• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.147-164
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• 2001

1. "MLS", state of the art MCM-D wiring substrate. 2. High pin-count LSl assembly. 3. Higher speed needs higher packaging density. 4. Wiring substrate, the key of LSl packaging device. 5. "Inter-Layer Transferability", a new index for the performance of wiring substrates. 6. "MLTF package", a core-less flexible package for high pin-count LSl.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.2
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• pp.1-5
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• 2002

In order to improve the load efficiency of pallets and trucks for agricultural products, various transport package sizes have been analyzed by modular coordination process. From the results, the load efficiency on pallet was 99.8 percent when size was 550 by 366 mm and 366 by 275 mm. Load efficiency of standard pallet(1100 by 1100mm) was 93.6% for truck with 11 tons load capacity while as low as 41.1% for 2.5 ton trucks. Like any other products, this study proved that trucks with more than 8 tons of capacity were highly recommended for transportation of agricultural products.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.357-358
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• 2005

Compact power amplifier modules (PAM) for WCDMA/KPCS and GSM/WCDMA dual-band applications based on multilayer low temperature co-fired ceramic (LTCC) substrates are presented in this paper. The proposed modules are composed of an InGaP/GaAs HBT PAs on top of the LTCC substrates and passive components such as RF chokes and capacitors which are embedded in the substrates. The overall size of the modules is less than 6mm $\times$ 6mm $\times$ 0.8mm. The measured result shows that the PAM delivers a power of 28 dBm with a power added efficiency (PAE) of more than 30 % at KPCS band. The adjacent-channel power ratio (ACPR) at 1.25-MHz and 2.25-MHz offset is -44dBc/30kHz and -60dBc/30kHz, respectively, at 28-dBm output power. Also, the PAM for WCDMA band exhibits an output power of 27 dBm and 32-dB gain at 1.95 GHz with a 3.4-V supply. The adjacent-channel leakage ratio (ACLR) at 5-MHz and 10-MHz offset is -37.5dBc/3.84MHz and -48dBc/3.84MHz, respectively. The measured result of the GSM PAM shows an output power of 33.4 dBm and a power gain of 30.4 dB at 900MHz with a 3.5V supply. The corresponding power added efficiency (PAE) is more than 52.6 %.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.19-25
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• 2008

In this paper, the front end module (FEM) was proposed for 2.4GHz WLAN band by LTCC multilayer application. The FEM was composed of power amplifier IC, switch IC, and LTCC module. LTCC module consists of output matching circuit and lowpass filter as Tx part, bandpass filter as Rx part. Design of output matching circuit for LTCC was used matching parameter from output matching circuit based on lumped circuit on the PCB board. The dielectric constant of LTCC substrate is 9. The substrate was composed of total 26 layers with each 30um thickness. Ag paste was used for the internal pattern as the conductor material. The size of the module is $4.5mm{\times}3.2mm{\times}1.4mm$. The fabricated FEM showed the gain of 21dB, ACPR of less than -31dBc first side lobe and Less than -59dBc second side lobe and the output power of 23Bm at P1dB.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.3 s.333
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• pp.17-24
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• 2005

We fabricated PIN-Photodiodes with a single mode fiber for analog communications and analyzed characteristics of the devices. The fabricated PIN-Photodiode shows a bandwidth of 1.5 GHz, a dark current of 20 p4 a capacitance of 0.48 pF, and the responsivity of 0.9 V/W, a second order distortion of -72 dBc. In this paper, we developed a new optical Packaging technology that is aligning in real-time monitoring of both responsivity and IM2 characteristics. As a result responsivity has been improved by 0.03 V/W, and also U has been improved by $3\~5\;dBc$. On the other hand, failure ratio has been reduced by $3.5\%$.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.19-24
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• 1999

The multilayer chip band pass filter for mobile communication is fabricated and designed. The size, insertion loss, center frequency and band width of multilayer chip filter are 4.5$\times$4.4$\times$1.8[mm], 3.0[dB] and 700[MHz]$\pm$15[MHz] respectively. The chip filter using $BiNbO_4$with CuO 0.06wt% +$V_2O_5$.lwt% was fabricated by screen printing with Ag electrode after tape casting. Insertion loss and center frequency of the fabricated chip filter are 2.58[dB] and 692.5$\pm$15[MHz] respectively. The center frequency was lower 7.5[MHz] than design result, but other characteristics of chip filter were similar to the ruts ultras of design result.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.7-12
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• 1998

감광성 BCB를 사용한 MCM-D기판에 신뢰성있는 비아형성을 위하여 BCB의 공정 특성과 C2F6를 사용한 플라즈마 cleaning 영향을 분석하였다. 절연막, 금속배선재료로 각각 감광성 BCB, Cu를 사용하여 MCM-D 기판을 제작 분석한 결과 BCB는 soft bake 후 초기 두께의 50%정도 두께 손실이 있었으며 해상도는 15um이었다. BCB층에 비아 형성후 C2F6 가스로 플라즈마 cleaning 하고 AES로 비아표면을 분석한 결과 유기물 C는 검출되지 않은 반면 플라즈마 cleaning을 하지 않은 비아를 분석한 결과 유기물 성분의 C가 많이 검출되었 고 Ar 스퍼터에 의해서도 완전히 제거되지 않았다. 따라서 감광성 BCB를 절연막으로 사용 한 MCM-D 기판 제작공정에서 비아 형성후 C2F6를 이용한 플라즈마 cleaning의 필요성을 확인하였다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.5
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• pp.1029-1034
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• 2012

This paper presents a cost-effective and high-performance film bulk acoustic resonator (FBAR) duplexer module for US-PCS handset applications. The FBAR device uses a glass wafer level packaging process, which is a more cost-effective alternative to the typical silicon capping process. The maximum insertion losses of the FBAR duplexer at the Tx and Rx bands are of 1.9 and 2.4 dB, respectively. The total thickness of the duplexer module is 1.2 mm, including the glass-wafer bonded Tx/Rx FBAR devices, PCB board, and transfer molding material.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.39-44
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• 2021

In this paper, two types of BPF(Band Pass Filter) which are hair-pin and interdigital have been designed for millimeter-wave application using two types of material which are LCP(Liquid Crystal Polymer) and PTFE(Polytetrafluoroethylene) and also, their performances such as bandwidth, insertion loss, and in-band flatness are compared. The proposed BPF are designed as third-order filters, and their pass band is from 26.5 GHz to 27.3 GHz. Interdigital BPF using PTFE substrate has most wide -3 dB S21 bandwidth of 7.8 GHz and hair-pin BPF using LCP substrate has most narrow -3 dB S21 bandwidth among the proposed four BPF. For in-band insertion loss, hair-pin BPF using PTFE substrate achieves low insertion loss better than -0.667 dB, and hair-pin BPF using LCP substrate exhibits relatively high insertion loss among the proposed four BPF better than -0.937 dB. However, the maximum difference in insertion loss performance among the proposed four BPF is 0.27 dB, which is too small to negligible. For in-band flatness, interdigital BPF using PTFE substrate shows greatest performance of 0.017 dB, and hair-pin BPF using LCP substrate exhibits the lowest performance of 0.07 dB. There are tiny difference in in-band flatness performance of 0.053 dB. As a results, it is considered that the BPF using LCP substrate can derive the performances similar to that of the BPF using PTFE substrate in Millimeter-wave band.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.24 no.1
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• pp.1-11
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• 2018

In this study, pro-oxidant($d2w^{(R)}$) and rPP/ZnO nanocomposite flexible films for food packaging were prepared, and their mechanical and antimicrobial properties were investigated. As a result, the carbonyl index and hydroxyl index increased with exposured time to heat and UV rays. Surface analysis showed that the addition of zinc oxide improved the dispersibility and compatibility of the polymer, so that the surface of the composite film was smooth and the zinc oxide particles were smaller than the compared film. And it kept the physical properties by heat and UV ray blocking effect, and it worked to reduce decomposition. In the antimicrobial activity test, the microbial reduction rate was 3 logs or more at the use concentration of zinc oxide. The tensile strength was increased and the elongation was decreased. Oxidative degradability of multi-layered film in UV exposured for 72 hours, the molecular weight of the film decreased by 75.6%, 1,294 g/mol Mn and 5,920 g/mol Mw. In the safety analysis of food packaging materials, we obtained that are in standard of polypropylene, a food contact material of domestic law.