• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.337-337
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• 2010

갈륨-질화물 (GaN) 기반의 고 전자 이동도 트랜지스터 (High Electron Mobility Transistor, HEMT)는 GaN의 큰 밴드갭 (3.4~6.2 eV), 높은 항복전계 (Ec~3 MV/cm) 및 높은 전자 포화 속도 (saturation velocity $-107\;cm{\cdot}s-1$) 특성과 AlGaN/GaN 등과 같은 이종접합구조(Heterostructure )로부터 발생하는 높은 면밀도(Sheet Concentration)를 갖는 이차원 전자가스(Two-Dimensional Electron Gas, 2DEG) 채널로 인해 차세대 고출력/고전압 소자로서 각광받고 있다. 하지만 드레인 쪽의 게이트 에지부분에 집중되는 전계로 인한 애벌린치 할복현상(Breakdown)이 발생하는 문제점이 있다. 따라서 AlGaN/GaN HEMT의 항복전압 향상을 위한 방법으로 필드플레이트(Field-Plate) 구조가 많이 사용되고 있다. 본 논문에서는 2D 시뮬레이션을 통한 AlGaN/GaN HEMT의 필드플레이트 구조 최적화를 수행하였다. 이를 위해 ATLASTM 전산모사 프로그램을 이용하여 필드플레이트 길이, 절연체 증류 및 두께에 따른 전류 전압 특성 및 전계 분산효과에 대한 전산모사를 수행하여 그 결과를 비교, 분석 하였다, 이를 바탕으로 기존의 구조에 비해 약 300%이상 향상된 항복전압을 갖는 AlGaN/GaN HEMT의 최적화된 필드 플레이트 구조를 제안하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.6
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• pp.384-392
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• 2003

The algorithm for calculating the base-collector breakdown voltage of NPN BJT for integrated circuits is proposed. The method of three-dimensional mesh generation to minimize the time required for device simulation is presented and the method for calculating the breakdown voltage using solutions of the Poisson´s equation is presented. To verify the proposed method, the breakdown voltage between base and collector of NPN BJT using 20V process and 30V process is compared with the measured data. The breakdown voltage from the proposed method of NPN BJT using 20V process shows an averaged relative error of 8.0% compared with the measured data and the breakdown voltage of NPN BJT using 30V process shows an averaged relative error of 4.3% compared with the measured data.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.5
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• pp.290-297
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• 2003

Analytical Expressions of temperature dependent breakdown voltage and on-resistance for silicon power MOSFETs are induced by employing the temperature dependent effective ionization coefficient extracted from temperature dependent ionization coefficients for electron and hole, and electron mobility in silicon. The analytical results for temperature dependent breakdown voltage are compared with experimental results for tile doping concentration, 4x10$^{14}$ cm$^{-3}$ , 1x10$^{15}$ cm$^{-3}$ , 6x10$^{16}$ cm$^{-3}$ respectively. The variations of temperature dependent on-resistance and breakdown voltage dependent ideal specific on-resistance are also compared with the ones reported previously. Good fits with the experimental results ate found for the breakdown voltages within 10% in error for the temperature in the range of 77~300K at each doping concentration.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.9
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• pp.1-9
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• 2004

Analytical expressions for breakdown voltages of abrupt pn junction in GaP, GaAs and InP of III-V binary semiconductors was induced. Getting analytical breakdown voltage, effective ionization coefficients were extracted using ionization coefficient parameters for each materials. The result of analytical breakdown voltages followed by ionization integral agrees well with numerical and experimental results within 10% in error.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.100-105
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• 1994

Analytical expressions for the breakdown voltage and the optimum drift region length (L$_{dr}$) of SOI (Silicon-On-Insulator) pn diodes are derived in terms of the doping concentration and the thickness of the n- drift region and the buried oxide thickness. The optimum L$_{dr}$ is obtained from the condition that the breakdown voltage of the vertical electric field of n+n- junction equals to the of the lateral electric field of n+n-p+ junction. Analytical results agree reasonably with the numerical simulations using PISCESII.

• 전자공학회논문지 IE
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• v.44 no.1
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• pp.10-14
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• 2007

Analytical expression for breakdown voltages of InP diodes is induced by employing the effective ionization coefficient extracted from ionization coefficients for electron and hole in InP. The analytical results for breakdown voltage are compared with numerical and experimental results for the doping concentration, $N_D=6\times10^{14}cm^{-3}\sim3\times10^{17}cm^{-3}$. The analytical results show good agreement with the numerical data. Good fits with the experimental results are found for the breakdown voltages within 10% in error at each doping concentration.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.59-60
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• 2006

원통형 PN접합의 Baliga의 해석적인 항복전압에 대한 근사식을 유도하였다. 근사식은 접합길이, $r_j$와 공핍층 깊이, $W_{pp}$의 비 ($r_i/W_{pp}$)가 0.1보다 작은 경우 Baliga식과 잘 일치하였다. 농도에 대한 원통형 접합의 항복전압의 민감도를 유도하였으며, 근사식을 사용한 경우가 Baliga식의 경우보다 민감도식이 더 간단하기 때문에, 민감도를 고려한 소자 설계 시 활용될 수 있으리라 기대된다. 민감도 식을 이용하여 설계한 결과 항복전압의 편차가 10% 이내로 제어하기 위해서는 도핑농도가 $10^{15}cm^{-3}$이고 접합깊이가 $5{\mu}m$ 인 원통형 접합인 경우 농도 편차가 12.8%이내 이어야한다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.42 no.10 s.340
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• pp.9-18
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• 2005

Analytical expressions for breakdown voltages of abrupt $p^{+}n$ junction of Si, GaAs, InP and In$In_{0.53}Ga_{0.47}AS$ were induced. Getting analytical breakdown voltages, effective ionization coefficients were extracted using lucky drift parameters of Marsland for each materials. The results of analytical breakdown voltages followed by ionization integral agreed well with experimental result within 10$\%$ in error for the doping concentration in the range of $10^{14}cm\;^{-3}\~5\times10\;^{17}cm\;^{-3}$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.1
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• pp.12-17
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• 2002

In this paper, an effective ionization coefficient for 4H-SiC is extracted in the form of c .E$^{m}$ from ionization coefficients of electron and hole. Analytical expressions for critical electric field and breakdown voltage of 4H-SiC p$^{+}$n junction are derived by employing the effective ionization coefficient. The analytic results agree well with the experimental ones reported within 10% in error for the doping concentration in the range of 10$^{15}$ cm$^{-3}$ ~10$^{18}$ cm$^{-3}$ . .

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.6
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• pp.1460-1464
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• 2010

In the paper, the breakdown voltage of Trench D-MOSFET have been analyzed by using MircoTec. The technology for characteristic analysis of device for high integration is changing rapidly. Therefore to understand characteristics of high-integrated device by computer simulation and fabricate the device having such characteristics became one of very important subjects. A Trench MOSFET is the most preferred power device for high voltage power applications. The oxide thickness and doping concentration in Trench MOSFET determines breakdown voltage and extensively influences on high voltage. We have investigated the breakdown voltage characteristics according to variation of doping concentration from $10^{15}cm^{-3}$ to $10^{17}cm^{-3}$ in this study. We have also investigated the breakdown voltage characteristics according to variation of oxide thickness and junction depth.