• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.31-31
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• 2010

The growth of the high-quality GaN epilayers is of significant technological importance because of their commercializedoptoelectronic applications as high-brightness light-emitting diodes (LEDs) and laser diodes (LDs) in the visible and ultraviolet spectral range. The GaN-based heterostructural epilayers have the polar c-axis of the hexagonal structure perpendicular to the interfaces of the active layers. The Ga and N atoms in the c-GaN are alternatively stacked along the polar [0001] crystallographic direction, which leads to spontaneous polarization. In addition, in the InGaN/GaN MQWs, the stress applied along the same axis contributes topiezoelectric polarization, and thus the total polarization is determined as the sum of spontaneous and piezoelectric polarizations. The total polarization in the c-GaN heterolayers, which can generate internal fields and spatial separation of the electron and hole wave functions and consequently a decrease of efficiency and peak shift. One of the possible solutions to eliminate these undesirable effects is to grow GaN-based epilayers in nonpolar orientations. The polarization effects in the GaN are eliminated by growing the films along the nonpolar [$11\bar{2}0$] ($\alpha$-GaN) or [$1\bar{1}00$] (m-GaN) orientation. Although the use of the nonpolar epilayers in wurtzite structure clearly removes the polarization matters, however, it induces another problem related to the formation of a high density of planar defects. The large lattice mismatch between sapphiresubstrates and GaN layers leads to a high density of defects (dislocations and stacking faults). The dominant defects observed in the GaN epilayers with wurtzite structure are one-dimensional (1D) dislocations and two-dimensional (2D) stacking faults. In particular, the 1D threading dislocations in the c-GaN are generated from the film/substrate interface due to their large lattice and thermal coefficient mismatch. However, because the c-GaN epilayers were grown along the normal direction to the basal slip planes, the generation of basal stacking faults (BSFs) is localized on the c-plane and the generated BSFs did not propagate into the surface during the growth. Thus, the primary defects in the c-GaN epilayers are 1D threading dislocations. Occasionally, the particular planar defects such as prismatic stacking faults (PSFs) and inversion domain boundaries are observed. However, since the basal slip planes in the $\alpha$-GaN are parallel to the growth direction unlike c-GaN, the BSFs with lower formation energy can be easily formed along the growth direction, where the BSFs propagate straightly into the surface. Consequently, the lattice mismatch between film and substrate in $\alpha$-GaN epilayers is mainly relaxed through the formation of BSFs. These 2D planar defects are placed along only one direction in the cross-sectional view. Thus, the nonpolar $\alpha$-GaN films have different atomic arrangements along the two orthogonal directions ($[0001]_{GaN}$ and $[\bar{1}100]_{GaN}$ axes) on the $\alpha$-plane, which are expected to induce anisotropic biaxial strain. In this study, the anisotropic strain relaxation behaviors in the nonpolar $\alpha$-GaN epilayers grown on ($1\bar{1}02$) r-plane sapphire substrates by metalorganic chemical vapor deposition (MOCVO) were investigated, and the formation mechanism of the abnormal zigzag shape PSFs was discussed using high-resolution transmission electron microscope (HRTEM).

• Journal of Sensor Science and Technology
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• v.2 no.1
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• pp.3-10
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• 1993

Polycrystalline CdS thin films were grown on ceramic substrate using a chemical bath deposition method. They were annealed at various temperature and X-ray diffraction patterns were measured by X-ray diffractometer in order to study CdS polycrystal structure. Using extrapolation method of X-ray diffraction patterns for the CdS samples annealed in $N_{2}$ gas at $550^{\circ}C$ it was found hexagonal structure whose lattice constants $a_{o}$ and $c_{o}$ were $4.1364{\AA}$ and $6.7129{\AA}$, respectively. Its grain size was about $0.35{\mu}m$. Hall effect on this sample was measured by Van der Pauw method and studied on carrier density and mobility defending on temperature. From Hall data, the mobility was likely to be decreased by piezo electric scattering at temperature range of 33K and 150k and by polar optical scattering at temperature range of 150K and 293K. We measured also spectral response, sensitivity (${\gamma}$), maximum allowable power dissipation and response time on these samples.

• Journal of Sensor Science and Technology
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• v.2 no.1
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• pp.81-86
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• 1993

Polycrystalline CdSe thin films were grown on ceramic substrate using a chemical bath deposition (CBD) method. They were annealed at various temperature and X-ray diffraction patterns were measured by X-ray diffractometer in order to study CdSe polycrystal structure. Using extrapolation method of X-ray diffraction patterns for the CdSe samples annealed in $N_{2}$ gas at $450^{\circ}C$ it was found hexagonal structure whose lattice parameters $a_{o}$ and $c_{o}$ were $4.302{\AA}$ and $7.014{\AA}$, respectively. Its grain size was about $0.3{\mu}m$. Hall effect on this sample was measured by Van der Pauw method and studied on carrier density and mobility depending on temperature. From Hall data, the mobility was likely to be decreased by piezo electric scattering at temperature range of 33 K and 200 K, and by polar optical scattering at temperature range of 200 K and 293 K. We measured also spectral response, sensitivity (${\gamma}$), maximum allowable power dissipation and response time on these samples.

• Progress in Superconductivity
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• v.9 no.1
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• pp.23-28
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• 2007

In order to have a superconductive connection between the wire-wound pickup coil and input coil, typically Nb terminal blocks with screw holes are used. Since this connection structure occupies large volume, large stray pickup area can be generated which can pickup external noise fields. Thus, SQUID and connection block are shielded inside a superconducting tube, and this SQUID module is located at some distance from the distal coil of the gradiometer to minimize the distortion or imbalance of uniform background field due to the superconducting module. To operate this conventional SQUID module, we need a higher liquid He level, resulting in shorter refill interval. To make the fabrication of gradiometers simpler and refill interval longer, we developed a novel method of connecting the pickup coil into the input coil. Gradiometer coil wound of 0.125-mm diameter NbTi wires were glued close to the input coil pads of SQUID. The superconductive connection was made using an ultrasonic bonding of annealed 0.025-mm diameter Nb wires, bonded directly on the surface of NbTi wires where insulation layer was stripped out. The reliability of the superconductive bonding was good enough to sustain several thermal cycling. The stray pickup area due to this connection structure is about $0.1\;mm^2$, much smaller than the typical stray pickup area using the conventional screw block method. By using this compact connection structure, the position of the SQUID sensor is only about 20-30 mm from the distal coil of the gradiometer. Based on this compact module, we fabricated a magnetocardiography system having 61 first-order axial gradiometers, and measured MCG signals. The gradiometers have a coil diameter of 20 mm, and the baseline is 70 mm. The 61 axial gradiometer bobbins were distributed in a hexagonal lattice structure with a sensor interval of 26 mm, measuring $dB_z/dz$ component of magnetocardiography signals.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.108-108
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• 1998

최근의 GaN에 관한 연구는 주로 MOCVD법과 MBE법이 이용되고 있으며 대부분 800¬1$\alpha$)()t 정도의 고옹에서 이루어지고 었다. 그러나 이러한 고온 성장은 GaN 성장 과청에서 질 소 vacancy를 생성시켜 광특성을 저하시키고 청색 발광충인 InGaN 화합물에 In의 유입울 어 렵게 하며 저온에서보다 탄소 오염이 증가하는 동의 문제캠을 가지고 있다. 이러한 고온 생장 의 문제점을 해결하기 위한 방법중의 한 가지로 제시되고 있는 것이 저온 성장법이다. 본 연구 에 사용된 RPE-UHVCVD법은 Nz률 rf plasma로 $\sigma$acking하여 공급함으로써 NI-h롤 질소원으 로 사용하는 고온 성장의 청우와는 다르게 온도에 크게 의존하지 고 질소원올 공급할 수 있 어 저옹 성장이 가능하였다. 기판으로는 a - Alz03($\alpha$)()1)를 사용하였고 3족원은 TEGa(triethylgallium)이며,5족원으로는 6 6-nine Nz gas를 rf plasma로 cracking하여 활성 질소원올 공급하였다 .. Nz plasma로 질화처리 를 한 sapphire 표면 위에 G따애 핵생성충을 성장 옹도(350 t, 375 t, 400 t)와 성장시간(30 분,50 분) 그리고 VIllI비(1$\alpha$)(), 2뼈)둥을 변화시키면서 성장시킨 후 GaN 에피택시충을 450 $^{\circ}C$에서 120 분 동안 성장시켰다 .. XPS(x-ray photoelectron spectroscopy), XRD(x-ray d diffraction), AFM(atomic force microscope)둥올 이용하여 표면의 조성 및 morphology 변화와 결정성을 관찰하였다. X XPS 분석 결과 질화처리를 한 sapphire 표면에는 AlN가 형성되었다는 것을 확인 할 수 있 었으며 질화처리를 한 후 G따J 핵생성충올 성장시킨 경우에 morphology 변화를 AFM으로 살 펴본 결과 표면에 facet shape의 island가 형성되었고 이러한 결파는 질화처리 과청이 facet s shape의 island 형성을 촉진시킨다는 것을 알 수 있었다. 핵생성충의 성장온도가 중가함에 따 라 island의 모양은 round shape에서 facet shape으로 변화하였다. 이러한 표면의 morphology 변화와 GaN 에피택시충의 결정성과의 관계를 살펴보면 GaN 에피택시충 표면의 rms(root m mean square) roughness가 중가하는 경 우 XRD (j -rocking curve의 FWHM(full width half m maximum) 값이 감소하는 것으로 나타났다. 이러한 현상은 결정성의 향상이 columnar 성장과 관계가 었다는 것올 알 수 있었다 .. columnar 성장은 결함의 밀도가 낮은 column의 형생과 G GaN 에피택시충의 웅력 제거로 인해 G값{의 결정성을 향상시킬 수 있는 것으로 생각된다. 톡 히 고온 성장의 경우와는 달리 rms roughness의 중가가 100-150 A청도로 명탄한 표면올 유 지하면서 결정성을 향상시킬 수 있었다. 본 실험에서는 핵생성충올 375 t에서 30 분 생장시킨 경우에 hexagonal 모양의 island로 columnar 성장을 하였고 GaN 에피태시충의 결정성도 가장 향상되었다 이상의 결과로부터 RPE-UHVCVD법용 이용한 GaN 저온 성장에서도 GaN의 결청성올 향 상시킬 수 있음융 확인할 수 있었다.

• Journal of Sensor Science and Technology
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• v.4 no.1
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• pp.51-63
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• 1995

Polycrystalline $CdS_{1-x}Se_{x}$ thin films were grown on ceramic substrate using a chemical bath deposition method. They were annealed at various temperature and X-ray diffraction patterns were measured by X-ray diffractometer in order to study $CdS_{1-x}Se_{x}$ polycrystal structure using extrapolation method of X-ray diffraction patterns for the CdS, CdSe samples annealed in $N_{2}$ gas at $550^{\circ}C$ it was found hexagonal structure which had the lattice constant $a_{0}=4.1364{\AA}$, $c_{0}=6.7129{\AA}$ in CdS and $a_{0}=4.3021{\AA}$, $c_{0}=7.0142{\AA}$ in CdSe, respectively. Hall effect on these samples was measured by Van der Pauw method and then studied on carrier density and mobility depending on temperature. We measured also spectral response, sensitivity(${\gamma}$), maximum allowable power dissipation and response time on these samples.

• The Journal of Korean Academy of Prosthodontics
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• v.50 no.1
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• pp.36-43
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• 2012

Purpose: To analyze the stress distribution of the implant and its supporting structures through 3D finite elements analysis for implants with different hexagon heights and to make the assessment of the mechanical stability and the effect of the elements. Materials and methods: Infinite elements modeling with CAD data was designed. The modeling was done as follows; an external connection type ${\phi}4.0mm{\times}11.5mm$ Osstem$^{(R)}$ USII (Osstem Co., Pusan, Korea) implant system was used, the implant was planted in the mandibular first molar region with appropriate prosthetic restoration, the hexagon (implant fixture's external connection) height of 0.0, 0.7, 1.2, and 1.5 mm were applied. ABAQUS 6.4 (ABAQUS, Inc., Providence, USA) was used to calculate the stress value. The force distribution via color distribution on each experimental group's implant fixture and titanium screw was studied based on the equivalent stress (von Mises stress). The maximum stress level of each element (crown, implant screw, implant fixture, cortical bone and cancellous bone) was compared. Results: The hexagonal height of the implant with external connection had an influence on the stress distribution of the fixture, screw and upper prosthesis and the surrounding supporting bone. As the hexagon height increased, the stress was well distributed and there was a decrease in the maximum stress value. If the height of the hexagon reached over 1.2mm, there was no significant influence on the stress distribution. Conclusion: For implants with external connections, a hexagon is vital for stress distribution. As the height of the hexagon increased, the more effective stress distribution was observed.