• Korean Journal of Radiology
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• v.22 no.9
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• pp.1525-1536
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• 2021

Objective: To investigate the feasibility of cine three-dimensional (3D) balanced steady-state free precession (b-SSFP) imaging combined with a non-local means (NLM) algorithm for image denoising in evaluating cardiac function in children with repaired tetralogy of Fallot (rTOF). Materials and Methods: Thirty-five patients with rTOF (mean age, 12 years; range, 7-18 years) were enrolled to undergo cardiac cine image acquisition, including two-dimensional (2D) b-SSFP, 3D b-SSFP, and 3D b-SSFP combined with NLM. End-diastolic volume (EDV), end-systolic volume (ESV), stroke volume (SV), and ejection fraction (EF) of the two ventricles were measured and indexed by body surface index. Acquisition time and image quality were recorded and compared among the three imaging sequences. Results: 3D b-SSFP with denoising vs. 2D b-SSFP had high correlation coefficients for EDV, ESV, SV, and EF of the left (0.959-0.991; p < 0.001) as well as right (0.755-0.965; p < 0.001) ventricular metrics. The image acquisition time ± standard deviation (SD) was 25.1 ± 2.4 seconds for 3D b-SSFP compared with 277.6 ± 0.7 seconds for 2D b-SSFP, indicating a significantly shorter time with the 3D than the 2D sequence (p < 0.001). Image quality score was better with 3D b-SSFP combined with denoising than with 3D b-SSFP (mean ± SD, 3.8 ± 0.6 vs. 3.5 ± 0.6; p = 0.005). Signal-to-noise ratios for blood and myocardium as well as contrast between blood and myocardium were higher for 3D b-SSFP combined with denoising than for 3D b-SSFP (p < 0.05 for all but septal myocardium). Conclusion: The 3D b-SSFP sequence can significantly reduce acquisition time compared to the 2D b-SSFP sequence for cine imaging in the evaluation of ventricular function in children with rTOF, and its quality can be further improved by combining it with an NLM denoising method.

• Proceedings of the IEEK Conference
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• 2003.07e
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• pp.2263-2266
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• 2003

Three-dimensional face recognition algorithm using curvature information representing characteristics of surface form is suggested. The experiment showed more than 90 percent of recognition for the noses which had definite change value of data, and contained much information about surface curvature. Recognition ratio using a contour taken from the remaining part other than the eyes, noses, mouths which are the main components of faces showed the important role, which could be used as the important index information in the three-dimensional face recognition.

• 유체기계공업학회:학술대회논문집
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• 2003.12a
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• pp.464-468
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• 2003

A general program of three dimensional profile design of impellers for centrifugal/fixed-flow compressors is successfully commercialized using Bezier curves and quasi-3D flow analysis methods. Control points for meridional hub and shroud contours and blade camberline angles are arbitrarily changed to give smooth Bezier curves. With specified blade normal thicknesses, contructed geometry is instantly analyzed using flow analysis methods to be checked.

• Journal of the Institute of Electronics Engineers of Korea SP
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• v.47 no.6
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• pp.1-9
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• 2010

In this paper, we propose an efficient compression method of the integral images. The integral imaging is a well-known technique to represent and record three-dimensional images. The proposed method is based on three dimensional discrete cosine transform (3D-DCT). The 3D-DCT techniques for the integral images have been reported as an efficient coding method for the integral images which reduces the redundancies between adjacent elemental images. The proposed method is a compression method efficient to integral images using adaptive block mode(ABM), based on the 3D-DCT technique. In the ABM, 3D-DCT blocks adaptive to the characteristics of integral images are constructed, which produces variable block size 3D-DCT blocks, and then 3D-DCTs for the 3D blocks are performed. Experimental results show that the proposed method gives significant improvement in coding efficiency. Especially, at the high bit-rates, the proposed method is more excellent since the overhead incurred by the proposed method take less part of the total bits.

• Archives of Plastic Surgery
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• v.47 no.5
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• pp.428-434
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• 2020

Background Three-dimensional (3D) model printing improves visualization of anatomical structures in space compared to two-dimensional (2D) data and creates an exact model of the surgical site that can be used for reference during surgery. There is limited evidence on the effects of using 3D models in microsurgical reconstruction on improving clinical outcomes. Methods A retrospective review of patients undergoing reconstructive breast microsurgery procedures from 2017 to 2019 who received computed tomography angiography (CTA) scans only or with 3D models for preoperative surgical planning were performed. Preoperative decision-making to undergo a deep inferior epigastric perforator (DIEP) versus muscle-sparing transverse rectus abdominis myocutaneous (MS-TRAM) flap, as well as whether the decision changed during flap harvest and postoperative complications were tracked based on the preoperative imaging used. In addition, we describe three example cases showing direct application of 3D mold as an accurate model to guide intraoperative dissection in complex microsurgical reconstruction. Results Fifty-eight abdominal-based breast free-flaps performed using conventional CTA were compared with a matched cohort of 58 breast free-flaps performed with 3D model print. There was no flap loss in either group. There was a significant reduction in flap harvest time with use of 3D model (CTA vs. 3D, 117.7±14.2 minutes vs. 109.8±11.6 minutes; P=0.001). In addition, there was no change in preoperative decision on type of flap harvested in all cases in 3D print group (0%), compared with 24.1% change in conventional CTA group. Conclusions Use of 3D print model improves accuracy of preoperative planning and reduces flap harvest time with similar postoperative complications in complex microsurgical reconstruction.

• Design & Manufacturing
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• v.6 no.1
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• pp.29-33
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• 2012

A 3D scanner scans and captures the shape of a real-world object. The captured shape can be used to construct three-dimensional model for CAD/CAM applications. In this study we have tried to design a cell phone cover by using the 3D scanner and reverse engineering. A 3D scanner is used to capture the shape of a cell phone. The 3D scanner generates a point cloud as the shape information. A three-dimensional CAD model for the cell phone is constructed from the point cloud. A cell phone cover is designed based on the CAD model of the cell phone. To check the integrity of this design process a prototype of the cover is made and assembled with the cell phone.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1424-1428
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• 2005

This paper describes a dedicated three-dimensional CAD system for design of drawing dies for automotive body panels. Since solid die models are useful not only for simulations for design verification, but also for NC tool path generation to machine dies and their Styrofoam patterns, 3-D CAD systems have been introduced in the tooling shop of automotive manufacturers. However, the work to build solid models requires a lot of time and effort if the designer uses only the general modeling capabilities of commercial 3-D CAD systems. To solve this problem, we customized a 3-D CAD system for the drawing die design. The system provides not only 3-D design capabilities, but also standard part libraries to enhance design productivity. By introducing this system, the drawing dies can be designed more rapidly in the 3-D space, and their solid data can be directly transferred to CAM tools for NC tool path generation and simulation tools for virtual manufacturing

• International Journal of CAD/CAM
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• v.6 no.1
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• pp.3-8
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• 2006

The application of three-dimensional (3-D) CAD has been popularized for design and production and digital manufacturing has been spreading in many industrial fields. By simulation of the production process using 3-D digital models, which are the core of CIM (Computer Integrated Manufacturing) system, the efficiency and safety of production are improved at each stage of work, and optimization of manufacturing can be achieved. This paper firstly describes the concept of "simulation based production" in shipbuilding and also digital manufacturing; the 3-D CAD system is indispensable for effective simulation because ship structure is three dimensionally complex. By simulation, "computer optimized manufacturing" can be possible. The most effective fields of simulation in shipbuilding are in jobs where many parties have to cooperate, while existing two-dimensional drawings are hardly observed the whole structures due to interference between structures or equipment of complex shape. In this paper some examples of the successful application in IHIMU (IHI Marine United Inc.) are shown: assembly of a pipe unit, erection of a complex hull block, carriage of equipment, installation of a propeller, and access in an engine room.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.55 no.1
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• pp.45-49
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• 2006

A nano-stereolithography (NSL) process has been developed for the fabrication of three-dimensional (3D) micro-devices with high spatital resolution of approximately 100 nm. In the NSL process, a complicated 3D structure can be created by stacking layer-by-layer, so it does not require any sacrificial layer or any supporting structure. A laminated layer was fabricated by means of solidifying liquid-state monomers using two-photon absorption (TPA) which was induced by a femtosecond laser. When the fabrication of a 3D stacked structure was finished, unsolidified liquid resins were rinsed by ethanol to develop the fabricated structures; then, the polymerized structure was only left on the glass substrate. Through this work, several 3D microstructures such as a micro-channel, shell structures, and photonic crystals were fabricated to evaluate the possibility of the developed system.

• Electronics and Telecommunications Trends
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• v.36 no.3
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• pp.12-22
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• 2021

Since the technical realization of self-aligned planar complementary metal-oxide-semiconductor field-effect transistors in 1960s, semiconductor manufacturing has aggressively pursued scaling that fruitfully resulted in tremendous advancement in device performances and realization of features sizes smaller than 10 nm. Due to many intrinsic material and technical obstacles, continuing the scaling progress of semiconductor devices has become increasingly arduous. As an effort to circumvent the areal limit, stacking devices in a three-dimensional fashion has been suggested. This approach is commonly called monolithic three-dimensional (M3D) integration. In this work, we examined technical issues that need to be addressed and overcome to fully realize energy efficiency, short latency and cost competency. Full-fledged M3D technologies are expected to contribute to various new fields of artificial intelligence, autonomous gadgets and unknowns, which are to be discovered.