• Title/Summary/Keyword: 3-D Integration

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THE DESIGN OF DGPS/INS INTEGRATION FOR IMPLEMENTATION OF 4S-Van (4S-Van 구현을 위한 DGPS/INS 통합 알고리즘 설계)

  • 김성백;이승용;김민수;이종훈
    • Journal of Astronomy and Space Sciences
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    • v.19 no.4
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    • pp.351-366
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    • 2002
  • In this study, we developed low cost INS and (D)GPS integration for continuous attitude and position and utilized it for the determination of exterior orientation parameters of image sensors which are equipped in 4S-Van. During initial alignment process, the heading information was extracted from twin GPS and fine alignment with Kalman filter was performed for the determination of roll and pitch. Simulation and van test were performed for the performance analysis. Based on simulation result, roll and pitch error is around 0.01-0.03 degrees and yaw error around 0.1 degrees. Based on van test, position error in linear road is around 10 cm and curve around 1 m. Using direct georeferencing method, the image sensor's orientation and position information can be acquired directly from (D)GPS/INS integration. 4S-Van achieved 3D spatial data using (D)GPS/INS and image data can be applied to the spatial data integration and application such as contemporary digital map update, road facility management and Video GIS DB.

Effect of Si Wafer Ultra-thinning on the Silicon Surface for 3D Integration (삼차원 집적화를 위한 초박막 실리콘 웨이퍼 연삭 공정이 웨이퍼 표면에 미치는 영향)

  • Choi, Mi-Kyeung;Kim, Eun-Kyung
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.2
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    • pp.63-67
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    • 2008
  • 3D integration technology has been a major focus of the next generation of IC industries. In this study Si wafer ultra-thinning has been investigated especially for the effect of ultra-thinning on the silicon surface. Wafers were grinded down to $30{\mu}m\;or\;50{\mu}m$ thickness and then grinded only samples were compared with surface treated samples in terms of surface roughness, surface damages, and hardness. Dry polishing or wet etching treatment has been applied as a surface treatment. Surface treated samples definitely showed much less surface damages and better roughness. However, ultra-thinned Si samples have the almost same hardness as a bulk Si wafer.

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Investigation of Growth Mechanism of Polymer, Ceramic and Metal Thick Films in Aerosol Deposition Method (Aerosol Deposition Method에 있어서 금속, 폴리머, 세라믹 후막의 성장 메커니즘 고찰)

  • Lee, Dong-Won;Nam, Song-Min
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.346-346
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    • 2008
  • 최근 디지털 컨버젼스에 의해서 정보 단말기 network가 디지털 기술을 기반으로 유기적으로 융 복합화 되고 있으며 BT, NT, ET, IT의 융합 기술의 필요성이 점차적으로 증대되고 있다. 이러한 환경 하에서 다양한 정보 및 서비스의 송신 및 수신이 가능한 휴대 단말기의 필요성에 부응하여 기존의 전화 기능, 카메라, DMB 이외에도 홈 네트워크, mobile internet 등 더욱 다양한 기능들이 요구되고 있다. 종래에는 수동 부품과 능동 부품의 실장을 별개로 추진했으나 최근에는 수동 및 능동 부품을 하나의 패키지 내에 실장 가능하도록 하는 3-D Integration을 추진하고 있다. 지금까지 여러 부품들을 실장 시키기 위한 공정들의 대부분은 높은 온도에서 공정이 이루어졌으나 여러 부품들을 손상 없이 집적화하고 실장하기 위해서는 저온화 공정이 필요하다. 최근 많은 저온 공정 중에서 Aerosol Deposition Method는 상온에서 세라믹 후막을 성막할 수 있어 가장 주목받고 있는 공정중의 하나이다. 본 연구에서는 3-D Integration을 실현하기 위해 이종 접합에 유리하고 상온에서 성막 공정이 이루어지는 Aerosol Deposition Method를 이용하여 금속 기판 위에 금속, 폴리머, 세라믹 후막을 성막시켰다. 기판 재료로는 Cu 기판을 사용하였으며 출발 파우더로는 Polyimide 파우더와 $Al_2O_3$ 파우더, Ag 파우더를 사용하였으며 이종 접합간의 메커니즘의 양상을 보기 위해 같은 조건에서 이종 접합간의 성막률을 비교하였으며 FE-SEM으로 미세 구조를 관찰하였다. 또한 기판의 표면 거칠기에 따른 메커니즘의 양상을 연구하였다.

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Fast Structure Recovery and Integration using Improved Scaled Orthographic Factorization (개선된 직교분해기법을 사용한 빠른 구조 복원 및 융합)

  • Park, Jong-Seung;Yoon, Jong-Hyun
    • Journal of Korea Multimedia Society
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    • v.10 no.3
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    • pp.303-315
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    • 2007
  • This paper proposes a 3D structure recovery and registration method that uses four or more common points. For each frame of a given video, a partial structure is recovered using tracked points. The 3D coordinates, camera positions and camera directions are computed at once by our improved scaled orthographic factorization method. The partially recovered point sets are parts of a whole model. A registration of point sets makes the complete shape. The recovered subsets are integrated by transforming each coordinate system of the local point subset into a common basis coordinate system. The process of shape recovery and integration is performed uniformly and linearly without any nonlinear iterative process and without loss of accuracy. The execution time for the integration is significantly reduced relative to the conventional ICP method. Due to the fast recovery and registration framework, our shape recovery scheme is applicable to various interactive video applications. The processing time per frame is under 0.01 seconds in most cases and the integration error is under 0.1mm on average.

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Integration of Products and Services of Korean Firms and Innovation Policy Directions

  • Jang, Pyoung Yol
    • STI Policy Review
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    • v.3 no.2
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    • pp.111-129
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    • 2012
  • The integration of products and services is being expanded in both manufacturing and service companies such as in Apple's iPod & iTunes, Amazon's Kindle, and Hyundai Motor Company's Mozen. This phenomenon has recently accelerated due to multiple factors including market change, lessening of differences in quality of products or services, the paradigm of participation and sharing, and deindustrialization and evolution toward becoming a service economy. The objective of this paper is to investigate and analyze the status and characteristics of integration of products and services in Korean firms and to suggest policy directions promoting this integration. Towards this purpose, income statements from the Korea Listed Companies Association (KLCA) database of companies listed on the Korea Stock Exchange are analyzed regarding the servitization of manufacturing firms as well as the productization of service firms. In addition, this research investigates the Korean Innovation Survey 2011 database for the service sector and 2010 database for the manufacturing sector in order to evaluate R&D activity in each. In the manufacturing sector, the average ratio of service sales (servitization) was low at 0.208, with bias in the level and distribution of ratios associated with the manufacturing sector. 18 out of a total of 23 sectors (78%) have low servitization, showing there's a long way to go for servitization in the Korean manufacturing sector. In the service sector, the average ratio of product sales (productization) was 9.53%, which is relatively high compared to that of the manufacturing sector. However, the distribution of ratios is also biased, as with the manufacturing sector. Based on this analysis, policy directions are proposed in terms of 1) R&D, 2) concept boost, 3) R&D result spread, 4) statistics, 5) infrastructure and 6) green growth.

A Survey for the Development of a 3D Printing Related Course in Fashion Design Department (3D 프린팅 관련 교과목 개발을 위한 기초 연구 - 전문대학 패션디자인과를 중심으로 -)

  • Jeong, Hwa-Yeon
    • Journal of the Korea Fashion and Costume Design Association
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    • v.19 no.3
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    • pp.33-47
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    • 2017
  • The purpose of this study is to provide fundamental data for the development of new course on 3D printing in the fashion design department. In order to investigate the perception of and educational needs in 3D printing, the data were collected from 266 students (female 68.8%, male 31.2%) majoring in fashion design aged 18-25 living in the capital area. The results of this survey showed that when investigating perceptions of 3D printing, it was found that 68.8% of answerers had indeed heard of 3D printing. Regarding the path they came to know about 3D printing, mass media such TV was the most frequent answer (54.6%). On the other hand, to the question asking about their intention to take the subject if given, approximately 71% said "Yes". Also, if a modeling class were given, the division that they wanted to explore most in the fashion industry was fashion jewelry. Finally, to the question asking interest in starting a business, 71.1% answered that they had interest. Out of those that answered that they had interest, when questioned about in which field they wanted to start a business, the most frequent answer was fashion online shopping mall. Finally, NCS-based 3D printing courses were suggested in the Fashion Design area. As 3D printing techniques are actively applied to the fashion industry overseas, creative education is needed through the integration of fashion and 3D printing technology by introducing 3D printing related programs in colleges.

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Three-dimensional geostatistical modeling of subsurface stratification and SPT-N Value at dam site in South Korea

  • Mingi Kim;Choong-Ki Chung;Joung-Woo Han;Han-Saem Kim
    • Geomechanics and Engineering
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    • v.34 no.1
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    • pp.29-41
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    • 2023
  • The 3D geospatial modeling of geotechnical information can aid in understanding the geotechnical characteristic values of the continuous subsurface at construction sites. In this study, a geostatistical optimization model for the three-dimensional (3D) mapping of subsurface stratification and the SPT-N value based on a trial-and-error rule was developed and applied to a dam emergency spillway site in South Korea. Geospatial database development for a geotechnical investigation, reconstitution of the target grid volume, and detection of outliers in the borehole dataset were implemented prior to the 3D modeling. For the site-specific subsurface stratification of the engineering geo-layer, we developed an integration method for the borehole and geophysical survey datasets based on the geostatistical optimization procedure of ordinary kriging and sequential Gaussian simulation (SGS) by comparing their cross-validation-based prediction residuals. We also developed an optimization technique based on SGS for estimating the 3D geometry of the SPT-N value. This method involves quantitatively testing the reliability of SGS and selecting the realizations with a high estimation accuracy. Boring tests were performed for validation, and the proposed method yielded more accurate prediction results and reproduced the spatial distribution of geotechnical information more effectively than the conventional geostatistical approach.

Design of an Integrated Inductor with Magnetic Core for Micro-Converter DC-DC Application

  • Dhahri, Yassin;Ghedira, Sami;Besbes, Kamel
    • Transactions on Electrical and Electronic Materials
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    • v.17 no.6
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    • pp.369-374
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    • 2016
  • This paper presents a design procedure of an integrated inductor with a magnetic core for power converters. This procedure considerably reduces design time and effort. The proposed design procedure is verified by the development of an inductor model dedicated to the monolithic integration of DC-DC converters for portable applications. The numerical simulation based on the FEM (finite elements method) shows that 3D modeling of the integrated inductor allows better estimation of the electrical parameters of the desired inductor. The optimization of the electrical parameter values is based on the numerical analysis of the influence of the geometric parameters on the electrical characteristics of the inductor. Using the VHDL-AMS language, implementation of the integrated inductor in a micro Buck converter demonstrate that simulation results present a very promising approach for the monolithic integration of DC-DC converters.

Generalized Integration Operator between the Bloch-type Space and Weighted Dirichlet-type Spaces

  • Ardebili, Fariba Alighadr;Vaezi, Hamid;Hassanlou, Mostafa
    • Kyungpook Mathematical Journal
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    • v.60 no.3
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    • pp.519-534
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    • 2020
  • Let H(𝔻) be the space of all holomorphic functions on the open unit disc 𝔻 in the complex plane ℂ. In this paper, we investigate the boundedness and compactness of the generalized integration operator $$I^{(n)}_{g,{\varphi}}(f)(z)=\normalsize\displaystyle\smashmargin{2}{\int\nolimits_0}^z\;f^{(n)}({\varphi}({\xi}))g({\xi})\;d{\xi},\;z{\in}{\mathbb{D}},$$ between Bloch-type and weighted Dirichlet-type spaces, where 𝜑 is a holomorphic self-map of 𝔻, n ∈ ℕ and g ∈ H(𝔻).

Development of World's Largest 21.3' LTPS LCD using Sequential Lateral Solidification(SLS) Technology

  • Kang, Myung-Koo;Kim, Hyun-Jae;Chung, Jin-Koo;Kim, Dong-Beom;Lee, Su-Kyung;Kim, Cheol-Ho;Chung, Woo-Seok;Hwang, Jang-Won;Joo, Seung-Yong;Meang, Ho-Seok;Song, Seok-Chun;Kim, Chi-Woo;Chung, Kyu-Ha
    • Journal of Information Display
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    • v.4 no.4
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    • pp.4-7
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    • 2003
  • The world largest 21.3" LTPS LCD has been successfully developed using SLS crystallization technology. Integration of gate circuit, transmission gate and level shifter was successfully performed in a large area display. Uniform and high performance of high quality grains of SLS technology make it possible to realize a uniform large size LTPS TFT-LCD with half the number of data driver IC's that is typically used in a-Si LCD. High aperture ratio of 65 % was achieved using an organic inter insulating method which lead to a high brightness of 500 cd/$cm^2$.