• Journal of Adhesion and Interface
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• v.15 no.4
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• pp.169-173
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• 2014

The effect of filler sizes on the thermal diffusivity of Nylon 66/SiC composites was investigated. By loading 60 vol% of SiC fillers on Nylon 66, the thermal diffusivity of the composites increased more than 10 times than that of unfilled Nylon 66 and the thermal diffusivity of composites with filler sizes of $24{\mu}m$ and $76{\mu}m$ increased to $2.2{\times}10^{-2}cm^2/sec$ and $1.75{\times}10^{-2}cm^2/sec$, respectively. It is speculated that the smaller filler size ($24{\mu}m$) of SiC is more favorable for the formation of thermal conductive path that the larger size ($76{\mu}m$) of filler composites. The thermal diffusivity of Nylon 46/SiC 400 (60 vol%) composites was $1.61{\times}10^{-2}cm^2/sec$ that was lower than that of Nylon 66/SiC (60 vol%) composites.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.305-305
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• 2007

SOFC용 밀봉유리$({\sim}10.0{\times}10^{-7}/K)$의 열팽창 계수를 SUS430$({\sim}12.0{\times}10^{-7}/K)$ 인터커넥터에 매칭 시키기 위하여 모유리에 비하여 열팽창계수가 큰 $CaTiO_3\;({\sim}13.5{\times}10^{-7}/K)$ 입자를 필러로서 첨가하였다. 필러입자의 첨가량이 증가함에 따라 밀봉재의 열팽창 계수가 증가하고, 동일 함량의 필러를 첨가하는 경우 필러 입자의 크기가 작을 수록 밀봉재의 연화점 상승 폭이 커서 SUS430 기판과의 접합 상태가 불량해짐을 관찰하였다. 필 테스트, 접합시험, 미세구조 분석 등을 통하여 필러 입자 크기가 증가 할 수록 SUS430과의 접합이 가능한 범위 내에서 보다 많은 양의 필러를 첨가하는 것이 가능하기 때문에 열팽창 계수 제어가 용이하다는 것을 확인 할 수 있었다.

• 전자공학회논문지 IE
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• v.43 no.4
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• pp.122-127
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• 2006

A series of conductive filler were prepared with electroless plating method. Base conductive materials of the filler were nickel and copper. The cores were prepared with Nylon 6 and rayon in different aspect ratio. Also, various complexes were made with ABS resin and conductive filler with different filler feed ratio. The conductivity of the filler was measured with conductivity analyzer and the size distributions of fillers was measured with laser particle size analyzer. Electromagnetic wave shielding efficiency of each complex film was measured with flange circular coaxial transmission line sample holder within the 1MHz$\sim$1GHz bandwidth range. From this study, the conductivity of filers surpass that of other carbon films. It is available that the filler made of fibrous materials can be applied in plastic molding industry of electric appliances as a EMI filler.

• Composites Research
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• v.34 no.1
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• pp.63-69
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• 2021

In order to develop an integrated heat dissipating material and gas barrier film for electronics, new polymer was designed and synthesized for preparing composites containing hexagonal boron nitride (hBN) filler. Depending on the size and content of the hBN filler, both thermal conductivity and oxygen transmission rate can be adjusted. The composite achieved a high thermal conductivity of 28.0 W·m-1·K-1 at most and the oxygen transmission rate was decreased by 62% compared to that of the filler free matrix. Effective filler aspect ratios could be estimated by comparing thermal conductivity and oxygen transmission rate with values predicted by theoretical models. Discrepancy on the aspect ratios extracted from thermal conductivity and oxygen transmission rate comparisons was also discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.158-158
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• 2008

모바일 정보통신기기를 중심으로 실장모듈의 초소형화, 고집적화로 인해 접속단자의 피치가 점점 미세화 됨에 따라 플립칩 본딩용 접착제에 함유되는 무기충전제인 실리카 필러의 크기도 미세화되고 있다. 본 연구에서는 NCP (non-conductive paste)의 실리카 필러의 크기가 COB(chip-on-board) 플립칩 패키지의 신뢰성에 미치는 영향을 조사하였다. 실험에 사용된 실리카 필러는 Fused silica 3 종과 Fumed silica 3종이며 response surface 실험계획법에 따라 혼합하여 최적의 혼합비를 정하였다. 테스트베드로 사용된 실리콘 다이는 투께 $700{\mu}m$, 면적 5.2$\times$7.2mm로 $50\times50{\mu}m$ 크기의 Au 도금범프를 $100{\mu}m$ 피치, peripheral 방식으로 형성시켰으며, 기판은 패드를 Sn으로 finish 하였다. 기판을 플라즈마 전처리 후 Panasonic FCB-3 플립칩 본더를 이용하여 플립칩 본딩을 수행하였다. 패키지의 신뢰성 평가를 위해 $-40^{\circ}C{\sim}80^{\circ}C$의 열충격시험과 $85^{\circ}C$/85%R.H.의 고온고습시험을 수행하였으며 Die shear를 통한 접합 강도와 4-point probe를 통한 접속저항을 측정하였다.

• International Journal of Highway Engineering
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• v.10 no.4
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• pp.181-187
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• 2008

This paper presents the results of the effects on the inclusion of the pigment in the color asphalt mixture. The particle size of the pigment is extremely finer than that of the filler and should be reduced the amount of the filler used. It was found in the present practise that the total weight of 2% of the pigment in the weight of the total aggregate was used during the mix design. The extra inclusion of the pigment in the mixture increased the amount of the filler and affected on the volumetric properties such as void ratio and VMA. It has related with the performance and distress of the pavement and found that the mechanical properties have decreased.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.56-56
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• 2004

• Journal of the Korea Institute of Military Science and Technology
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• v.2 no.2
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• pp.234-241
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• 1999

본 논문에서는 얇은 직사각형 단면 형상을 가지는 세 가지 서로 다른 유동로 안에서 움직이는 공기버블의 변형 거동에 대한 실험을 수행하였다. 압력 차이로 유체는 유동되며, 유동장을 따라서 변형하는 버블의 정상상태 모양을 관찰하였다. 벽면효과를 알아보기 위해 세 종류의 얇은 사각단면을 사용하였으며, 두 가지 종류의 작동 유체, 버블의 초기 크기, 작동 유체의 유량 등을 변화시켰을 때 이에 대한 공기 버블의 변형을 체계적으로 관찰하고 이들의 관계를 고찰하였다. 실험데이타를 정량화하여 캐필러리 수에 대한 버블의 무차원 속도비와의 관계를 상세하게 고찰하였다. 글리세린의 경우는 항상 버블 선단부의 곡률이 후단의 곡률보다 더 작게 나타났으며 실리콘 오일의 경우와 반대 경향이 관찰되었다. 두 경우 모두 캐필러리 수에 대한 속도비와 세장비 값은 1 보다 큰 값을 가졌다. 실리콘 오일의 경우는 주어진 Ca 수에 대하여 속도비가 글리세린의 경우보다 더 크게 나왔으며 버블 크기에 따른 속도비 분산도가 더 조밀하게 나타났다. 사각 단면 폭이 감소할수록 벽면 효과는 증대되었으며 같은 폭에 대해서는 버블 변형이 축소관의 경우가 가장 크게 나타났다.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.21-27
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• 2000

To develop the underfill materials which are required for the new process of semi-conductor industry, the properties of epoxy/anhydride/cobalt(II) catalyst system with two types of fused silica(1 $\mu\textrm{m}$, 8 $\mu\textrm{m}$) are studied as a function of filler fraction. According to the curing profile, the optimum catalyst amount was 1.0 wt% for full curing at the conditions of $160^{\circ}C$/l5 min., and we could conclude that the viscosity has superior effect on the real flaw through the relationship between surface tension and viscosity data. The underfills which were filled with 1 $\mu\textrm{m}$ fused silica did not show good flowability, but they should be useful by improving the viscosity for a future process which has small gaps. The underfills which were filled with 8 $\mu\textrm{m}$ fused silica showed good flowability when the filler contents were 55~60 vol%. The model which was referred by Matthew can predict the real flow length only when the underfill has high viscosity and low surface tension.

• Polymer(Korea)
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• v.36 no.6
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• pp.733-738
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• 2012

The effect of glass bead and glass fiber on the enhancement of dimensional stability in poly(ethylene naphthalate) (PEN) flexible substrate for photovoltaic devices has been studied. It was found that the coefficient of thermal expansion (CTE) and the optical transmittance decreased with increasing inorganic filler content. In addition to filler contents, the size and size distribution of fillers are the other important factors to improve CTE and optical transmittance of PEN film. Our results showed that the optimum filler content was found to be about 5 wt% to enhance the dimensional stability of PEN by more than 50% with maintaining the optical transmittance over 85% for the flexible substrate.