• Title/Summary/Keyword: 3차원 마이크로형상

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Recent Progress in the Nanoscale Additive Layer Manufacturing Process Using Two-Photon Polymerization for Fabrication of 3D Polymeric, Ceramic, and Metallic Structures (이광자 광중합 공정을 이용한 3차원 미세구조물 제작기술 동향)

  • Ha, Cheol-Woo;Lim, Tae-Woo;Son, Yong;Park, Suk-Hee;Park, Sang-Hu;Yang, Dong-Yol
    • Journal of the Korean Society for Precision Engineering
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    • v.33 no.4
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    • pp.265-270
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    • 2016
  • Recently, many studies have been conducted on the nano-scale fabrication technology using twophoton- absorbed polymerization induced by a femtosecond laser. The nano-stereolithography process has many advantages as a technique for direct fabrication of true three-dimensional shapes in the range over several microns with sub-100 nm resolution, which might be difficult to obtain by using general nano/microscale fabrication technologies. Therefore, two-photon induced nano-stereolithography has been recently recognized as a promising candidate technology to fabricate arbitrary 3D structures with sub-100 nm resolution. Many research works for fabricating novel 3D nano/micro devices using the two-photon nano-stereolithography process, which can be utilized in the NT/BT/IT fields, are rapidly advancing.

Three-dimensional Stress Analysis of Implant Systems with Micro Threads in the Maxillary Bone (다양한 마이크로쓰레드(Micro thread)의 개수를 가지는 임플란트의 상부구조물 형상과 하중조건에 따른 3차원 유한요소해석을 이용한 하악골의 응력분포에 관한 연구)

  • Shin Ha-Shik;Han Chong-Hyun;Lee Soo-Hong;Chun Heoung-Jae
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.3 s.168
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    • pp.179-186
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    • 2005
  • A comparative study of stress distributions in the maxillary bone with three different types of abutment was conducted. Finite element analysis was adopted to determine stress generated in the bone with the different implant systems with micro threads (Onebody type implant, Internal type implant, and External type implant). It was found that the types of abutments and the number of micro threads have significant influence on the stress distribution in the maxillary bone. They were due to the difference in the load transfer mechanism and the size of contact area between abutment and fixture. Also the maximum effective stress in the maxillary bone was increased with increasing inclination angle of load. It was concluded that the maximum effective stress in the bone was the lowest by the internal implant among the maximum effective stresses by other two types of implants and by appropriate number of micro threads, and that the specific number of micro thread was existed to decrease the maximum effective stress in the maxillary bone due to different implant systems and loading conditions.

Optimal Design for 3D Structures Using Artificial Intelligence : Its Application to Micro Accelerometer (인공지능을 이용한 3차원 구조물의 최적화 설계 : 마이크로 가속도계에 적용)

  • Lee, Joon-Seong
    • Journal of the Korean Institute of Intelligent Systems
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    • v.14 no.4
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    • pp.445-450
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    • 2004
  • This paper describes an optimal design system for multi-disciplinary structural design. An automatic finite element (FE) mesh generation technique, which is based on the fuzzy knowledge processing and computational geometry technique, is incorporated into the system, together with a commercial FE analysis code and a commercial solid modelers. An optimum design solution or satisfactory solutions are then automatically searched using the genetic algorithms modified for real search space, together with the automated FE analysis system. With an aid of genetic algorithms, the present design system allows us to effectively obtain a multi-dimensional solutions. The developed system is successfully applied to the shape design of a micro accelerometer based on a tunnel current concept.

Three-dimensional micro photomachining of polymer using DPSSL (Diode Pumped Solid State Laser) with 355 nm wavelength (355nm 파장의 DPSSL을 이용한 폴리머의 3차원 미세 형상 광가공기술)

  • 장원석;신보성;김재구;황경현
    • Korean Journal of Optics and Photonics
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    • v.14 no.3
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    • pp.312-320
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    • 2003
  • The basic mechanistic aspects of the interaction and practical considerations related to polymer ablation were briefly reviewed. Photochemical and photothermal effects, which highly depend on laser wavelength have close correlation with each other. In this study, multi-scanning laser ablation processing of polymer with a DPSS (Diode Pumped Solid State) 3rd harmonic Nd:YVO$_4$ laser (355 nm) was developed to fabricate a three-dimensional micro shape. Polymer fabrication using DPSSL has some advantages compared with the conventional polymer ablation process using KrF and ArF laser with 248 nm and 193 nm wavelength. These advantages include pumping efficiency and low maintenance cost. And this method also makes it possible to fabricate 2D patterns or 3D shapes rapidly and cheaply because CAD/CAM software and precision stages are used without complex projection mask techniques. Photomachinability of polymer is highly influenced by laser wavelength and by the polymer's own chemical structure. So the optical characteristics of polymers for a 355 nm laser source is investigated experimentally and theoretically. The photophysical and photochemical parameters such as laser fluence, focusing position, and ambient gas were considered to reduce the plume effect which re-deposits debris on the surface of substrate. These phenomena affect the surface roughness and even induce delamination around the ablation site. Thus, the process parameters were tuned to optimize for gaining precision surface shape and quality. This maskless direct photomachining technology using DPSSL could be expected to manufacture tile prototype of micro devices and molds for the laser-LIGA process.

Three-Dimensional Numerical Analysis for Verifying Behavioral Mechanism and Bearing Capacity Enhancement Effect According to Tip Elements (선단 고정 지압구의 거동 메커니즘과 형상에 따른 지지력 증대효과 검증을 위한 3차원 수치해석)

  • Lee, Seokhyung;Kim, Seok-Jung;Han, Jin-Tae;Jin, Hyun-Sik;Hwang, Gyu-Cheol;Lee, Jeong-Seob
    • Journal of the Korean Geotechnical Society
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    • v.38 no.9
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    • pp.53-67
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    • 2022
  • Micropiles are cast-in-place-type piles with small diameters. They are widely used for the foundation reinforcement of existing buildings and structures because this technique is easy to construct and economic. A base expansion structure is developed following the mechanism of radial expansion at the pile tip under compression. Numerical analysis, durability tests, and centrifuge tests have been conducted using the base expansion structure. In this study, three-dimensional numerical modeling was performed to describe the behavioral mechanism of the base expansion structure using steel bar penetration under compressive loading, and numerical analyses using centrifuge test conditions were performed for the comparative studies. Additionally, the base structure was modified based on the results of lab-scale analyses, and the bearing capacities of micropiles were compared using field-scale numerical analyses under various ground conditions.

Development of a Measurement System for the Surface Shape of Micro-parts by Using Atomic Force Microscope (원자간력 현미경을 이용한 초소형 마이크로 부품 표면 형상 측정 시스템 개발)

  • Hong Seong-Wook;Ko Myung-Jun;Shin Young-Hyun;Lee Deug-Woo
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.14 no.6
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    • pp.22-30
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    • 2005
  • This paper proposes a measurement method for the surface shape of micro-parts by using an atomic force microscope(AFM). To this end, two techniques are presented: First, the measurement range is expanded by using an image matching method based on correlation coefficients. To account for the inaccuracy of the coarse stage implemented in AFM, the image matching technique is applied to two neighboring images intentionally overlapped with each other. Second, a method to measure the shape of relatively large specimen is proposed that utilizes the inherent trigger mechanism due to the atomic force. The proposed methods are proved effective through a series of experiments.

Direct Patterning of 3D Microstructures on an Opaque Substrate Using Nano-Stereolithography (나노 스테레오리소그래피 공정을 이용한 불투명 기판에서의 3차원 마이크로 형상 제작 방법에 관한 연구)

  • Son, Yong;Lim, Tae-Woo;Ha, Cheol-Woo;Yang, Dong-Yol;Jung, Byung-Je;Kong, Hong-Jin
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.10
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    • pp.93-99
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    • 2010
  • A nano-stereolithography is the direct patterning process with a nanoscale resolution using twophoton absorption induced by a femtosecond laser. However, in the majority of the works, the fabrication of 3D microstructures have been done only onto transparent glass due to the use of an oil immersion objective lens for achieving a high resolution. In this work, the coaxial illumination and the auto-focusing system are proposed for the direct patterning of nano-precision patterns on an opaque substrate such as a silicon wafer and a metal substrate. Through this work, 3D polymer structures and metallic patterns are fabricated on a silicon wafer using the developed process.

Thermal Warpage Behavior of Single-Side Polished Silicon Wafers (단면 연마된 실리콘 웨이퍼의 열에 의한 휨 거동)

  • Kim, Junmo;Gu, Chang-Yeon;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.27 no.3
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    • pp.89-93
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    • 2020
  • Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

Generation and Validation of Finite Element Models of Computed Tomography for Unidirectional Composites Using Supervised Learning-based Segmentation Techniques (지도학습 기반 분할기법을 이용한 단층 촬영된 단방향 복합재료의 유한요소모델 생성 및 검증)

  • Taeyi Kim;Seong-Won Jin;Yeong-Bae Kim;Jae Hyuk Lim;YunHo Kim
    • Composites Research
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    • v.36 no.6
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    • pp.395-401
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    • 2023
  • In this study, finite element modeling of unidirectional composite materials of the computed tomography (CT) was conducted using a supervised learning-based segmentation technique. Firstly, Micro-CT scan was performed to obtain the raw volume of unidirectional composite materials, providing microstructure information. From the CT volume images, actual microstructure of the cross-section of unidirectional composite materials was extracted by the labeling process. Then, a U-net deep learning model was trained with a small number of raw images as inputs and their labeled images as outputs to generate a segmentation model. Subsequently, most of remaining images were input to the trained U-net deep learning model to segment all raw volume for identifying complex microstructure, which was used for the generation of finite element model. Finally, the fiber volume fraction of the finite element model was compared with that of experimentally measured volume to validate the appropriateness of the proposed method.

Recent Progress in Micro In-Mold Process Technologies and Their Applications (마이크로 인몰드 공정기술 기반 전자소자 제조 및 응용)

  • Sung Hyun Kim;Young Woo Kwon;Suck Won Hong
    • Journal of the Microelectronics and Packaging Society
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    • v.30 no.2
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    • pp.1-12
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    • 2023
  • In the current era of the global mobile smart device revolution, electronic devices are required in all spaces that people interact with. The establishment of the internet of things (IoT) among smart devices has been recognized as a crucial objective to advance towards creating a comfortable and sustainable future society. In-mold electronic (IME) processes have gained significant industrial significance due to their ability to utilize conventional high-volume methods, which involve printing functional inks on 2D substrates, thermoforming them into 3D shapes, and injection-molded, manufacturing low-cost, lightweight, and functional components or devices. In this article, we provide an overview of IME and its latest advances in application. We review biomimetic nanomaterials for constructing self-supporting biosensor electronic materials on the body, energy storage devices, self-powered devices, and bio-monitoring technology from the perspective of in-mold electronic devices. We anticipate that IME device technology will play a critical role in establishing a human-machine interface (HMI) by converging with the rapidly growing flexible printed electronics technology, which is an integral component of the fourth industrial revolution.