• Journal of Advanced Navigation Technology
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• v.22 no.2
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• pp.133-140
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• 2018

In recent years, model-based design techniques have been used as a way to support cost reduction and safety certification in the development of avionics systems. In order to support performance analysis and safety analysis of aircraft and avionics equipment (item) using model based design, we developed a multi-domain simulation environment that inter-works with heterogeneous simulators. We present a multi-domain simulation environment that can verify air data computers and integrated multi-function probes at the aircraft level. The model was developed by Simulink and the flight simulator X-Plane 10 was used to verify the model at the aircraft level. Avionics model functions were tested at the aircraft level and the air data errors of the model and flight simulator were measured within 0.1%.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.8
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• pp.808-820
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• 2014

In this paper, we fabricated two on-wafer type DUT(Device-Under-Test)s; a 10-dB attenuator and an amplifier using commercially available MMIC and we proposed the measurement method of the noise parameters for the two fabricated DUTs. Since the 10-dB attenuator DUT is a passive device, its noise parameters can be accurately determined when its S-parameters are measured. In the case of the amplifier DUT, its noise parameters are available in the datasheet. Hence, the measured noise parameters using the proposed method can be assessed by comparing with the known noise parameters. The noise parameter measurement method having been presented by the authors requires the S-parameters of the 8-port network used in the measurement and limited to coaxial type DUTs. When on-wafer probes are included in the 8-port network, the 8-port S-parameters requires the measurements with different kinds of connectors. In this paper, we obtained the 8-port S-parameters using the Smart-Cal function in the network analyzer. The measured noise parameters shows about ${\pm}0.2dB$ fluctuations for $NF_{min}$. Other noise parameters with the frequency change show good agreement with the expected results.

• Investigative Magnetic Resonance Imaging
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• v.13 no.2
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• pp.171-176
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• 2009

Purpose : To investigate the effect of coating material in RF coil, which is one of main parts in MRI machine, on the Q-factor and SNR(signal-to-noise ratio) in MR images. Materials and Methods : RF coils with inner diameter of 1.7 mm were made by using copper wires coated with polyester, polyurethane, polyimide, polyamideimide, and polyester-imide, and by using copper wires in which coating materials had been removed. Q-factors of the RF coils were measured by network analyzer, and SNR values in the spin-echo MR images obtained by 600 MHz (14.1 T, Bruker DMX600) micro-imaging system for the coated and uncoated cases. Results : The measured SNRs were almost same for the RF coils with coat-removed copper wires, however SNRs and Q-factors were different for the coated cases depending on the coating material. They were maximized in the polyurethane-coated case in which the SNR was > 30% greater than polyester-coated case. Conclusion : We made solenoid-type RF coils which were easily used for MR micro-imaging in Bruker MRI probe. There was a significant coating-material dependence in the measured Q values and SNRs for the home-made RF coils. The study demonstrated that the choice of coating material of RF coil may be a critical factor in the MRI sensitivity based on SNR value.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.12
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• pp.1805-1810
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• 2010

We present a simple, cost-effective, and fast fabrication process for three-dimensional (3D) microstructures; this process is based on multi-step electrochemical etching of metal foils which facilitates the mass production of 3D microstructures. Compared to electroplating, this process maintains uniform and well-controlled material properties of the microstructure. In the experimental study, we perform single-step electrochemical etching of aluminum foils for the fabrication of 2D cantilever arrays. In the single-step etching, the depth etch rate and bias etch rate are measured as $1.50{\pm}0.10 {\mu}m/min$ and $0.77{\pm}0.03 {\mu}m/min$, respectively. Using the results of single-step etching, we perform two-step electrochemical etching for 3D microstructures with probe tips on cantilevers. The errors in height and lateral fabrication in the case of the fabricated structures are $15.5{\pm}5.8% $ and $3.3{\pm}0.9%$, respectively; the surface roughness is $37.4{\pm}9.6nm$.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.289-299
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• 2005

The ball shear force was investigated in terms of test parameters, i.e. displacement rate and probe height, with an experimental and non-linear finite element analysis for evaluation of the solder joint integrity in area array packages. The increase in the displacement rate and the decrease in the probe height led to the increase in the shear force. Excessive probe height could cause some detrimental effects on the test results such as unexpected high standard deviation and probe sliding from the solder ball surface. The low shear height conditions were favorable for assessing the mechanical integrity of the solder joints. The mechanical and electrical properties of the Sn-37Pb/Cu and Sn-3.5Ag/Cu BGA solder joints were also investigated with the number of reflows. The total thickness of the intermetallic compound (IMC) layers, consisting of Cu6Sn5 and Cu3Sn, was increased as a function of cubic root of reflow time. The shear force was increased up to 3 or 4 reflows, and then was decreased with the number of reflows. The fracture occurred along the bulk solder, in irrespective of the number of reflows. The electrical resistivity was increased with increasing the number of reflows.