• Title/Summary/Keyword: 플라즈마디스플레이

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A Study on Plasma Corrosion Resistance and Cleaning Process of Yttrium-based Materials using Atmospheric Plasma Spray Coating (Atmospheric Plasma Spray코팅을 이용한 Yttrium계 소재의 내플라즈마성 및 세정 공정에 관한 연구)

  • Kwon, Hyuksung;Kim, Minjoong;So, Jongho;Shin, Jae-Soo;Chung, Chin-Wook;Maeng, SeonJeong;Yun, Ju-Young
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.3
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    • pp.74-79
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    • 2022
  • In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y2O3 and Y3Al5O12 (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF4, O2, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H2SO4(3):H2O2(1)) to remove the defect-causing surface fluorinated film. APS-Y2O3 and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

증착 환경 변화에 따른 인이 첨가된 ZnO 박막의 물성연구

  • Jeong, Yeong-Ui;Lee, Seung-Hwan;Hwang, Seon-Min;Jo, Chang-U;Bae, Jong-Seong;Park, Seong-Gyun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.299-299
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    • 2012
  • 투명전도산화물 박막은 디스플레이, 태양전지, 압전소자 등 다양한 응용분야에 많이 이용되고 있는 소재이다. 그 중에서 현재 산업에서 활용 빈도가 높은 투명전도막의 재료는 ITO를 기반으로 하는 물질이다. 하지만 인듐의 높은 생산단가와 플라즈마 노출시 열화로 인한 문제점 때문에 기존의 ITO를 대체하기 위한 새로운 재료에 관심이 증대되고 있다. 본 연구에서는 대표적인 ITO 대체 물질 중의 하나인 ZnO 박막에 대해서 증착환경변화에 따른 물성변화를 조사하였다. 먼저 대기중에서 안정화된 ZnO 박막을 얻기 위해서 인(P) 2% 첨가된 ZnO 세라믹을 고상반응법으로 제작하고, 펄스레이저 증착법을 이용하여 Al2O3(0001)기판에 산소분압을 30~150 mTorr로 변화를 주어 P-ZnO 박막을 제작하였다. 이 때 증착온도는 $400^{\circ}C$로 고정하였다. X선 회절 결과로부터 산소분압에 상관없이 ZnO (002)방향으로 증착되었다. 하지만 결정립의 크기는 산소분압이 증가하면서 줄어들고, ZnO (002)피크로부터 얻어진 격자상수(c-축)는 벌크 값에 가까워짐을 알 수 있었다. 하지만 P첨가로 인해서 박막의 격자상수는 순수한 ZnO 벌크 값 보다 큰 것으로 알 수 있다. 산소분압 변화에 따른 P-ZnO 박막의 산화 상태는 X-선 광전자 분광기를 이용하여 측정하였다. 그 결과 산소 core-level의 스펙트럼은 자연산화, 산소 vacancy, Zn-O 결합으로 구성되어짐을 알 수 있었다. 산소분압이 증가하면 Zn-O 결합은 증가하지만 산소 vacancy는 감소함을 알 수 있었다. 전기적 특성 결과 P-ZnO 박막은 30 mTorr에서는 n형 반도체 특성, 100 mtorr에서 p형 반도체의 특성이 나타내었고, 산소분압이 증가하면 다시 n형 반도체 특성을 나타냄을 알 수 있었다. 광학적 특성 결과 P-ZnO 박막은 산소분압에 상관없이 가시광선 영역에서 80%이상의 투과율을 나타내었으며, 산소분압이 증가할수록 에너지 갭이 증가하였다.

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Direct Patterning Technology of Indium Tin Oxide Layer using Nd:$YVO_4$ Laser Beam (Nd:$YVO_4$ 레이저 빔을 이용한 인듐 주석 산화물 직접 묘화 기술)

  • Kim, Kwang-Ho;Kwon, Sang-Jik
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.11
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    • pp.8-12
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    • 2008
  • For the reduction of fabrication cost and process time of AC plasma display panel (PDP), indium tin oxide (ITO) layer was patterned as bus electrode using Nd:$YVO_4$ laser. In comparison with the chemically wet etched ITO patterns, laser ablated ITO patterns showed the formation of shoulders and ripple-like structures at the edge of the ITO lines. For the reduction of shoulders and ripple-like structures, pulse repetition rate and scan velocity of laser was changed. In addition, we analyzed a discharge characteristic of PDP test panel to observe how the shoulders and ripple-like structures influence on the PDP. Based on experimental results, the pattern etched at the 500 mm/s and 40 kHz was better than any other condition. From this experiment we could see the possibility of the laser direct patterning for the application to the patterning of ITO in AC-PDP.

Ni-Cr 합금의 재결정 집합조직 형성에미치는 Cr 함량의 영향

  • Kim, Hyo-Min;Kim, Han-Sol;Kim, Won-Yong
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.11a
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    • pp.46.2-46.2
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    • 2009
  • 휴대전화, 랩톱 컴퓨터 등 각종 모바일기기 및 디스플레이 기기의 경박단소화 및 고기능화에 따라 연성회로기판(FPCB)의 사용량이 증가하고있다. 연성회로기판의 핵심소재인 동박적층필름(FCCL)은 폴리이미드필름과 접착층, Cu 층으로 구성되는데, 이 중접착층으로 사용되는 Ni-20Cr합금은 에칭공정 후 Cr의 잔류에 의해 불량률 증가가 문제되고 있어, Ni-Cr합금 스퍼터링 타깃의 Cr 함량 저감 또는 Cr-free Ni합금 개발 등이 요구되고 있다. 본 연구에서는 차세대 FCCL 본드층에 적합한 Ni기 합금을 개발하기 위한 기초연구로써 Cr 함량 및 가공열처리조건에 따른 미세조직과 집합조직 변화를 조사하였다. 4N급의 고순도Ni과 Cr을 진공 플라즈마 용해장치로 용해하여Ni-xCr (x=5, 10, 15, 20wt.%)합금 잉곳을 만들고, 이를 두께감소율 90%로 냉간압연한 후, $600^{\circ}C$$800^{\circ}C$에서 10~120분 동안 어닐링하여 시편을 준비하였다. 광학현미경으로 미세조직을 관찰하고, Micro-Vickers 경도시험을 통해 어닐링 조건에 따른 경도변화를 조사하였다. 또한 SEM-EBSD를 이용하여 집합조직 및 입계특성을 분석하였다. $600^{\circ}C$ 어닐링 시 Cr함량이 증가할수록 재결정 완료시간이 증가하여 Ni-20Cr합금의 경우 2시간이상 어닐링에도 재결정이 일어나지 않았다. $800^{\circ}C$ 어닐링 시 10분 어닐링 조건에서 4종류 합금 모두 재결정이 완료되었으며, 동일한 어닐링 조건에서 Cr함량이 증가할수록 결정립이 작아지는 것으로 나타났다. $800^{\circ}C$ 2시간 어닐링 조건에서 Ni-5Cr 합금의 주요 집합조직은 {223}<113>과 {122}<112>로 나타났으며, 이중 {223}<113>은Cr 함량이 증가함에 따라 점차 {122}<112>에 가까운 방향으로 변화되어 Ni-20Cr 합금의 경우 {123}<112>만이 형성되었다. 이러한 집합조직의 변화는 적층결함에너지 감소에 의한 ${\Sigma}3$ 입계의 분율 증가와 밀접한 관련이 있는 것으로 사료된다.

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Synthesis of Concentrated Silver Nano Sol for Ink-Jet Method (잉크젯용 고농도 은 나노 졸 합성)

  • Park, Han-Sung;Seo, Dong-Soo;Choi, Youngmin;Chang, Hyunjoo;Kong, Ki-Jeong;Lee, Jung-O;Ryu, Beyong-Hwan
    • Journal of the Korean Ceramic Society
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    • v.41 no.9
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    • pp.670-676
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    • 2004
  • The synthesis of highly concentrated silver nano sol assisted by polymeric dispersant (polyelectrolytes) for inkjet method was studied. The silver nano sol was prepared with AgNO$_3$, polyelectrolytes (HS5468cf ; polyacrylic ammonium salt), and reducing agent. The polyelectrolytes play an important role in formation of complex composed of Ag$\^$+/ion and carboxyl group (COO$\^$-/), result in preparation of highly dispersed silver nano particles. The optimization of added amount of polyelectrolytes, and concentration of silver nano sol was studied. The silver nanoparticles were evaluated by XRD, particle size/zeta potential analyzer and FE-TEM. The silver nanoparticles with the range of 10 nm in diameter were produced. The concentration of batch-synthesized silver nano sol was possible up to 40 wt%.

A Study on Plasma Display Panel Barrier Rib Fabrication by Mold and Electromagnetic Wave (몰드와 전자기파에 의한 PDP격벽의 성형에 관한 연구)

  • Son, Jae-Hyeok;Im, Yong-Gwan;Jeong, Yeong-Dae;Jeong, Seong-Il;Jeong, Hae-Do
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.6
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    • pp.176-183
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    • 2002
  • Plasma Display Panel(PDP) is a type of flat panel display utilizing the light emission produced by gas discharge. Barrier Ribs of PDP separating each sub-pixel prevents optical and electrical crosstalks from adjacent sub-pixels. The mold for forming the barrier ribs has been newly researched to overcome the disadvantages of conventional manufacturing processes such as screen printing, sand-blasting and photosensitive glass methods. The mold for PDP barrier ribs have stripes of micro grooves transferring glass-material wall. In this paper , Stripes of grooves of which width 48$\mu$m, depth 124$\mu$m , pitch 274$\mu$m was acquired by machining of single crystal silicon with dicing saw blade. Maximum roughness of the bottom of the grooves was 59.6 nm Ra in grooving Si. Barrier ribs were farmed with silicone rubber mold, which is transferred from grooved Si forming hard mold. Silicone rubber mold has the elasticity, which enable to accommodate the waviness of lower glass plate of PDP. The methods assisted by the microwave and UV was adopted for reducing the forming time of glass paste.

The Analysis of the Discharging Characteristics and MgO protective layer by MgO Evaporation Rates for High-Efficiency PDP (MgO 증착률에 따른 PDP 보호막 물성 및 방전 특성 분석)

  • Kim, Yong-Jae;Kwon, Sang-Jik
    • Journal of the Korean Vacuum Society
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    • v.16 no.3
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    • pp.181-186
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    • 2007
  • We have investigated and analyzed the effects of the evaporation rate of MgO films on the MgO properties and the discharge characteristics of a plasma display panel(PDP). The MgO properties such as the crystal orientation, the surface roughness, the film structure, and cathode-luminescence (CL) spectra were inspected using XRD (X-ray diffraction), AFM(atomic force microscopy). And the discharging characteristics of the PDP such as the firing voltage, discharging current, and luminescence were measured using a vacuum chamber with oscilloscope (TDS 540C), current probe (TCP-312A), color meter (CS-100A) and etc. From the experiments results we confirmed the optimum evaporation rate at $5{\AA}/sec$, the MgO properties were shown to be strongly dependent on the evaporation rate, and the MgO properties had an effecton the optical and electrical characteristics. In other words, if the evaporation rates increase than $5{\AA}/sec$, the intensity of (200) orientation and cathode-luminescence (CL) spectra reduce, and the firing vlotage was increased. So the luminuous efficiency grows worse.

The Delay-Time Characteristics of DC Discharge in the Discharge Logic Gate Plasma Display Panel (방전논리게이트 플라즈마 디스플레이 패널의 직류방전 지연특성)

  • Ryeom, Jeong-Duk;Kwak, Hee-Ro
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.21 no.1
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    • pp.28-34
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    • 2007
  • In this research, the characteristics of the DC discharge that was the logical gate input of discharge logic gate PDP newly proposed was considered. The logical output is induced by controlling the potential difference of inter-electrode according to the discharge path in the discharge logic gate. From the experimental result the discharge time lag was shortened to 1/3 and the voltage has decreased to 1/2 in the case to apply priming discharge for improving stability of these DC discharges compared with the case when it is not applied. Moreover, after the priming discharge ends, the space charge generated by this discharge influences it up to about $30[{\mu}s]$. And, as a measured result of the influence that the space charge exerts on the DC discharge with the change in time and spatial distance, it has been understood that there is a possibility that going away spatially can slip out the influence of the discharge easily as for going away from the discharge time-wise. Therefore the conclusion that the discharge logic gates of each scanning electrode can be operated independently is obtained.

Discharge Characteristics of Narrow Width Pulse Addressing for the High-Speed Driving of Plasma Display Panels (플라즈마 디스플레이 패널의 고속 구동을 위한 세폭 펄스 어드레스 방전특성)

  • Ryeom, Jeong-Duk
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.21 no.7
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    • pp.13-19
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    • 2007
  • This study relates to a new high-speed drive method for the full-HD PDP with 1080 horizontal scanning lines. The characteristics of the new drive method is evaluated considering the characteristics of the display discharge by the high-speed addressing. In this drive method, if the width of the address pulse narrows, the relati0[V]e discharge strength and the discharge time lag of the first display discharge are received the influence of it. Though the change in the applied position of the address pulse is unrelated to the discharge strength, it influences at the discharge time lag. However, the stable display discharges can be induced regardless of the address pulse position and width if the address pulse position is within [$6{\mu}s$] and the width is up to [$0.7{\mu}s$]. From the experiments, it has been understood that the high-speed drive technique with the address pulse of narrow width is sensitively influenced by the space charge because of the insufficiency of wall charge.

Electrical and Optical Characteristics of Plasma Display Panel Fabricated by Vacuum In-line Sealing (진공 인라인 실장에 의해 제작된 플라즈마 디스플레이 패널의 전기적ㆍ광학적 특성)

  • Park, Sung-Hyun;Lee, Neung-Hun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.4
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    • pp.344-349
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    • 2005
  • The optical and electrical characteristics of plasma display panel(PDP) using the vacuum in-line sealing technology compared with the conventional sealing process in this research. This PDP consisted of MgO protecting layer by e-beam evaporation and battier rib, transparent dielectric layer, dielectric layer, and electrodes by screen printer and then sealed off on Ne-Xe(4 %) 400 Torr and 430。C. The brightness and luminous efficiency were good as the base vacuum level was higher, and it was to check the advantage of high vacuum level sealing, one of the strong points of the vacuum in-line sealing process. However, the brightness and luminous efficiency was dropped sharply because of a crack on MgO protecting layer by the difference of the expansion and contraction stress on high temperature in the vacuum states between MgO and substrate. Fortunately, the crack was prevented by MgO was deposited on higher temperature than 300。C. Finally, the PDP, was fabricated by the vacuum in-line sealing process, resulted the lower brightness than processing only the thermal annealing treatment in the vacuum chamber, but the luminous efficiency was increased by the reducing power consumption with the decreasing luminous current. The vacuum in-line sealing technology was not to need the additional thermal annealing process and could reduce the fabrication process and bring the excellent optical and electrical properties without the crack of MgO protecting layer than the conventional sealing process.