• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.99-105
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• 2022

As the chip size gets smaller, the width of the electrode line is also fine, and the density of interconnections is increasing. As a result, RC delay is becoming a problem due to the difference in resistance between the capacitor layer and the electrical conductivity layer. To solve this problem, the development of electrodes with high electrical conductivity and dielectric materials with low dielectric constant is required. In this study, we developed low dielectric ink by mixing commercial PSR which protect PCB's circuits from external factors and PI with excellent thermal property and low-k characteristics. As a result, the ink mixture of PSR and PI 10:3 showed the best results, with a dielectric constant of about 2.6 and 2.37 at 20 GHz and 28 GHz, respectively, and dielectric dissipation was measured at about 0.022 and 0.016. In order to verify the applicability of future applications, various line-width transmission lines produced on Teflon were evaluated, and as a result, the loss of transmission lines using low dielectric ink mixed with PI was 0.12 dB less on average in S21 than when only PSR was used.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.129-134
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• 2005

Electroplating copper is the important role in formation of 3D stacking interconnection in SiP (System in Package). The I-V characteristics curves are investigated at different electrolyte conditions. Inhibitor and accelerator are used simultaneously to investigate the effects of additives. Three different sizes of via are tested. All via were prepared with RIE (reactive ion etching) method. Via's diameter are 50, 75, $100{\mu}m$ and the height is $100{\mu}m$. Inside via, Ta was deposited for diffusion barrier and Cu was deposited fer seed layer using magnetron sputtering method. DC, pulse and pulse revere current are used in this study. With DC, via cannot be filled without defects. Pulse plating can improve the filling patterns however it cannot completely filled copper without defects. Via was filled completely without defects using pulse-reverse electroplating method.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.1
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• pp.1-11
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• 2018

In this study, pro-oxidant($d2w^{(R)}$) and rPP/ZnO nanocomposite flexible films for food packaging were prepared, and their mechanical and antimicrobial properties were investigated. As a result, the carbonyl index and hydroxyl index increased with exposured time to heat and UV rays. Surface analysis showed that the addition of zinc oxide improved the dispersibility and compatibility of the polymer, so that the surface of the composite film was smooth and the zinc oxide particles were smaller than the compared film. And it kept the physical properties by heat and UV ray blocking effect, and it worked to reduce decomposition. In the antimicrobial activity test, the microbial reduction rate was 3 logs or more at the use concentration of zinc oxide. The tensile strength was increased and the elongation was decreased. Oxidative degradability of multi-layered film in UV exposured for 72 hours, the molecular weight of the film decreased by 75.6%, 1,294 g/mol Mn and 5,920 g/mol Mw. In the safety analysis of food packaging materials, we obtained that are in standard of polypropylene, a food contact material of domestic law.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.25-29
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• 2016

The semiconductor industry has been developed mainly by micronization process due to many advantages of miniaturization of devices. Mass production of semiconductors of 10 nm class has been started recently, and it is expected that the technology generation of 5 nm & 7 nm technology will come. However, excessive linewidth reduction affects physical limits and device reliability. To solve these problems, new process technology development and new concept devices are being studied. In this review, we introduce the next generation technology and introduce the advanced research for the new concept device.

• Journal of the Microelectronics and Packaging Society
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• v.4 no.2
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• pp.1-16
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• 1997

Modern electronic components require its sophistication to meet the stringent requirements which are demanded for high tech industry. In an attempt to meet to such demand miniaturization of the components has been considrably progressed to increase its circuit density. High density of the components can be achieved by an innovative technology of design and manufacturing with functionally improved or new materials such as small bulk devices thick films and thin films circuits (2D). Recently many efforts have been extensively made in the community of the Hybrid Microelectronics through out world. In this paper an approach is introduced in realizing a sophisticated passive circuit for the microelectronics applications by use of hybrid thick/thin films technology. The merit of this technology is discussed and the future trend is speculated.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.3
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• pp.97-106
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• 2015

Thermal deformation of packaging materials was observed in some ready-to-eat food products for microwave use. Therefore, the deformation patterns depending on packaging types and shapes of 9 domestic and 11 foreign products after microwave heating were investigated. Among the domestic and foreign products, thermal deformations of packaging material were observed in 5 and 8 samples, respectively. Besides, thermal deformation occurred on the lid and cup body of tray filled with a spicy chicken sauce after having microwaved where previously no deformation had been observed with other food types. No consistent results of thermal deformation were obtained by the analysis of salinity, brix, pH and viscosity of RTE products for microwave heating. However, thermal deformations of packages were less found in the packages used for the RTE foods contained very high or low viscosity than those with medium viscosity. Furthermore, the degree of thermal deformations was dependent on the food composition and shape as well as package type. In order to prevent the thermal deformation of packaging materials, therefore, technological advances and further studies are required to develop the heat-resistant packaging system and to improve the non-uniformity during microwave heating of RTE foods.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.20-34
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• 2023

Single or multi-layered two-dimensional (2D) materials, with thicknesses in the order of a few nanometers, have garnered substantial attention across diverse research domains owing to their distinct properties, including electrical conductivity, flexibility, and optical transparency. These materials are frequently subjected to repetitive mechanical actions in applications like electronic skin (E-Skin) and smart textiles. Moreover, they are often exposed to external factors like temperature, humidity, and pressure, which can lead to a deterioration in component durability and lifespan. Consequently, significant research efforts are directed towards developing self-healing properties in these components. Notably, recent investigations have revealed promising outcomes in the field of self-healing composite materials, with Ti₃Ci₂Ti_x MXene being a prominent component among the myriad of available 2D materials. In this paper, we aim to introduce various synthesis methods and characteristics of Ti₃Ci₂Ti_x MXene, followed by an exploration of self-healing application technologies based on Ti₃Ci₂Ti_x MXene.

• Journal of Mushroom
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• v.21 no.3
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• pp.83-87
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• 2023

The importance of biocomposites has increased owing to the changes in global consumption trends and rapid climate change. Technologies using mushroom mycelium cultivation, and molding methods for mycelial application have gained attention as potential strategies for producing eco-friendly composites. Currently, mushroom mycelia are used as raw materials for food and cosmetics; however, research on their utilization as biocomposite materials is limited. Therefore, the potential for the development of mushroom mycelium-related products and technologies is high. This review analyzes the domestic and international patent application trends related to the technologies for composite (packaging, insulation, adhesives, and leather) and food (substitute for meat) materials using mushroom mycelium, as an eco-friendly biocomposite material, to provide objective patent information that can further research and development (R&D) in this field.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.31-36
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• 2004

We charaterized electromagnetic shielding properties of a soft magnetic film using by a ASTM method and 2-port flanged coaxial line method in a RF range and quantitatively analyzed factors for the shielding effectiveness of the soft magnetic film in far field. The shielding effectiveness of the soft magnetic film was dominantly affected by absorption loss not reflection loss in high frequency range of 4-13.5 GHz.