• Journal of the Society of Naval Architects of Korea
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• v.31 no.2
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• pp.65-77
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• 1994

This paper presents a derailed application procedure of the linear quadratic(LQ) theory for a SWATH heave and pitch control. A time domain model of coupled, linear time-invariant second order differential equations is derived from the frequency response model with the frequency dependent added mass and damping approximated as constant values at the heave natural frequency. Wave exciting forces are modeled as a sum of sinusoids. A systematic selection procedure of state and control weighting matrices is presented to obtain good transient behavior and acceptable fin movement. The validity of this controller design process is throughly investigated by simulations both in time domain and frequency domain and singular value plots of transfer function matrices. The finally designed control system shows good overall performances revealing that the applicability of the present study is proved successful.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.11
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• pp.1-5
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• 2010

We developed a novel micro-electro mechanical systems (MEMS) test socket using silicon on insulator (SOI) substrate with the cantilever array structure. We designed the round shaped cantilevers with the maximum length of $350{\mu}m$, the maximum width of $200{\mu}m$ and the thickness of $10{\mu}m$ for $650{\mu}m$ pitch for 8 mm x 8 mm area and 121 balls square ball grid array (BGA) packages. The MEMS test socket was fabricated by MEMS technology using metal lift off process and deep reactive ion etching (DRIE) silicon etcher and so on. The MEMS test socket has a simple structure, low production cost, fine pitch, high pin count and rapid prototyping. We verified the performances of the MEMS test sockets such as deflection as a function of the applied force, path resistance between the cantilever and the metal pad and the contact resistance. Fabricated cantilever has 1.3 gf (gram force) at $90{\mu}m$ deflection. Total path resistance was less than $17{\Omega}$. The contact resistance was approximately from 0.7 to $0.75{\Omega}$ for all cantilevers. Therefore the test socket is suitable for BGA integrated circuit (IC) packages tests.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.7
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• pp.2323-2327
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• 2010

The experimental apparatus consists of dehumidifier with multi-layer type heat exchangers to remove the moisture from automatic equipments, semiconductors, and manufacturing processes under the low temperature environment, and chemical production lines which are likely to take moisture. The major components of this system are four evaporators with different fin pitch, two compressors, two condensers and an expansion valve. In this study, the performance characteristics of dehumidifier is analyzed by the variations of frontal air velocity in the first heat exchanger(evaporator). The cooling capacity of each heat exchanger is acquired by the enthalpy calculating from measuring point of temperature and relative humidity of the first heat exchanger from 1.0m/s to 4.0m/s with increasing interval 0.5m/s, and the front air velocity. As a result, it is found that cooling capacity of the first heat exchanger showed the best cooling capacity when its frontal air velocity is 2.0 m/s.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Composites Research
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• v.34 no.5
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• pp.290-295
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• 2021

The application of lightweight structural composites to automobiles as a solution in line with global fuel economy regulations to curb global warming is recognized as a megatrend. This study was conducted to provide a technical approach that can respond to the issue of replacing parts that require conductive properties to maximize the application of thermoplastic carbon fiber reinforced plastics (CFRPs), which are advantageous in terms of repair, disposal and recycling. By utilizing the properties of the low-viscosity polymerizable oligomer matrix, it was possible to prepare a thermoplastic CFRP exhibiting excellent impregnation properties while uniformly mixing the conductive filler. Various carbon-based conductive fillers such as carbon black, carbon nanotubes, graphene nanoplatelets, graphite, and pitch-based carbon fibers were filled up to the maximum content, and electrical and thermal conductive properties of the fabricated composites were compared and studied. It was confirmed that the maximum incorporation of filler was the most important factor to control the conductive properties of the composites rather than the type or shape of the conductive carbon filler. Experimental results were observed in which it might be advantageous to apply a one-dimensional conductive carbon filler to improve electrical conductivity, whereas it might be advantageous to apply a two-dimensional conductive carbon filler to improve thermal conductivity. The results of this study can provide potential insight into the optimization of structural design for controlling the conductive properties of thermoplastic CFRPs.

• Korean Journal of Optics and Photonics
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• v.28 no.3
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• pp.108-115
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• 2017

We report the assembly procedure and performance evaluation of a visible and near-infrared spectrometer in the wavelength region of 400-900 nm, which is later to be combined with fore-optics (a telescope) to form a f/2.5 imaging spectrometer with a field of view of ${\pm}7.68^{\circ}$. The detector at the final image plane is a $640{\times}480$ charge-coupled device with a $24{\mu}m$ pixel size. The spectrometer is in an Offner relay configuration consisting of two concentric, spherical mirrors, the secondary of which is replaced by a convex grating mirror. A double-pass test method with an interferometer is often applied in the assembly process of precision optics, but was excluded from our study due to a large residual wavefront error (WFE) in optical design of 210 nm ($0.35{\lambda}$ at 600 nm) root-mean-square (RMS). This results in a single-path test method with a Shack-Hartmann sensor. The final assembly was tested to have a RMS WFE increase of less than 90 nm over the entire field of view, a keystone of 0.08 pixels, a smile of 1.13 pixels and a spectral resolution of 4.32 nm. During the procedure, we confirmed the validity of using a Shack-Hartmann wavefront sensor to monitor alignment in the assembly of an Offner-like spectrometer.