• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.1
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• pp.39-46
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• 2001

When designing a gear, designers determine basic dimensions of a gear with transmitted power considering strength, interference and so on. But, designers can not easily obtain the tooth profile generated by dimensions as well as the geometry of generating hob for cutting the tooth profile. In order to resolve these problems, an automatic design system creating not only the solid model of a gear but also that of the generating hob using the design parameters of dimensions is developed. Through the developed system, designers system, designers can improve the efficiency of design and satisfy the variable requirements of design as well. In this research, the three-dimensional solid models for spur and helical gears are generated considering the design parameters. Besides, those for generating hob regarding the design parameters of hob is created automatically. The system is developed by using Visual Basic and its three-dimensional geometric modeling module is constructed by using SolidWorks.

• Transactions of Materials Processing
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• v.9 no.3
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• pp.233-241
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• 2000

It is well known that the quality and efficiency of the design of metal forming processes can be significantly improved with the aid of effective numerical simulations. In the present study, a two-and three-dimensional finite element simulation system, CAMP form, was developed for the analysis of metal forming processes in the PC environment. It is composed of a solver based on the thermo-rigid-viscoplastic approach and graphic user interface (GUI) based pre-and post-processors to be used for the effective description of forming conditions and graphic display of simulation results, respectively. In particular, in the case of CAMPform 2D (two-dimensional), as the solver contains an automatic remeshing module which determines the deformation step when remeshing is required and reconstructs the new mesh system, it is possible to carry out simulations automatically without any user intervention. Also, the forming analysis considers ductile fracture of the workpiece and wear of dies for better usage of the system. In the case of CAMPform 3D, general three-dimensional problems that involve complex die geometries and require remeshing can be analyzed, but full automation of simulations has yet to be achieved. In this paper, the overall structure and computational background of CAMPform will be briefly explained and analysis results of several forming processes will be shown. From the current results, it is construed that CAMPform can be used in providing useful information to assist the design of forming processes.

• Journal of the Korean institute of surface engineering
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• v.53 no.4
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• pp.160-168
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• 2020

A polymer-based carbon nanomaterial composite was fabricated and characterized for the application of a thermal conductive adhesive. Low-dimensional carbon nanomaterials with excellent thermal conductivity such as carbon nanotube (CNT) and graphene were selected as a filler in the composite. Thermal, electrical and adhesive properties of the composite were investigated with respect to the morphology and content of the low-dimensional carbon nanomaterials. As a result, the composite-based adhesive fabricated by the loading of surface-treated MWCNTs of 0.4 wt% showed uniform dispersion, moderate adhesion and effective heat dissipation properties. Finally, it was confirmed through the thermal image analysis of LED module that the temperature reduction of 10℃ was achieved using the fabricated composite adhesive with MWCNT-6A. Expecially, heat dissipation performance of the optimized composite adhesive was evident at the hot spot in the module compared to other samples mixed with graphene or different MWCNT loading ratios.

• Journal of the Korea Fashion and Costume Design Association
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• v.25 no.4
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• pp.123-132
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• 2023

The term 'module' is an architectural term. It refers to the components or systems that make up a finished product. As industries develop, modules have become one of the methods that can create diverse and creative designs. Traditional modular fashion design mainly focused on structural methods, such as the combination, assembly, overlap, and arrangement of modules, as well as the tessellation of geometric shapes. However, in this paper, significance lies in exploring the application of shape grammar, a design method in architecture, to fashion design. It aims to search for ways to express three-dimensional designs, derive designs that can be worn and produced, and propose fashion design by applying the rules of shape grammar to the design process. Through this analysis, the paper aims to examine the methods and characteristics of shape grammar. The research method of this paper is as follows. First, by utilizing optimized programs for implementing the modules of shape grammar, it was possible to propose a method for producing modules of shape grammar and suggest module designs. Additionally, effective methods of representation using the Clo 3D program were explored in the design development process. Second, by applying shape grammar to the fashion design process, five-dimensional modular fashion designs were proposed, including a bolero, dress 1, dress 2, setup, and coat. The proposed modular fashion design using shape grammar in this paper provides a rational design process that differentiates itself from traditional modular fashion design. By formalizing the shapes between modules and creating rules, it overcomes the limitations of design that rely on the designer's intuition or sensibility and enables the development of more diverse modular fashion designs. This application of shape grammar in fashion design can provide an important direction in exploring a sustainable fashion industry.

• Journal of the Optical Society of Korea
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• v.10 no.3
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• pp.124-129
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• 2006

We have developed a compact and cost-effective camera module on the basis of wafer-scale-replica processing. A multiple-layered structure of several aspheric lenses in a mobile-phone camera module is first assembled by bonding multiple glass-wafers on which 2-dimensional replica arrays of identical aspheric lenses are UV-embossed, followed by dicing the stacked wafers and packaging them with image sensor chips. This wafer-scale processing leads to at least 95% yield in mass-production, and potentially to a very slim phone with camera-module less than 2 mm in thickness. We have demonstrated a VGA camera module fabricated by the wafer-scale-replica processing with various UV-curable polymers having refractive indices between 1.4 and 1.6, and with three different glass-wafers of which both surfaces are embossed as aspheric lenses having $230{\mu}m$ sag-height and aspheric-coefficients of lens polynomials up to tenth-order. We have found that precise compensation in material shrinkage of the polymer materials is one of the most technical challenges, in orderto achieve a higher resolution in wafer-scaled lenses for mobile-phone camera modules.

• Journal of Ship and Ocean Technology
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• v.4 no.3
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• pp.13-20
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• 2000

In recent years, a number of successful nesting approaches have been developed by using the various heuristic algorithms, and due to their application potential several commercial CAD/CAM packages include a nesting module for solving the layout problems. Since a large portion of the complexity of the part nesting problem results from the overlapping computation, the geometric representation is one of the most important factors to reduce the complexity of the problem. The proposed part representation method can easily handle parts and raw materials with widely varying geometrical shape by using the redesigning modules. This considerably reduces the amount of processed data and consequently the run time of the computer. The aim of this research is to develop parametric macro for two-dimensional layout on the Auto-CAD system. Therefore, this research can be called "pre-nesting".ing".uot;.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.12
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• pp.24-28
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• 2000

This paper reports a new calculation method of three dimensional deposeition rate by level set method. To model an advancement of the surface efficiently, we have developed a new iteration method to re-initialize the level set function. For calculating etching and deposition rate by direct flow, we have developed a visibility test module and a refraction and re-sputtering model. Sputter deposition rate with shadow effect and surface refraction is calculated. We report that difference of profiles in cases that sticking coefficient are 1.0 and 0.3. We report that the difference of the deposition rate on bottom of the hole is caused by a difference of visible angle by the shadowing effect.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1047-1055
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• 2006

We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.44 no.9
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• pp.825-832
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• 2016

This paper describes the development of a data bus analyzer for use in avionics systems integration test. The data bus analyzer is equipped with MIL-STD-1553B, CAN and Ethernet interface cards which is incorporated in a majority of the avionics systems to accommodate a variety of interfaces. It has an individual hardware for a capture engine and a analyzing engine in order to perform the collection and the analysis of the bus data at the same time efficiently. It provides a data display function of the grid, 2-dimensional and 3-dimensional form to increase the data analysis efficiency. Verification of the data bus analyzer was carried out module unit testing and inter-module integration testing on the basis of the test procedures. Verification of interlocking requirement and usefulness of developed equipment was confirmed through an integration test result performed on a system integration laboratory of aircraft which is an actual testing environment.

• Journal of applied mathematics & informatics
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• v.40 no.5_6
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• pp.1137-1150
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• 2022

Consider the quantum algebra U_q(sl₂) over field 𝓕 (char(𝓕) = 0) with equitable generators x^±1, y and z, where q is fixed nonzero, not root of unity scalar in 𝓕. Let V denote a finite dimensional irreducible module for this algebra. Let Λ ∈ End(V), and let {A₁, A₂, A₃} = {x, y, z}. First we show that if Λ, A₁ is a Leonard pair, then this Leonard pair have four types, and we show that for each type there exists a Leonard pair Λ, A₁ in which Λ is a linear combination of 1, A₂, A₃, A₂A₃. Moreover, we use Λ to construct 𝚼 ∈ U_q(sl₂) such that 𝚼, A^-1₁ is a Leonard pair, and show that 𝚼 = I + A₁Φ + A₁ΨA₁ where Φ and Ψ are linear combination of 1, A₂, A₃.