• International Journal of High-Rise Buildings
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• v.3 no.4
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• pp.311-323
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• 2014

This paper introduces recent applications of three-dimensional building/construction data modeling (3D) and building information modeling (BIM) to large-scale complex building construction projects in Japan. Recently, BIM has been utilized as a tool in construction process innovation through planning, design, engineering, procurement and construction to establish a front-loading-type design building system. Firstly, the background and introduction processes of 3D and BIM are described to clarify their purposes and scopes of applications. Secondly, 3D and BIM applications for typical large-scale complex building construction projects to improve planning and management efficiency in building construction are presented. Finally, future directions and further research issues with 3D and BIM applications are proposed.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.133-138
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• 2008

Since the invention of 'the Stereoscope' in 1838, many kinds of 3D display systems have been developed and used for various applications. In fact they have been at least proposed for virtually every application that uses 2D displays. In this paper, we introduce the various 3D display techniques and its products.

• Ceramist
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• v.22 no.3
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• pp.243-255
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• 2019

Graphene, a two-dimensional material with a single atomic layer, has recently become a major research focus in various applications such as electronic devices, sensors, energy storage, catalysts, and adsorbents, because of its large theoretical surface area, excellent electrical conductivity, outstanding chemical stability, and good mechanical properties. Recently, 3D nanoporous graphene structures have received tremendous attention to expand the application of 2D graphene. Here, we overview the synthesis of 3D nanoporous graphene network structure with two-dimensional graphite oxide sheets, the control of porous parameters such as specific surface area, pore volume and pore size etc, and the modification of electronic structure by heteroatom doping along with its various applications. The 3D nanoporous graphene shows superior performance in diverse applications as a promising key material. Consequently, 3D nanoporous graphene can lead the future for advanced nanotechnology.

• Journal of information and communication convergence engineering
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• v.15 no.2
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• pp.117-122
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• 2017

Three-dimensional integrated circuits (3D ICs), starting with memory cubes, have entered the mainstream recently. The benefits many predicted in the past are indeed delivered, including higher memory bandwidth, smaller form factor, and lower energy. However, 3D ICs have yet to find their deployment in aerospace applications. In this paper we first present key design tools and methodologies for high performance, low power, and reliable 3D ICs that mainly target terrestrial applications. Next, we discuss research needs to extend their capabilities to ensure reliable operations under the harsh space environments. We first present a design methodology that performs fine-grained partitioning of functional modules in 3D ICs for power reduction. Next, we discuss our multi-physics reliability analysis tool that identifies thermal and mechanical reliability trouble spots in the given 3D IC layouts. Our tools will help aerospace electronics designers to improve the reliability of these 3D IC components while not degrading their energy benefits.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.1-7
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• 2023

The ability of 3D/4D printing technology to create arbitrary 3D structures provides a greater degree of freedom in the design of printed structures. This capability has influenced the field of electronics and biomedical applications by enabling the trends of device miniaturization, customization, and personalization. Here, the current state-of-the-art knowledge of 3D printed electronics and biomedical applications with the unique and unusual properties enabled by 3D/4D printing is reviewed. Specifically, the review encompasses emerging areas involving recyclable and degradable electronics, metamaterial-based pressure sensor, fully printed portable photodetector, biocompatible and high-strength teeth, bioinspired microneedle, and transformable tube array for 3D cell culture and histology.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1561-1564
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• 2006

SDI has been developing mobile 3D display for years. For mobile applications, we adapted parallax barrier method. We have developed auto stereoscopic swing 3D display in which people can 3D image in both portrait and landscape mode. Furthermore to increase 3D resolution, we have developed a high resolution 3D display using time division multiplexing parallax barrier method

• Journal of Technology Innovation
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• v.14 no.3
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• pp.43-69
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• 2006

In this study, we examine the effect of TRIPS on the relationship between R&D expenditures and patent applications in manufacturing firms. The first set of tests examines the association between patent applications and R&D expenditures and firm specific factors such as firm size and capital intensity. The next set of tests adds environmental factors including R&D intensity of the industry and development of TRIPS. We divide the sample period into three subperiods according to the progress of TRIPS subperiod 1(1984-1988) before TRIPS, subperiod 2(1989-1994) after negotiation of TRIPS and subperiod 3(1995-2000) after agreement on TRIPS. Regression model reveals that the coefficient on firm size is significantly positive over the all sample Period, while that of R&D expenditures of R&D intensive firms is significantly positive in subperiod 2 and 3(1989-2000) and that of capital intensity is significantly negative only in subperiod 3(1995-2000). The findings suggest that the efficient intellectual property system promotes the patent application of R&D intensive firms.

• Journal of Sensor Science and Technology
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• v.32 no.1
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• pp.31-38
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• 2023

Three-dimensional (3D) micro/nanostructures based on soft elastomers have received extensive attention in recent years, owing to their potential and advanced applicability. Designing and fabricating 3D micro/nanostructures are crucial for applications in diverse engineering fields, such as sensors, harvesting devices, functional surfaces, and adhesive patches. However, because of their structural complexity, fabricating soft-elastomer-based 3D micro/nanostructures with a low cost and simple process remains a challenge. Bio-inspired designs that mimic natural structures, or replicate their micro/nanostructure surfaces, have greatly benefited in terms of low-cost fabrication, scalability, and easy control of geometrical parameters. This review highlights recent advances in 3D micro/nanostructures inspired by nature for diverse potential and advanced applications, including flexible pressure sensors, energy-harvesting devices based on triboelectricity, superhydrophobic/-philic surfaces, and dry/wet adhesive patches.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1085-1091
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• 2014

Recently, 3D printing has received increasing attention due to its boundless potentials. Because 3D printing starts from 3D geometry information, computer-aided design (CAD) is an essential technology to build 3D geometry data. These days, education of 3D CAD for engineering students has been changed from the theoretical lecture to practical design training using commercial CAD software. As a result, open-ended design projects have replaced the traditional theoretical examinations to evaluate students' outcomes. However, such design projects are not enough to evaluate students' outcomes because their results are expressed in two-dimensional ways. In this paper, applications of 3D printing in engineering design education are discussed by describing the procedure and outcomes of design projects. It was found that the use of 3D printing could improve students' outcomes by fabricating real physical models out of their designs.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.917-920
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• 2005

This paper presents 3D graphics geometry processor for mobile applications. Geometry stage needs to cope with the large amount of computation. Geometry stage consists of transformation process and lighting process. To deal with computation in geometry stage, the vector processor that is based on pipeline chaining is proposed. The performance of proposed 3D graphics geometry processor is up to 4.3M vertex/sec at 100 MHz. Also, the designed processor is compliant with OpenGL ES that is widely used for standard API of embedded system. The proposed structure can be efficiently used in 3D graphics accelerator for mobile applications.