Information
    • /
    • v.16 no.6
    • /
    • pp.1-10
    • /
    • 2011
  • In designing multi-core processors, interconnection delay is one of the major constraints in performance improvement. To solve this problem, the 3-dimensional integration technology has been adopted in designing multi-core processors. The 3D multi-core architecture can reduce the physical wire length by stacking cores vertically, leading to reduced interconnection delay and reduced power consumption. However, the power density of 3D multi-core architecture is increased significantly compared to the traditional 2D multi-core architecture, resulting in the increased temperature of the processor. In this paper, the floorplan methods which change the forms of vertical placement of the core and the level-2 cache are analyzed to solve the thermal problems in 3D multi-core processors. According to the experimental results, it is an effective way to reduce the temperature in the processor that the core and the level-2 cache are stacked adjacently. Compared to the floorplan where cores are stacked adjacently to each other, the floorplan where the core is stacked adjacently to the level-2 cache can reduce the temperature by 22% in the case of 4-layers, and by 13% in the case of 2-layers.

Design Optimization of Double-array Bolted Joints in Cylindrical Composite Structures

  • Kim, Myungjun;Kim, Yongha;Kim, Pyeunghwa;Park, Jungsun
    • International Journal of Aeronautical and Space Sciences
    • /
    • v.17 no.3
    • /
    • pp.332-340
    • /
    • 2016
  • A design optimization is performed for the double-bolted joint in cylindrical composite structures by using a simplified analytical method. This method uses failure criteria for the major failure modes of the bolted composite joint. For the double-bolted joint with a zigzag arrangement, it is necessary to consider an interaction effect between the bolt arrays. This paper proposes another failure mode which is determined by angle and distance between two bolts in different arrays and define a failure criterion for the failure mode. The optimal design for the double-bolted joint is carried out by considering the interactive net-tension failure mode. The genetic algorithm (GA) is adopted to determine the optimized parameters; bolt spacing, edge distance, and stacking sequence of the composite laminate. A purpose of the design optimization is to maximize the burst pressure of the cylindrical structures by ensuring structural integrity. Also, a progressive failure analysis (PFA) is performed to verify the results of the optimal design for the double-bolted joint. In PFA, Hashin 3D failure criterion is used to determine the ply that would fail. A stiffness reduction model is then used to reduce the stiffness of the failed ply for the corresponding failure mode.