• Journal of Dental Rehabilitation and Applied Science
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• v.33 no.4
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• pp.260-268
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• 2017

Purpose: Manufacturing with AM (Additive manufacturing) technique has many advantages; but, due to insufficient study in the area, it is not being widely used in the general clinic. In this study, differences of flexural strength among various materials of 3 unit fixed dental prosthesis were analyzed. Materials and Methods: A metal jig for specimens that had a 3-unit-fixed dental prosthesis figure were fabricated. The jigs were made appropriately to the specifications of the specimens. Three different kinds of materials of specimens which were NC (mathacrylic esther based), DP-1 (Bisphenol A epoxy acrylate type oligomer based), and DT-1 (urethane acrylate based) were printed with DLP machine. Five specimens for each kind of material were printed with an angle of $30^{\circ}$ from the horizontal surface. The specimens were placed on the jig and the flexural strength was measured and recorded using Universal testing machine. The recorded data was analyzed in SPSS using One-way ANOVA and Tukey HSD to determine the significance of the differences of flexural strength among the groups. Results: The flexural strengths of each group were the followings: NC, $1119{\pm}305$ N; DP-1, $619{\pm}150$ N; DT-1, $413{\pm}65N$. Using One-way ANOVA and Tukey Honestly Significant Difference test, significant difference was found between NC and the other groups (P < 0.05), but there was no significant difference between DP-1 and DT-1 (P > 0.05). Conclusion: Higher flexural strength was shown in 3-unit-fixed dental prosthesis that were 3D printed using a DLP machine with NC material.

• The Journal of the Korea Contents Association
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• v.20 no.5
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• pp.545-557
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• 2020

With the increasing interest on K-fashion all over the world, it's the important time to create the items which can express the unique identity of Korea for promoting the globalization of Korean fashion. Accordingly, this study aims to suggest the modern applicability of traditional patterns by designing the bags using the Dancheong patterns(traditional multi-colored decorative painting) which can effectively express Korean images in a variety of shapes and definite visual features and then expand the scope of fashion items. To this end, this study concentrated on expressing the Dancheong patterns to fit to the modern fashion trends by re-interpreting them. The bag was designed using the laser cutting technique, without weaving or digital printing, to imbue the technical emotion and 3D effect to the patterns. In accordance with the analysis results, the features of patterns could be delicately expressed around the shaping and structuring method in terms of the design, and the scope of design for leather goods could be expanded using the laser cutting in technical aspects. For the industrial aspects, it is required to develop differentiated goods expressing the unique emotion of the Korean for globalization of Korean design.

• Progress in Medical Physics
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• v.3 no.1
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• pp.71-78
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• 1992

This study describes the design of the biophysiological signal processing analyzer which can collect and analyze the biosignal raw data. System hardware is consisted of the IBM PC AT. pre-amplifier. AID converter, Counter/Timer. and RS-232C processor. Biophysiological signal data were processed by the software digital filter. FFT and graphic processing routine. The tachogram and FFT of the the peak to peak interval time was accomplished by the Graphic user interface software using the biophysiological signal processed data. Using this system. the powerspectrum of the heart rate variability during the long term could be observed. Experimental results of this system approach our purpose. which is improved the cost performance. easy to use. reducing raw-data noise and optimizing model for digital filter.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.6
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• pp.345-351
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• 2019

Recently, ink-jet printing technology has been applied for various industries such as semiconductor, display, ceramic tile decoration. Ink-jet printing has advantages of high resolution patterning, fast printing speed, high ink efficiency and many attempts have been made to apply functional materials with excellent physical and chemical properties for the ink-jet printing process. Due to these advantages, research scope of ink-jet printing is expanding from conventional two-dimensional printing to three-dimensional printing. In order to expand the application of ink-jet printing, it is necessary to optimize the rheological properties of the ink and the interaction with the substrate. In this study, photo curable ceramic complex ink containing nano silica particles were synthesized and its printability was characterized. Contact angle of the photo curable silica ink were modified by control of the ink composition and the surface property of the substrate. Effects of contact angle on printing resolution and three-dimensional printability were investigated in detail.

• Korean Journal of Optics and Photonics
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• v.23 no.1
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• pp.12-16
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• 2012

In the paper, we fabricated a Ni master with $45^{\circ}$-mirror structures for flexible waveguide fabrication. The flexible waveguide films with embedded $45^{\circ}$-angled mirrors at the waveguide ends were successfully fabricated using a UV-imprint process. Next, in order to enhance the reflectivity of the mirrors, Ni(3 nm)-Au(200 nm) bilayers were evaporated on the $45^{\circ}$-angled facets through a locally opened thin mask using an electron beam evaporator. We measured propagation loss, bending loss, mirror loss and bending reliability of the fabricated waveguide.

• Journal of Korea Water Resources Association
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• v.55 no.spc1
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• pp.1177-1185
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• 2022

The water and sewage system is an infrastructure that provides safe and clean water to people. In particular, since the water and sewage pipelines are buried underground, it is very difficult to detect system defects. For this reason, the diagnosis of pipelines is limited to post-defect detection, such as system diagnosis based on the images taken after taking pictures and videos with cameras and drones inside the pipelines. Therefore, real-time detection technology of pipelines is required. Recently, pipeline diagnosis technology using advanced equipment and artificial intelligence techniques is being developed, but AI-based defect detection technology requires a variety of learning data because the types and numbers of defect data affect the detection performance. Therefore, in this study, various defect scenarios are implemented using 3D printing model to improve the detection performance when detecting defects in pipelines. Afterwards, the collected images are performed to pre-processing such as classification according to the degree of risk and labeling of objects, and real-time defect detection is performed. The proposed technique can provide real-time feedback in the pipeline defect detection process, and it would be minimizing the possibility of missing diagnoses and improve the existing water and sewerage pipe diagnosis processing capability.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.