• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.7
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• pp.39-46
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• 2016

This paper describes the third order feedforward delta-sigma modulator with inverter-based integrators and a 1.5bit comparator for the application of audio signal processing. The proposed 3rd-order delta-sigma modulator is multi-bit structure using 1.5 bit comparator instead of operational amplifier. This delta-sigma modulator has high SNR compared with single-bit 4th-order delta-sigma modulator in a low OSR. And it minimizes power consumes and simplified circuit structure using inverter-based integrator and using inverter-based integrator as analogue adder. The modulator was designed with 0.18um CMOS standard process and total chip area is $0.36mm^2$. The measured power cosumption is 28.8uW in a 0.8V analog supply and 66.6uW in a 1.8V digital supply. The measurement result shows that the peak SNDR of 80.7 dB, the ENOB of 13.1bit and the dynamic range of 86.1 dB with an input signal frequency of 2.5kHz, a sampling frequency of 2.56MHz and an oversampling rate of 64. The FOM (Walden) from the measurement result is 269 fJ/step, FOM (Schreier) was calculated as 169.3 dB.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.11 s.353
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• pp.58-68
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• 2006

This work proposes a 10b 250MS/s $1.8mm^2$ 85mW 0.13um CMOS A/D Converter (ADC) for high-performance integrated systems such as next-generation DTV and WLAN simultaneously requiring low voltage, low power, and small area at high speed. The proposed 3-stage pipeline ADC minimizes chip area and power dissipation at the target resolution and sampling rate. The input SHA maintains 10b resolution with either gate-bootstrapped sampling switches or nominal CMOS sampling switches. The SHA and two MDACs based on a conventional 2-stage amplifier employ optimized trans-conductance ratios of two amplifier stages to achieve the required DC gain, bandwidth, and phase margin. The proposed signal insensitive 3-D fully symmetric capacitor layout reduces the device mismatch of two MDACs. The low-noise on-chip current and voltage references can choose optional off-chip voltage references. The prototype ADC is implemented in a 0.13um 1P8M CMOS process. The measured DNL and INL are within 0.24LSB and 0.35LSB while the ADC shows a maximum SNDR of 54dB and 48dB and a maximum SFDR of 67dB and 61dB at 200MS/s and 250MS/s, respectively. The ADC with an active die area of $1.8mm^2$ consumes 85mW at 250MS/s at a 1.2V supply.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.4
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• pp.443-451
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• 2010

This paper describes a fully integrated CMOS low-IF mobile-TV RF tuner for Band-III T-DMB/DAB applications. All functional blocks such as low noise amplifier, mixers, variable gain amplifiers, channel filter, phase locked loop, voltage controlled oscillator and PLL loop filter are integrated. The gain of LNA can be controlled from -10 dB to +15 dB with 4-step resolutions. This provides a high signal-to-noise ratio and high linearity performance at a certain power level of RF input because LNA has a small gain variance. For further improving the linearity and noise performance we have proposed the RF VGA exploiting Schmoock's technique and the mixer with current bleeding, which injects directly the charges to the transconductance stage. The chip is fabricated in a 0.18 um mixed signal CMOS process. The measured gain range of the receiver is -25~+88 dB, the overall noise figure(NF) is 4.02~5.13 dB over the whole T-DMB band of 174~240 MHz, and the measured IIP3 is +2.3 dBm at low gain mode. The tuner rejects the image signal over maximum 63.4 dB. The power consumption is 54 mW at 1.8 V supply voltage. The chip area is $3.0{\times}2.5mm^2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.7 s.361
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• pp.37-44
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• 2007

A low-voltage high-linear bipolar OTA and its application to IF bandpass filter for GSM cellular telephone are presented. The OTA consists of a low-voltage linear transconductor, a translinear current gain cell, and three current mirrors. The bandpass filter is composed of two cascaded identical second-order bandpass filters, which consist of a resistor, a capacitor, and a grounded simulated inductor realized with two OTA's and a grounded capacitor. SPICE simulations using an 8 GHz bipolar transistor-array parameter show that the OTA with a transconductance of 1 mS exhibits a linearity error of less than ${\pm}2%$ over an input voltage range of ${\pm}0.65\;V$ at supply voltages of ${\pm}2.0\;V$. Temperature coefficient of the transconductance is less than $-90ppm/^{\circ}C$. The bandpass filter has a center frequency of 85 MHz and Q-factor of 80. Temperature coefficient of the center frequency is less than $-182ppm/^{\circ}C$. The power dissipation of the filter is 128 mW.

• Korean Journal of Optics and Photonics
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• v.31 no.5
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• pp.218-222
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• 2020

In this paper, we have experimentally demonstrated a 2-kW-class spectrally-beam-combined laser with high beam quality, using narrow-linewidth ytterbium-doped polarization-maintaining fiber amplifiers. Five fiber amplifiers with different center wavelengths were implemented for the spectrally-beam-combined laser. The center wavelengths of the five amplifiers were 1062, 1063, 1064, 1065, and 1066 nm, respectively. A phase-modulated laser diode was used as a seed source for each amplifier. The seed sources were modulated by filtered pseudorandom-bit-sequence (PRBS) signals 5 GHz in linewidth. The polarization-maintaining large-mode-area fiber with a core size of 30 ㎛ was used as a delivery fiber to mitigate the stimulated Brillouin scattering (SBS) effect. The laser beams from five amplifiers were spectrally combined by a multilayer dielectric diffraction grating. The maximum output power and beam quality M² of the combined laser were measured to be 2.3 kW and 1.74, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.1
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• pp.98-106
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• 2009

This work proposes a 1280-RGB $\times$ 800-Dot 70.78mW 0.l3um CMOS LCD driver IC (LDI) for high-performance 16M-color low temperature poly silicon (LTPS) thin film transistor liquid crystal display (TFT-LCD) systems such as ultra mobile PC (UMPC) and mobile applications simultaneously requiring high resolution, low power, and small size at high speed. The proposed LDI optimizes power consumption and chip area at high resolution based on a resistor-string based architecture. The single column driver employing a 1:12 MUX architecture drives 12 channels simultaneously to minimize chip area. The implemented class-AB amplifier achieves a rail-to-rail operation with high gain and low power while minimizing the effect of offset and output deviations for high definition. The supply- and temperature-insensitive current reference is implemented on chip with a small number of MOS transistors. A slew enhancement technique applicable to next-generation source drivers, not implemented on this prototype chip, is proposed to reduce power consumption further. The prototype LDI implemented in a 0.13um CMOS technology demonstrates a measured settling time of source driver amplifiers within 1.016us and 1.072us during high-to-low and low-to-high transitions, respectively. The output voltage of source drivers shows a maximum deviation of 11mV. The LDI with an active die area of $12,203um{\times}1500um$ consumes 70.78mW at 1.5V/5.5V.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.11
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• pp.828-835
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• 2001

Novel bipolar transresistance amplifier(TRA) and its offset-compensated TRA for high-performance current-mode signal processing are described. The TRA consist of two current follower for a current inputs, a current summer for the current-difference, a resistor for the current to voltage converter, and a voltage follower for the voltage output. The offset-compensated TRA adopts diode-connected npn and pnp transistor to reduce offset voltage in the TRA. The simulation results show that the TRA has impedance of 0.5 Ω at the input and the output terminal. The offset voltages at these terminals is 40 mV The offset-compensated TRA has the offset voltage of 1.1 mV and the impedance of 0.25 Ω. The 3-dB cutoff frequency is 40 MHz for the two TRA＇s when used as a current to voltage converter with unit-gain transresistance. The power dissipation is 11.25 mW.

• Journal of Navigation and Port Research
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• v.27 no.4
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• pp.443-447
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• 2003

In this work. using 0.2 GaAs modulation doped FET(MODFET), a high performance DBS downconverter MMIC was developed for direct broadcasting satellite (DBS) application. Without LNA, the downconverter MMIC showed a very low noise of 4.8 dB, which is lower by 3 dB than conventional ones. A low LO power of -10 dBm was required for the normal DBS operation of the downconverter MMIC. which reduced the power consumption via a removal of LO amplifier on MMIC. It required only a low power consumption of 175 mW, which is lower than 70 percent of conventional ones. The LO leakage power at IF output was suppressed to a lower level than 30 dBm, which removes a bulky LO rejection filter on a board. The fabricated chip, which include a mixer, If amplifiers. LO rejection filter, and active balun, exhibited a small size of $0.84{\times}0.9\textrm{mm}^2$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.6
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• pp.670-680
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• 2010

A low power single-chip CMOS receiver for 60 GHz mobile application are proposed in this paper. The single-chip receiver consists of a 4-stage current re-use LNA with under 4 dB NF, Cgs compensating resistive mixer with -9.4 dB conversion gain, Ka-band low phase noise VCO with -113 dBc/Hz phase noise at 1 MHz offset from 26.89 GHz, high-suppression frequency doubler with -0.45 dB conversion gain, and 2-stage current re-use drive amplifier. The size of the fabricated receiver using a standard 0.13 ${\mu}m$ CMOS technology is 2.67 mm$\times$0.75 mm including probing pads. An RF bandwidth is 6.2 GHz, from 55 to 61.2 GHz and an LO tuning range is 7.14 GHz, from 48.45 GHz to 55.59 GHz. The If bandwidth is 5.25 GHz(4.75~10 GHz) The conversion gain and input P1 dB are -9.5 dB and -12.5 dBm, respectively, at RF frequency of 59 GHz. The proposed single-chip receiver describes very good noise performances and linearity with very low DC power consumption of only 21.9 mW.

• Journal of The Korean Astronomical Society
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• v.25 no.1
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• pp.23-46
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• 1992

The electrical, mechanical and optical capabilities have been tested of the microdensitometer PDS 1010GMS at the Korea Astronomy Observatory. The highest stage of scan speed 255 csu (conventional speed unit) is measured to be 47 mm/s. At this speed the position is displaced by $4{\mu}m$ to the direction of scanning and the density is underestimated by $0.4{\sim}0.7D$. Standard deviation in the measured density is proportional to $A^{-0.46}$, where A is the area of scan aperture. The accuracy of position repeatability is ${\pm}1{\mu}m$, and that of density repeatability is ${\pm}(0.003{\sim}0.03)D$. Callier coefficient is determined to be 1.37; the semispecular density is directly proportional to the diffuse density up to 3.5D. Because the logarithmic amplifier has a finite response time, the densities measured at high scan speeds are underestimated to the degree that speeds higher than 200 csu are inadequate for making an accurate astronomical photometry. After power is on, an about 5 hour period of warming is required to stabilize the system electrically and mechanically as well. On the basis of this performance test, we have determined the followings as the optimum scan parameters for the astronomical photometry: For the scan aperture $10\;\sim\;20{\mu}m$ is optimal, and for the scan speed. $20\;{\sim}\;50$ csu is appropriate. These parameter values are chosen in such a way that they may keep the density repeatability within ${\pm}0.01D$, the position displacement under $1{\mu}m$, and the density underestimation below 0.1D even in high density regions.