• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.2
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• pp.82-90
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• 2019

In this paper, the effects of different 3D printing conditions including oil lubrication and annealing are observed for their effects on tensile testing. In 3D printing, a press-out extrude filament is rapidly heated and cooled to create internal stress in the printed part. The 3D printing internal stress can be removed using oil-coated filament and annealing. During the oven cooling at an annealing temperature of $106^{\circ}C$, the stress of the specimens with laminated angle $0^{\circ}$ tends to increase by 12.6%, and that of the oil-coated filament printing specimens is increased by 17%. At the annealing temperature of $106^{\circ}C$, the stress of the oil-coated filament printing specimens tends to increase by 35%. In this study, we have found that the oil lubrication and annealing remove the internal stresses and increase the strength of the printed specimens. The oil lubrication and annealing reform the crystalline structures to even out the areas of high and low stress, which creates fewer fragile areas. These results are very useful for the manufacture of 3D printing products with a suitable mechanical strength for applications.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.53-60
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• 2018

In this paper, the effect of different 3D printing parameters including laminated angle and annealing temperature is observed their effect on FDM conductive 3D printing. In FDM 3D printing, a conductive filament is heated quickly, extruded, and then cooled rapidly. FDM 3D Print conductive filament is a poor heat conductor, it heats and cools unevenly causing the rapid heating and cooling to create internal stress. when the printed conductive specimens this internal stress can be increase electrical resistance and decrease electrical conductivity. Therefore, This experiment would like to use annealing to remove internal stress and increase electrical conductivity. The result of experiment when 3D printing conductive specimen be oven cooling of annealing temperature $120^{\circ}C$ electrical resistance appeared decrease than before annealing. So We have found that 3D printing annealing removes internal stresses and increases the electrical conductivity of printed specimens. These results are very useful for making conductive 3D printing electronic circuit, sensor ect...with electrical conductance suitable for the application.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.4
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• pp.130-136
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• 2018

In this paper, the effects of different 3D printing parameters including laminated angle and annealing temperature, were observed for their effects on tensile testing. In 3D printing, a filament is heated quickly, extruded, and then cooled rapidly. Because plastic is a poor heat conductor, it heats and cools unevenly causing the rapid heating and cooling to create internal stress within the printed part. Therefore, internal stress can be removed using annealing and to increase tensile strength and strain. During air cooling at annealing temperature $140^{\circ}C$, the strain of laminated angle $45^{\circ}$ specimens tended to increase by 46% while the tensile stress tended to increase by 7.4%. During oven cooling at annealing temperature $140^{\circ}C$, the strain of laminated angle $45^{\circ}$ specimens tended to increase by 34% while the tensile stress tended to increase by 22.2%. In this study, we found "3D printing with annealing" eliminates internal stress and increases the strength and stiffness of a printed piece. On the microstructural level, annealing reforms the crystalline structures to even out the areas of high and low stress, which created fewer weak areas. These results are very useful for making 3D printed products with a mechanical strength that is suitable for applications.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.81-88
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• 2020

In this paper, the performances of the electrical characteristics of the Fused Deposition Modeling (FDM) 3D-printed flexible resistance sensor was evaluated. The FDM 3D printing flexible resistive sensor is composed of flexible-material thermoplastic polyurethane and a conductive PLA (carbon black conductive polylactic acid) polymer. While 3D printing, polymer filaments heat up quickly before being extruded and cooled down quickly. Polymers have poor thermal conductivity so the heating and cooling causes unevenness, which then results in internal stress on the printed parts due to the rapidity of the heating and cooling. Electrical resistance measurements show that the 3D-printed flexible sensor is unstable due to internal stress, so the 3D-printed flexible sensor resistance curve does not match the increases and decreases in the displacement curve. Therefore, annealing was performed to eliminate the mismatch between electrical resistance and displacement. Annealing eliminates residual stress on the sensor, so the electrical resistance of the sensor increases and decreases in proportion to displacement. Additionally, the resistance is lowered in comparison to before annealing. The results of this study will be very useful for the fabrication of various devices that employ 3D-printed flexible sensor that have multiple degrees of freedom and are not limited by size and shape.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.1
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• pp.63-71
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• 2020

Recently, to improve convenience, flexible electronics are quickly being developed for a number of application areas. Flexible electronic devices comprise characters such as being bendable, stretchable, foldable, and wearable. Effectively manufacturing flexible electronic devices requires high efficiency, low costs, and simple processes for manufacturing technology. Through this study, we enabled the rapid production of multifunctional flexible bending sensors using a simple, low-cost Fused Deposition Modeling (FDM) 3D printer. Furthermore, we demonstrated the possibility of the rapid production of a range of functional flexible bending sensors using a simple, low-cost FDM 3D printer. Accurate and reproducible functional materials made by FDM 3D printers are an effective tool for the fabrication of flexible sensor electronic devices. The 3D-printed flexible bending sensor consisted of polyurethane and a conductive filament. Two patterns of electrodes (straight and Hilbert curve) for the 3D printing flexible sensor were fabricated and analyzed for the characteristics of bending displacement. The experimental results showed that the straight curve electrode sensor sensing ability was superior to the Hilbert curve electrode sensor, and the electrical conductivity of the Hilbert curve electrode sensor is better than the straight curve electrode sensor. The results of this study will be very useful for the fabrication of various 3D-printed flexible sensor devices with multiple degrees of freedom that are not limited by size and shape.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.5
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• pp.174-182
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• 2020

The printed electronics field using ink-jet printing technology is in the spotlight as a next-generation technology, especially ink-jet 3D printing, which can simultaneously discharge and precisely control various ink materials, has been actively researched in recent years. In this study, complex structure of an insulating layer and a conductive layer was fabricated with photo-curable silica ink and PVP-added Cu nano ink using ink-jet 3D printing technology. A precise photocured silica insulating layer was designed by optimizing the printing conditions and the rheological properties of the ink, and the resistance of the insulating layer was 2.43 × 10¹³ Ω·cm. On the photo-cured silica insulating layer, a Cu conductive layer was printed by controlling droplet distance. The sintering of the PVP-added nano Cu ink was performed using an IPL flash sintering process, and electrical and mechanical properties were confirmed according to the annealing temperature and applied voltage. Finally, it was confirmed that the resistance of the PVP-added Cu conductive layer was very low as 29 μΩ·cm under 100℃ annealing temperature and 700 V of IPL applied voltage, and the adhesion to the photo-cured silica insulating layer was very good.

• Korean Journal of Materials Research
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• v.30 no.7
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• pp.369-375
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• 2020

FDM 3D printing structures have rough surfaces and require post-treatment to improve the properties. Fumigation is a representative technique for removing surface unevenness. Surface treatment by fumigation proceeds by dissolving the surface of the protruding structure using a vaporized solvent. In this study, 3D printed PVB outputs are surface-treated with ethyl-alcohol fumigation. As the fumigation time increases, the surface flattens as ethanol dissolves the mountains on the surface of PVB and the surface valleys are filled with dissolved PVB. Through the fumigation process, the mechanical strength tends to decrease, and deformation rate increases. Ethanol vapor permeates into PVB, widening the distance between chains and resulting in weak bonding strength between chains. In order to confirm the effect of fumigation only, an annealing process is performed at 80 ℃ for 1, 5, 10, 30, and 50 minutes and the results of the fumigation are compared.

• Journal of IKEEE
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• v.26 no.4
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• pp.705-709
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• 2022

The effect of the annealing temperature of the poly(vinylidene fluoride-trifluoroethylene)(P(VDF-TrFE)) solid electrolyte layer on the electrical properties of the P(VDF-TrFE)-based memristor was analyzed. In morphological analyses, the P(VDF-TrFE) thin film with 200℃ annealing temperature (200P(VDF-TrFE)) was shown to have surface roughness ≈5 times larger and thickness ≈20% smaller than that with 100℃ annealing temperature (100P(VDF-TrFE)). Compared to the 100P(VDF-TrFE) memristor (M100), the set voltage of the 200P(VDF-TrFE) memristor (M200) decreased by ≈50% and the magnitude of its reset voltage increased by ≈30%. Moreover, M200 was found to have better memory retention characteristics than M100. These differences were attributed to relatively strong local electric fields inside M200 compared to M100. This study suggests the importance of the annealing temperature in polymer memristors.

• Journal of IKEEE
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• v.25 no.2
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• pp.322-329
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• 2021

In this study, a method for improving the light extraction efficiency of organic light emitting diodes was presented using the polymer Poly(vinylidenefluoride-co-trifluoroethylene) [P(VDF-TrFE)] having an island surface structure after annealing. Polydimethylsiloxane (PDMS) imprinted on the island-structured P(VDF-TrFE) surface has a spike structure, which improves the external light extraction efficiency aroud 20%. It was confirmed that the produced film showed a low haze characteristic of 8.2, and the Current and external quantum efficiency could be improved without pixel blur due to the excellent transmittance of 93.4%.

• Journal of IKEEE
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• v.27 no.1
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• pp.25-29
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• 2023

Effect of the processes of polysilazane solid electrolyte layer and silver (Ag) active electrode on the electrical characteristics of memristor was investigated. The memristor with the solid electrolyte annealed at higher temperature exhibited the higher set voltage and better memory retention characteristics than that annealed at lower temperature. The increase in the set voltage and the improvement of the memory retention characteristic at high annealing temperature were attributed to a reduction in the void density and an increase in the void uniformity inside the solid electrolyte, respectively. In the case where the polysilazane solution's concentration is high, the memristor exhibited rapid degradation of low resistive state even annealed at high temperature. Lastly, it was shown that the memristor with the solution-processed Ag active electrode showed WORM property unlike that with the vacuum-processed Ag active electrode. The WORM property was possibly due to morphological defects present in the solution-processed Ag active electrode.