• Title/Summary/Keyword: 3D optical measurement

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High-speed Three-dimensional Surface Profile Measurement with the HiLo Optical Imaging Technique

  • Kang, Sewon;Ryu, Inkeon;Kim, Daekeun;Kauh, Sang Ken
    • Current Optics and Photonics
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    • v.2 no.6
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    • pp.568-575
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    • 2018
  • Various techniques to measure the three-dimensional (3D) surface profile of a 3D micro- or nanostructure have been proposed. However, it is difficult to apply such techniques directly to industrial uses because most of them are relatively slow, unreliable, and expensive. The HiLo optical imaging technique, which was recently introduced in the field of fluorescence imaging, is a promising wide-field imaging technique capable of high-speed imaging with a simple optical configuration. It has not been used in measuring a 3D surface profile although confocal microscopy originally developed for fluorescence imaging has been adapted to the field of 3D optical measurement for a long time. In this paper, to the best of our knowledge, the HiLo optical imaging technique for measuring a 3D surface profile is proposed for the first time. Its optical configuration and algorithm for a precisely detecting surface position are designed, optimized, and implemented. Optical performance for several 3D microscale structures is evaluated, and it is confirmed that the capability of measuring a 3D surface profile with HiLo optical imaging technique is comparable to that with confocal microscopy.

The Use of Advanced Optical Measurement Methods for the Mechanical Analysis of Shear Deficient Prestressed Concrete Members

  • Wilder, K. De;Roeck, G. De;Vandewalle, L.
    • International Journal of Concrete Structures and Materials
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    • v.10 no.2
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    • pp.189-203
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    • 2016
  • This paper investigates on the use of advanced optical measurement methods, i.e. 3D coordinate measurement machines (3D CMM) and stereo-vision digital image correlation (3D DIC), for the mechanical analysis of shear deficient prestressed concrete members. Firstly, the experimental program is elaborated. Secondly, the working principle, experimental setup and corresponding accuracy and precision of the considered optical measurement techniques are reported. A novel way to apply synthesised strain sensor patterns for DIC is introduced. Thirdly, the experimental results are reported and an analysis is made of the structural behaviour based on the gathered experimental data. Both techniques yielded useful and complete data in comparison to traditional mechanical measurement techniques and allowed for the assessment of the mechanical behaviour of the reported test specimens. The identified structural behaviour presented in this paper can be used to optimize design procedure for shear-critical structural concrete members.

A High-speed Digital Laser Grating Projection System for the Measurement of 3-dimensional Shapes

  • Park, Yoon-Chang;Park, Chul-Geun;Ahn, Seong-Joon;Kang, Moon-Ho;Ahn, Seung-Joon
    • Journal of the Optical Society of Korea
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    • v.13 no.2
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    • pp.251-255
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    • 2009
  • In the non-contact 3-dimensional (3D) shape measurements, the fringe pattern projection method based on the phase-shifting technique has been considered very effective for its high speed and accuracy. The digital fringe projector in particular has great flexibility in generating fringe patterns since the patterns can be controlled easily by the computer program. In this work, we have developed a high-speed digital laser grating projection system using a laser diode and a polygon mirror, and evaluated its performance. It has been demonstrated that all the optical measurements required to find out the profile of a 3D object could be carried out within 31 ms, which confirmed the validity of our 3D measurement system. The result implies the more important fact that the speed in 3D measurement can be enhanced remarkably since, in our novel system, there is no device like a LCD or DMD whose response time limits the measurement speed.

A New Method of Noncontact Measurement for 3D Microtopography in Semiconductor Wafer Implementing a New Optical Probe based on the Precision Defocus Measurement (비초점 정밀 계측 방식에 의한 새로운 광학 프로브를 이용한 반도체 웨이퍼의 삼차원 미소형상 측정 기술)

  • 박희재;안우정
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.1
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    • pp.129-137
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    • 2000
  • In this paper, a new method of noncontact measurement has been developed for a 3 dimensional topography in semiconductor wafer, implementing a new optical probe based on the precision defocus measurement. The developed technique consists of the new optical probe, precision stages, and the measurement/control system. The basic principle of the technique is to use the reflected slit beam from the specimen surface, and to measure the deviation of the specimen surface. The defocusing distance can be measured by the reflected slit beam, where the defocused image is measured by the proposed optical probe, giving very high resolution. The distance measuring formula has been proposed for the developed probe, using the laws of geometric optics. The precision calibration technique has been applied, giving about 10 nanometer resolution and 72 nanometer of four sigma uncertainty. In order to quantitize the micro pattern in the specimen surface, some efficient analysis algorithms have been developed to analyse the 3D topography pattern and some parameters of the surface. The developed system has been successfully applied to measure the wafer surface, demonstrating the line scanning feature and excellent 3 dimensional measurement capability.

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The Design of Optical Marker for Auto-registering of 3D scan data (3차원 스캐너의 레지스터링 문제 해결을 위한 광학식 마커 설계)

  • 손용훈;양현석
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.256-259
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    • 2003
  • This paper proposes OPTICAL MARKER fer registering process - one of the 3D measurement process : scan registering - merging - measurement. If the registering work is carried out manually, it can be accompanied with much time and many errors. Because the patterned marker make registering process automatic, many firms use it now. But the physical shape of existing markers is the source of the data loss caused by hiding surface, and the marker arrangement is the source of the time loss. The optical marker proposed in this paper has marker generator, organized a large number of binary coded control laser diode, separate from 3D scan object. So, it does not take much time for the marker disposition, and it is not the origin of the data loss, and the binary coded laser information make the auto-registering possible.

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Design of an Asymmetric-custom-surface Imaging Optical System for Two-dimensional Temperature-field Measurement

  • Guanghai Liu;Ming Gao;Jixiang Zhao;Yang Chen
    • Current Optics and Photonics
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    • v.8 no.5
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    • pp.484-492
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    • 2024
  • In response to the difficulty of synchronously obtaining multiwavelength images for fast two-dimensional (2D) temperature measurement, a multispectral framing imaging optical system is designed, based on the segmented-aperture imaging method and asymmetric surface shape. The system adopts a common-aperture four-channel array structure to synchronously collect multiwavelength temperature-field images. To solve the problem of asymmetric aberration caused by being off-axis, a model of the relationship between incident and outgoing rays is established to calculate the asymmetric custom surface. The designed focal length of the optical system is 80 mm, the F-number is 1:3.8, and the operating wavelength range is 0.48-0.65 ㎛. The system is divided into four channels, corresponding to wavelengths of 0.48, 0.55, 0.58, and 0.65 ㎛ respectively. The modulation transfer function value of a single channel lens is higher than 0.6 in the full field of view at 35 lp/mm. The experimental results show that the asymmetric-custom-surface imaging system can capture clear multiwavelength images of a temperature field. The framing imaging system can capture clear images of multiwavelength temperature fields, with high consistency in images of different wavelengths. The designed optical system can provide reliable multiwavelength image data for 2D temperature-field measurement.

Precision Profile Measurement on Roughly Processed Surfaces (거친 가공표면 형상의 고정밀 측정법 개발)

  • Kim, Byoung-Chang;Lee, Se-Han
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.7 no.1
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    • pp.47-52
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    • 2008
  • We present a 3-D profiler specially devised for the profile measurement of rough surfaces that are difficult to be measured with conventional non-contact interferometer. The profiler comprises multiple two-point-diffraction sources made of single-mode optical fibers. Test measurement proves that the proposed profiler is well suited for the warpage inspection of microelectronics components with rough surface, such as unpolished backsides of silicon wafers and plastic molds of integrated-circuit chip package.

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3D imaging and 3D display based on digital holography

  • Matoba, Osamu
    • Proceedings of the Optical Society of Korea Conference
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    • 2009.10a
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    • pp.133-134
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    • 2009
  • We have presented our approach to build a 3D display system based on digital holography. For wide viewing angle, we have presented several techniques such as measurement, time-sharing display, and coherent amplification. These techniques can advance the wavefront 3D display system to next stage.

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Measurement of Tunnel 3-D Displacement using Digital Photogrammetry (디지털 영상을 이용한 터널 3차원 변위 계측)

  • Kim, Kwang-Yeom;Kim, Chang-Yong;Lee, Seung-Do;Seo, Yong-Seok;Lee, Chung-In
    • The Journal of Engineering Geology
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    • v.17 no.4
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    • pp.567-576
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    • 2007
  • In order to assess the on-site applicability of 3D absolute displacement monitoring of tunnel using digital photogrammetry, the displacement of the optical target placed at the measurement section was investigated, as planned in the OO tunnel construction site. The targets on 3 measurement lines only were considered for each point of measurement for the reconstruction of 3D cubic model for the digital vision monitoring. For each 3D model, 3 or more images have to be obtained at each point. On the last 2 measurement lines, 6 targets (crown, left and right walls) were continuously overlapped to construct 3D models so that 6 or more apices can be shared by 2 3D models. In order to compare the measurement methods of 3D absolute displacements in tunnel excavation, i. e, total station and digital image measurement, both the digital image measurement and optical measurement were conducted for 10 times in the same work section. The time and measurement results of both methods were compared.

Low Cost Omnidirectional 2D Distance Sensor for Indoor Floor Mapping Applications

  • Kim, Joon Ha;Lee, Jun Ho
    • Current Optics and Photonics
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    • v.5 no.3
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    • pp.298-305
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    • 2021
  • Modern distance sensing methods employ various measurement principles, including triangulation, time-of-flight, confocal, interferometric and frequency comb. Among them, the triangulation method, with a laser light source and an image sensor, is widely used in low-cost applications. We developed an omnidirectional two-dimensional (2D) distance sensor based on the triangulation principle for indoor floor mapping applications. The sensor has a range of 150-1500 mm with a relative resolution better than 4% over the range and 1% at 1 meter distance. It rotationally scans a compact one-dimensional (1D) distance sensor, composed of a near infrared (NIR) laser diode, a folding mirror, an imaging lens, and an image detector. We designed the sensor layout and configuration to satisfy the required measurement range and resolution, selecting easily available components in a special effort to reduce cost. We built a prototype and tested it with seven representative indoor wall specimens (white wallpaper, gray wallpaper, black wallpaper, furniture wood, black leather, brown leather, and white plastic) in a typical indoor illuminated condition, 200 lux, on a floor under ceiling mounted fluorescent lamps. We confirmed the proposed sensor provided reliable distance reading of all the specimens over the required measurement range (150-1500 mm) with a measurement resolution of 4% overall and 1% at 1 meter, regardless of illumination conditions.