• 제목/요약/키워드: 3-Terminal Electronic Device

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Bi-directional Two Terminal Switching Device based on SiGe for Spin Transfer Torque (STT) MRAM

  • Yang, Hyung-Jun;Kil, Gyu-Hyun;Lee, Sung-Hyun;Song, Yun-Heub
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.385-385
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    • 2012
  • A two terminal N+/P/N+ junction device to replace the conventional selective transistor was studied as a bilateral switching device for spin transfer torque (STT) MRAM based on 3D device simulation. An N+/P/N+ junction structure with $30{\times}30nm$ area requires bi-directional current flow enough to write a data by a drain induced barrier lowering (DIBL) under a reverse bias at N+/P (or P/N+ junction), and high current on/off ratio of 106. The SiGe materials are widely used in hetero-junction bipolar transistors, bipolar compensation metal-oxide semiconductors (BiCMOS) since the band gap of SiGe materials can be controlled by changing the fraction and the strain epilayers, and the drift mobility is increased with the increasing Ge content. In this work, N+/P/N+ SiGe material based junction provides that drive current is increased from 40 to $130{\mu}A$ by increased Ge content from 10~80%. When Ge content is about 20%, the drive current density of SiGe device substantially increased to 2~3 times better than Si-based junction device in case of 28 nm P length, which is sufficient current to operation of STT-MRAM.

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Design and Simulation Study on Three-terminal Graphene-based NEMS Switching Device (그래핀 기반 3단자 NEMS 스위칭 소자 설계 및 동작 시뮬레이션 연구)

  • Kwon, Oh-Kuen;Kang, Jeong Won;Lee, Gyoo-Yeong
    • Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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    • v.8 no.6
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    • pp.939-946
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    • 2018
  • In this work, we present simple schematics for a three-terminal graphene-based nanoelectromechanical switch with the vertical electrode, and we investigated their operational dynamics via classical molecular dynamics simulations. The main structure is both the vertical pin electrode grown in the center of the square hole and the graphene covering on the hole. The potential difference between the bottom gate of the hole and the graphene of the top cover is applied to deflect the graphene. By performing classical molecular dynamic simulations, we investigate the nanoelectromechanical properties of a three-terminal graphene-based nanoelectromechanical switch with vertical pin electrode, which can be switched by the externally applied force. The elastostatic energy of the deflected graphene is also very important factor to analyze the three-terminal graphene-based nanoelectromechanical switch. This simulation work explicitly demonstrated that such devices are applicable to nanoscale sensors and quantum computing, as well as ultra-fast-response switching devices.

Study on Current Switching in Electronic Devices Based on Vanadium Dioxide Thin Films Using CO2 Laser (이산화탄소 레이저를 이용한 바나듐 이산화물 박막 전자 소자에서의 전류 스위칭에 관한 연구)

  • Kim, Jihoon;Lee, Yong Wook
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.30 no.1
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    • pp.1-7
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    • 2016
  • With a collimated $CO_2$ laser beam, the bidirectional current switching was realized in a two-terminal electronic device based on a highly resistive vanadium dioxide($VO_2$) thin film. A $VO_2$ thin film was grown on a $Al_2O_3$ substrate by a pulsed laser deposition method. For the fabrication of a two-terminal electronic device, the $VO_2$ thin film was etched by an ion beam-assisted milling method, and the $VO_2$ device, of which $VO_2$ patch width and electrode separation were 50 and $100{\mu}m$, respectively, was fabricated through a photolithographic method. A bias voltage range for stable bidirectional current switching was found by using the current-voltage property of the device measured in a current-controlled mode. The transient responses of bidirectionally switched currents were analyzed when the laser was modulated at a variety of pulse widths and repetition rates. A switching contrast was measured as ~3333, and rising and falling times were measured as ~39 and ~21ms, respectively.

Bi-directional Two Terminal Switching Device with Metal/P/N+or Metal/N/P+ Junction

  • Kil, Gyu-Hyun;Lee, Sung-Hyun;Yang, Hyung-Jun;Lee, Jung-Min;Song, Yun-Heub
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.386-386
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    • 2012
  • We studied a bilateral switching device for spin transfer torque (STT-MRAM) based on 3D device simulation. Metal/P/N+or Metal/N/P+ junction device with $30{\times}30nm2$ area which is composed of one side schottky junction at Metal/P/N+ and Metal/N/P+ provides sufficient bidirectional current flow to write data by a drain induced barrier lowering (DIBL). In this work, Junction device confirmed that write current is more than 30 uA at 2 V, It is also has high on-off ratio over 105 under read operation. Junction device has good process feasibility because metal material of junction device could have been replaced by bottom layer of MTJ. Therefore, additional process to fabricate two outer terminals is not need. so, it provides simple fabrication procedures. it is expected that Metal/P/N+ or Metal/N/P+ structure with one side schottky junction will be a promising switch device for beyond 30 nm STT-MRAM.

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Bonding Property and Reliability for Press-fit Interconnection (Press-fit 단자 접합특성 및 신뢰성)

  • Oh, Sangjoo;Kim, Dajung;Hong, Won Sik;Oh, Chulmin
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.3
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    • pp.63-69
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    • 2019
  • Soldering technology has been used in electronic industry for a long time. However, due to solder fatigue characteristics, automotive electronics are searching the semi-permanent interconnection technology such as press-fit method. Press fit interconnection is a joining technology that mechanically inserts a press fit metal terminal into a through hole in a board, and induces a strong bonding by closely contacting the inner surface joining of the through hole by plastic deformation of press-fit terminal. In this paper, the bonding properties of press-fit interconnection are investigated with PCB hole size and surface finishes. In order to compare interconnection reliability between the press fit and soldering, the change in resistance of the press-fit and soldering joints was observed during thermal shock test. After thermal cycling, the failure modes are investigated to reveal the degradation mechanism both press-fit and soldering technology.

Design of RF Receiver using Independent-Gate-Mode Double-Gate MOSFET (Independent-Gate-Mode Double-Gate MOSFET을 이용한 RF Receiver 설계)

  • Jeong, Na-Rae;Kim, Yu-Jin;Yun, Ji-Sook;Park, Sung-Min;Shin, Hyung-Soon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.10
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    • pp.16-24
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    • 2009
  • Independent-gate-mode double-gate(IGM-DG) MOSFET overcomes the limitation of 3-terminal device structure, and enables to operate with different voltages for front-gate and back-gate. Therefore, circuit designs becomes not only simple, but also area-efficient due to the controllability of the 4th terminal provided by IGM-DG MOSFETs. In this paper, an RF receiver utilizing IGM-DG MOSFETs is presented and also, the circuit performance is verified by the HSPICE simulations. Besides, the circuit analysis and optimization are performed for various IGM-DG characteristics.

A High Performance Harmonic Mixer Using a plastic packaged device

  • Kim, Jae-Hyun;Go, Min-Ho;Park, Hyo-Dal;Shin, Hyun-Sik
    • The Journal of the Korea institute of electronic communication sciences
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    • v.2 no.1
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    • pp.1-9
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    • 2007
  • In this paper, a third-order harmonic mixer is designed using frequency multiplier theory for the Ka-band. The gate bias voltage is selected by frequency multiplier theory to maximize the third-order harmonic element ofthe fundamental LO frequency in the proposed mixer. The designed mixer has a gate mixer structure composed of a gate terminal input for the fundamental local signal ($f_{LO}$), RF signal (${RF}$) and a drain terminal output for the harmonic frequency ($3f_{LO}-f_{RF}$) respectively. The Ka-band harmonic mixer is designed and fabricated using a commercial GaAs MESFET device with a plastic package. The proposed mixer will provide a solution for the problems found in the high cost, complex circuitry in a conventional Ka-band mixer. The 33.5 GHz harmonic mixer has a -10 dB conversion gain by pumping 11.5 GHz LO with a +5 dBm level.

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Study on 3-dimension Image Process based on Organic light Emitting Diode (유기발광소자 (Organic Light Emitting Diode)를 이용한 3차원 영상에 대한 연구)

  • Lee, Jung-Ho
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.497-499
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    • 2005
  • A portable terminal assistant market grows rapidly every year and it requires many change in research on display devices. Among many newly developing methods, OLED(Organic Light Emitting Diode) is considered an advanced flat display device because its excellent characteristics, including high speed response, full color performance, low power consumption and flux of panel. However changes in the market of display shows that the market will require 3-dimensional images, but it is hard for existing 2-dimensional displays to make 3-dimensional images. Therefore we will try to find various methods such as holograms. In this paper, we will show existing flat displays can make 3-dimensional images by applying Lenticular Screen printing techniques on the organic semiconductor display device.

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A Study on the Design and Implementation of the private u-Terminal for the new ITS Service (신규 ITS 서비스를 위한 전용 u-단말기 설계 및 구현에 관한 연구)

  • Kim, Joeng-Hoon;Kim, Su-Sun
    • 한국ITS학회:학술대회논문집
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    • 2008.11a
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    • pp.519-524
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    • 2008
  • In this paper, we mainly describe the development of exclusive u-device essentially required to implement new ITS services (taxi call service, service for transportation vulnerable, transport information service, walker's navigator, electronic payment service, call information service etc.). To design this device, Samsung main CPU S3C2440A was selected and large memories (ROM and RAM) which are required for new ITS services are applied. In addition, all of GPS, RFID module, Wi-Fi and Bluetooth functions are included to develop an exclusive device indispensable in the ubiquitous society. For this, in this paper, we first examined detailed design of an exclusive u-device development, and based on the designed contents, the performance of a realized u-device was evaluated. If services are created by linking new ITS services with relevant public institutions or companies, based on application of the exclusive u-device developed as above, they would be expanded to a new blue ocean, expectedly resulting in a big spillover effect in local societies.

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Electrical Characteristics of 1,200 V Reverse Conducting-IGBT (1,200 V Reverse Conducting IGBT의 전기적 특성 분석)

  • Kim, Se Young;Ahn, Byoungsub;Kang, Ey Goo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.33 no.3
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    • pp.177-180
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    • 2020
  • This paper focuses on the 1,200-V level reverse conducting-insulated gate bipolar transistor (RC-IGBT). The structure of the RC-IGBT has an n+ collector at the collector terminal. The breakdown voltage, Vth, Vce-sat, and turn-off time, and the electrical characteristics of a field-stop IGBT (FS-IGBT) and RC-IGBT are compared and analyzed using simulations. Based on the results, the RC-IGBT obtained a turn-off time of 320.6 ㎲ and a breakdown voltage of 1,720 V, while the FS-IGBT obtained a turn-off time of 742.2 ㎲ and a breakdown voltage of 1,440 V. Therefore, RC-IGBTs have faster on/off transitions and a higher breakdown voltage, which can reduce the size of the element.