• Proceedings of the Computational Structural Engineering Institute Conference
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• 2001.04a
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• pp.3-9
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• 2001

In this study, the geometric modeling has been conducted for the current lower end fitting and 2 candidates using three-dimensional solid modeler, Solidworks. Then, the three-dimensional stress analysis using the finite element method has been performed. The evaluation for the mechanical integrity of 2 candidates has been performed based on the stress distribution obtained from the finite element analysis.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.12
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• pp.43-50
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• 1993

Three-dimensional simulator for the ion implantation process is developed. The simulator based on an analytical model which would be a choice with high computational efficiency and accuracy. This is an important issue for the simulation of a numerous number of processing steps required in the fabrication of ULSI or GSI. The model can explain scattering and bulk channeling mechanism (1D). It can also explain depth dependent lateral diffusion effect(2D) and mask effect(3D). The model is consist of one-dimensional JPD(Joined Pearson Distribution) function and two-dimensional modified Gaussian functions. Final implanted profiles under typical mask structures such as hole, line and island structure are obtained with varying ion species.

• Nuclear Engineering and Technology
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• v.49 no.7
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• pp.1405-1413
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• 2017

To investigate the heat loads imposed on a reactor vessel through the natural convection of core melts in severe accidents, mass transfer experiments were performed based on the heat transfer/mass transfer analogy, using two- (2-D) and three-dimensional (3-D) facilities of various heights. The modified Rayleigh numbers ranged from $10^{12}$ to $10^{15}$, with a fixed Prandtl number of 2,014. The measured Nusselt numbers showed a trend similar to those of existing studies, but the absolute values showed discrepancies owing to the high Prandtl number of this system. The measured angle-dependent Nusselt numbers were analyzed for 2-D and 3-D geometries, and a multiplier was developed that enables the extrapolation of 2-D data into 3-D data. The definition of $Ra^{\prime}_H$ was specified for 2-D geometries, so that results could be extrapolated for 3-D geometries; also, heat transfer correlations were developed.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.12
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• pp.136-142
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• 2007

Precise fabrication of three-dimensional (3D) self-standing microstructures on thin glass plates via two-photon induced polymerization (TPP) has been an important issue for innovative 3D nanodevices and microdevices. However, there are still issues remaining to be solved, such as building 3D microstructures on opaque materials via TPP and being able to implant them as functional parts onto practical systems. To settle these issues simply and effectively, we propose a contact print lithography (CPL) method using an ultraviolet (UV)-curable polymer layer. We report some of the possibilities and potential of CPL by presenting our results for transplanting 3D microstructures onto large-area substrates and also our examination of some of the effects of the process parameters on successful transplantation.

• Korean Journal of Computational Design and Engineering
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• v.2 no.1
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• pp.35-43
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• 1997

Concurrent Engineering is one of the methods which are used for the rapid product development. One of the important features in Concurrent Egineering is that the development process is to be parallel and the organization should be cross-functional. In order that the process be parallel and that the organization be cross-functional, an integrated information system such as PDM (Product Data Management) is required. Although the integrated data base is constructed, it could be meaningless if the application softwares were not inter-operable. This study shows an example of intergrated information system from three-dimensional product design to mold design and tooling for the development of Deflection Yoke(DY) which is one of the important parts of Cathode Ray Tube(CRT). A three-dimensional product design software, which is based on a commercial code, has been developed by ourselves. Selective Laser Sintering(SLS), which is one of the rapid prototyping techniques, has been used in this study. Mold design has been done by the three-dimensional way. A newly developed method of mold tooling, which is called Quick Die Manufacturing(QDM), has been introduced.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.16 no.10 s.115
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• pp.1024-1035
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• 2006

A three-dimensional (3-D) method of analysis is presented for determining the free vibration frequencies and mode shapes of thick, complete (circumferentially closed), circular rings with an elliptical or circular cross-section. Displacement components $u_r,\;u_\theta\;and\;u_z$ in the radial, circumferential, and axial directions, respectively, are taken to be periodic in ${\theta}$ and in time, and algebraic polynomials in the r and z directions. Potential (strain) and kinetic energies of the circular rings are formulated, and upper bound values of the frequencies are obtained by minimizing the frequencies. As the degree of the polynomials is increased, frequencies converge to the exact values. Convergence to four-digit exactitude is demonstrated for the first five frequencies of the rings. Novel numerical results are presented for the circular rings having an elliptical cross-section based upon 3-D theory. Comparisons are also made between the frequencies from the present 3-D Ritz method and ones obtained from thin and thick ring theories, experiments, and another 3-D method.

• Investigative Magnetic Resonance Imaging
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• v.9 no.1
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• pp.24-29
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• 2005

Purpose : Instead of conventional two-dimensional (2-D) visual stimuli, three-dimensional (3-D) visual stimuli with stereoscopic vision were employed for the study of functional Magnetic Resonance Imaging (f-MRI). In this paper f-MRI with 3-D visual stimuli is investigated in comparison with f-MRI with 2-D visual stimuli. Materials and Methods : The anaglyph which generates stereoscopic vision by viewing color coded images with red-blue glasses is used for 3-D visual stimuli. Two-dimensional visual stimuli are also used for comparison. For healthy volunteers, f-MRI experiments were performed with 2-D and 3-D visual stimuli at 3.0 Tesla MRI system. Results : Occipital lobes were activated by the 3-D visual stimuli similarly as in the f-MRI with the conventional 2-D visual stimuli. The activated regions by the 3-D visual stimuli were, however, larger than those by the 2-D visual stimuli by $18\%$. Conclusion : Stereoscopic vision is the basis of the three-dimensional human perception. In this paper 3-D visual stimuli were applied using the anaglyph. Functional MRI was performed with 2-D and 3-D visual stimuli at 3.0 Tesla whole body MRI system. The occipital lobes activated by the 3-D visual stimuli appeared larger than those by the 2-D visual stimuli by about $18\%$. This is due to the more complex character of the 3-D human vision compared to 2-D vision. The f-MRI with 3-D visual stimuli may be useful in various fields using 3-D human vision such as virtual reality, 3-D display, and 3-D multimedia contents.

• Korean Journal of Acupuncture
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• v.25 no.4
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• pp.167-174
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• 2008

Objectives : Acupuncture points and meridians have been usually depicted as a two dimensional drawing and verbal description. Recently, imaging and three-dimensional image processing technologies have been introduced into medical fields such as anatomy and virtual operation, for the purpose of enhanced efficiency in research and education. This study attempted an image modelling of the meridian and acupoint in the upper limb region. Methods : A vector image model of an arm was produced and medical information on the meridian and acupoint of the arm region was incorporated. Results : A 3D modelling of the acupuncture meridian and acupoint in the upper limb region was produced along with a user console to control the presentation of related information and to facilitate visualization of the 3D model images. Conclusions : A 3D modelling of the acupuncture meridian and acupoint will be an efficient platform for an education and research.

• 한국전산유체공학회:학술대회논문집
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• 2010.05a
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• pp.404-411
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• 2010

The present paper deals with the continuous work of extending multi-dimensional limiting process (MLP), which has been quite successfully proposed on two- and three-dimensional structured grids, onto the unstructured grids. The basic idea of the present limiting strategy is to control the distribution of both cell-centered and cell-vertex physical properties to mimic a multi-dimensional nature of flow physics, which can be formulated as so called the MLP condition. The MLP condition can guarantee a high-order spatial accuracy without yielding spurious oscillations. Recently, MLP slope limiter was proposed based on the MUSCL-type reconstruction in two-dimensional case and it can be readily extended to three-dimensional case. Through various numerical analyses and extensive computations, it is observed that the proposed limiters are quite effective in controlling numerical oscillations and very accurate in capturing both discontinuous and continuous multi-dimensional flow features on 3-D tetrahedral grids.

• ETRI Journal
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• v.36 no.4
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• pp.643-653
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• 2014

To reduce interconnect delay and power consumption while improving chip performance, a three-dimensional integrated circuit (3D IC) has been developed with die-stacking and through-silicon via (TSV) techniques. The power supply problem is one of the essential challenges in 3D IC design because IR-drop caused by insufficient supply voltage in a 3D chip reduces the chip performance. In particular, power bumps and TSVs are placed to minimize IR-drop in a 3D power delivery network. In this paper, we propose a design methodology for 3D power delivery networks to minimize the number of power bumps and TSVs with optimum mesh structure and distribute voltage variation more uniformly by shifting the locations of power bumps and TSVs while satisfying IR-drop constraint. Simulation results show that our method can reduce the voltage variation by 29.7% on average while reducing the number of power bumps and TSVs by 76.2% and 15.4%, respectively.