• Composites Research
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• v.30 no.2
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• pp.138-144
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• 2017

Damage sensing of polymer composite films consisting of poly(dicyclopentadiene) p-DCPD and carbon nanotube (CNT) was studied experimentally. Only up to 1st ring-opening polymerization occurred with the addition of CNT, which made the modified film electrically conductive, while interfering with polymerization. The interfacial adhesion of composite films with varying CNT concentration was evaluated by measuring the wettability using the static contact angle method. 0.5 wt% CNT/p-DCPD was determined to be the optimal condition via electrical dispersion method and tensile test. Dynamic fatigue test was conducted to evaluate the durability of the films by measuring the change in electrical resistance. For the initial three cycles, the change in electrical resistance pattern was similar to the tensile stress-strain curve. The CNT/p-DCPD film was attached to an epoxy matrix to demonstrate its utilization as a sensor for fracture behavior. At the onset of epoxy fracture, electrical resistance showed a drastic increase, which indicated adhesive fracture between sensor and matrix. It leads to prediction of crack and fracture of matrix.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Restorative Dentistry and Endodontics
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• v.12 no.2
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• pp.45-53
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• 1987

The purpose of this study was to evaluate the tensile bond strength between composite resin and the human enamel. Three composite resin systems, two chemical (Clearfil Posterior, and Clearfil Posterior-3) and one light cure (Photo Clearfil-A), used with and without an intermediate resin (clearfil bonding agent), were evaluated under different amounts of load (10g, 200g and 200g for a moment) for in vitro tensile bond strength to acid-eched human enamel. Clinically intact buccal or lingual surfaces of 144 freshly extracted human permanent molars, embedded in acrylic were flattened with No #600 carborundum discs. Samples were randomly assigned to the different materials and treatments using a table of random numbers. Eight samples were thus prepared for each group(Table 2) these surfaces were etched with an acid etchant (Kurarey Co. Japan) in a mode of etching for 30 seconds, washing for 15 seconds, and drying for 30-seconds. During the polymerization of composite resin on the acid-etched enamel surfaces with and without bonding agent 10-gram, 200 gram and temporary 200 gram of load were applied. The specimens were stored in 50% relation humidity at $37^{\circ}C$ for 24 hours before testing. An universal Testing machine (Intesco model No. 2010, Tokyo, Japan) was used to apply tensile loads in the vertical directed (fig 5), and the force required for separation was recorded with a cross head speed of 0.25 mm/min and 20 kg in full scale. The results were as follow: 1. The tensile bond strength was much greater in applying a bonding agent than in not doing that. 2. The tensile bond strength of chemical cure composite resin was higher than that of light cure composite resin with applying on bonding agent on the acid-etched enamel. 3. In case of not applying a bonding agents on the acid-etching enamel, the highest tensile bond strength under 200 gram of load was measured in light cure composite resin. 4. The tensile bond strength under 200-gram of load has no relation with applying the bonding agent. 5. Under the load of 10-gram, There was significant difference in tensile bond strength as applying the bonding agent.

• Applied Chemistry for Engineering
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• v.30 no.5
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• pp.597-605
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• 2019

In order to improve the adhesion of water-based adhesive, gemini type nonionic reactive surfactants were synthesized and applied to water-based adhesives. The surfactants were synthesized by using maleic acid and polyoxyethylene cetyl ether having different length of ethylene oxide and confirmed by FT-IR and $^1H-NMR$. Their appearance was light yellow wax. The cloud point of the compound was more than $78^{\circ}C$. The measured critical micelle concentration (c.m.c) was $1.0{\times}10^{-4}{\sim}7.0{\times}10^{-4}mol/L$ and surface tension at c.m.c was 25.9~32.0 mN/m. As the number of ethylene oxide increased, the emulsifying power was improved. The foaming height of each compound by Ross-Miles method was 1.4~4.5 cm. The synthesized surfactants was then used as an emulsifier in emulsion polymerization of water-based adhesives and its physical properties were evaluated. The solid contents of prepared adhesives was 59%. The average particle size and initial tackiness of the prepared adhesives were 164~297 nm and ball no. of 20~32, respectively. The peel strength was $1.8{\sim}2.1kg_f/mm$. The retention rate of adhesives viscosity was evaluated to 99% during 30 days. Therefore, synthesized gemini type nonionic reactive surfactants are expected to be applied as an emulsifier for the high adhesive force.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of Dental Rehabilitation and Applied Science
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• v.28 no.2
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• pp.119-126
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• 2012

State of problem: Cement-retained implant-supported prostheses are routinely used in dentistry. The use of high strength cements has become more popular with the increasing confidence in the stability of the implant-abutment screw connection and the high survival rates of osseointegrated implants. No clinical data on retention of metal copings using CAD/CAM. To evaluate retention of metal copings using CAD/CAM system bonded to short titanium abutment with four different cements and compare retentive strength of metal copings with sandblasting or without sandblasting before cementation. Forty titanium abutment blocks were fabricated and divided into 4 groups of 10 samples each. Forty metal copings with occlusal hole to allow for retention testing were fabricated using CAD/CAM technology. The four cements were Fujicem(Fuji, Japan), Maxcem Elite(Kerr, USA), Panavia F2.0(Kurarary, Japan) and Superbond C&B(Sunmedical, Japan). The copings were cemented on the titanium abutment according to manufacture's recommendation. All samples were stored for 24h at 37oC in 100% humidity and tested for retention using universal testing machine(Instron) at a crosshead speed of 1.0mm/min. Force at retentive failure was recorded in Newton. The mode of failure was also recorded. Means and standard deviations of loads at failure were analyzed using ANOVA and Paired t-test. Statistical significance was set at P<0.05. Panavia F2.0 provided significantly higher retentive strength than Fujicem, Maxcem Elite(P<0.05). Sandblasting significantly increased bond strength(P<0.05). The mode of failure was cement remaining principally on metal copings. Within the limitation of this study, Panavia F2.0 showed significantly stronger retentive strength than Fujicem, Maxcem Elite(p<0.05). The Ranking order of the cements to retain the copings was Panavia F2.0, Fujicem = Maxcem Elite. Sandblasting significantly increased bond strength(P<0.05). The retentive strength of metal copings on implant abutment were influenced by surface roughness and type of cements.

• Restorative Dentistry and Endodontics
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• v.25 no.1
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• pp.46-55
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• 2000

During bonding procedure of composite resin, the prepared cavity can be contaminated by saliva. In this study, marginal microleakage and shear bond strength of a composite resin to primed enamel and dentin treated with artificial saliva(Taliva$^{(R)}$) were evaluated. For the marginal microleakage test, Class V cavities were prepared in the buccal surfaces of fifty molars. The samples were randomly assigned into 5 groups with 10 samples in each group. Control group was applied with a bonding system (Scotchbond$^{TM}$ Multi-Purpose plus) according to manufacture's directions without saliva contamination. Experimental groups were divided into 4 groups and contaminated with artificial saliva for 30 seconds after priming: Experimental 1 group ; artificial saliva was dried with compressed air only, Experimental 2 group ; artificial saliva was rinsed and dried. Experimental 3 group ; cavities were etched with 35% phosphoric acid for 15 seconds after rinsing and drying artificial saliva. Experimental 4 group ; cavities were etched with 35% phosphoric acid for 15 seconds and primer was reapplied after rinsing and drying artificial saliva. All the cavities were applied a bonding agent and filled with a composite resin (Z-100$^{TM}$). Specimens were immersed in 0.5% basic fuschin dye for 24 hours and embedded in transparent acrylic resin and sectioned buccolingually with diamond wheel saw. Four sections were obtained from one specimen. Degree of marginal leakage was scored under stereomicroscope and their scores were averaged from four sections. The data were analyzed by Kruscal-Wallis test and Fisher's LSD. For the shear bond strength test, the buccal or occlusal surfaces of one hundred molar teeth were ground to expose enamel(n=50) or dentin(n=50) using diamond wheel saw and its surface was smoothed with Lapping and Polishing Machine(South Bay Technology Co., U.S.A.). Samples were divided into 5 groups. Treatment of saliva-contaminated enamel and dentin surfaces was same as the marginal microleakage test and composite resin was bonded via a gelatin capsule. All specimens were stored in distilled water for 48 hours. The shear bond strengths were measured by universal testing machine (AGS-1000 4D, Shimaduzu Co., Japan) with a crosshead speed of 5 mm/minute. Failure mode of fracture sites was examined under stereomicroscope. The data were analyzed by ANOVA and Tukey's studentized range test. The results of this study were as follows : 1. Enamel marginal microleakage showed no significant difference among groups. 2. Dentinal marginal microleakages of control, experimental 2 and 4 groups were lower than those of experimental 1 and 3 groups (p<0.05). 3. The shear bond strength to enamel was the highest value in control group (20.03${\pm}$4.47MPa) and the lowest value in experimental 1 group (13.28${\pm}$6.52MPa). There were significant differences between experimental 1 group and other groups (p<0.05). 4. The shear bond strength to dentin was higher in control group (17.87${\pm}$4.02MPa) and experimental 4 group (16.38${\pm}$3.23MPa) than in other groups, its value was low in experimental 1 group (3.95${\pm}$2.51 MPa) and experimental 2 group (6.72${\pm}$2.26MPa)(p<0.05). 5. Failure mode of fractured site on the enamel showed mostly adhesive failures in experimental 1 and 3 groups. 6. Failure mode of fractured site on the dentin did not show adhesive failures in control group, but showed mostly adhesive failure in experimental groups. As a summary of above results, if the primed tooth surface was contaminated with artificial saliva, primer should be reapplied after re-etching it.

• Journal of the Korean Electrochemical Society
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• v.26 no.1
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• pp.1-10
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• 2023

The cathode, which is one of the four major components of a lithium secondary battery, is an important component responsible for the energy density of the battery. The mixing process of active material, conductive material, and polymer binder is very essential in the commonly used wet manufacturing process of the cathode. However, in the case of mixing conditions of the cathode, since there is no systematic method, in most cases, differences in performance occur depending on the manufacturer. Therefore, LiMn₂O₄ (LMO) cathodes were prepared using a commonly used THINKY mixer and homogenizer to optimize the mixing method in the cathode slurry preparation step, and their characteristics were compared. Each mixing condition was performed at 2000 RPM and 7 min, and to determine only the difference in the mixing method during the manufacture of the cathode other experiment conditions (mixing time, material input order, etc.) were kept constant. Among the manufactured THINKY mixer LMO (TLMO) and homogenizer LMO (HLMO), HLMO has more uniform particle dispersion than TLMO, and thus shows higher adhesive strength. Also, the result of the electrochemical evaluation reveals that HLMO cathode showed improved performance with a more stable life cycle compared to TLMO. The initial discharge capacity retention rate of HLMO at 69 cycles was 88%, which is about 4.4 times higher than that of TLMO, and in the case of rate capability, HLMO exhibited a better capacity retention even at high C-rates of 10, 15, and 20 C and the capacity recovery at 1 C was higher than that of TLMO. It's postulated that the use of a homogenizer improves the characteristics of the slurry containing the active material, the conductive material, and the polymer binder creating an electrically conductive network formed by uniformly dispersing the conductive material suppressing its strong electrostatic properties thus avoiding aggregation. As a result, surface contact between the active material and the conductive material increases, electrons move more smoothly, changes in lattice volume during charging and discharging are more reversible and contact resistance between the active material and the conductive material is suppressed.