• Journal of the Korea Convergence Society
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• v.9 no.12
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• pp.1-7
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• 2018

Gentry is responsible for moving the fine chip in the device that mounts the chip on the PCB. However, it is not easy to increase productivity because of the mechanical limitations of the gantry. Therefore, in this paper, we try to solve the method to increase the productivity by software. For this purpose, we propose a method to improve the productivity by shortening the movement time of the gantry. First, we calculated the total travel time for the current method(stop-motion). In addition, the total travel time is also calculated for the travel time reduction method presented in this paper. This method reduces the travel time by checking parts without stopping in front of the camera. As a result, we showed that the proposed method shortened the time of 16%. In the future, we will study time calculation methods for other types.

• KIPS Transactions on Software and Data Engineering
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• v.10 no.10
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• pp.385-390
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• 2021

The gantry is a device that moves fine chips from the feeder to the PCB. While the gantry is moving the part, the camera checks the condition of the part. The purpose of this paper is to find the path with the shortest travel time of the gantry and calculate the travel time according to the path. stop_motion is a way to check the status of the parts currently in use. This paper presents the moving_motion method and the fly_motion method with maximum speed in front of the camera. In addition the signature method was used to inspect the condition of the parts. When comparing the moving time of the three types of gantry, the moving_motion method improved by 9.42% and the fly_motion method by 17.73% compared to stop_motion. When the fly_motion method proposed in this paper is used for the gantry movement path, it is expected that productivity will be improved.

• Journal of the Korea Society of Computer and Information
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• v.27 no.11
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• pp.115-121
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• 2022

In surface mount technology (SMT), the screen printer, which is an equipment for applying solder cream, has a lot of poor coating as the pad becomes smaller. To solve this problem, a jet printer is being used recently. However, if the nozzle at the end of the valve applied to the jet printer head is not cleaned, solder cream remains or an error occurs. To prevent this, the nozzles should be cleaned periodically. In this paper, a more stable cleaning method than the existing technology is presented for the stable application of solder cream on a jet printer. In this method, cut a 35mm wide mujin cloth, wrap it in a roll, and rotate it with a DC geared motor on the other side to clean it. As a result, it was confirmed that the solder paste was not left on the nozzle surface and was well wiped when cleaning with about 2,000 dotting cycles.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.105-109
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• 2015

In this study, a new airbag sensor packaging technique of directly attachment by adhesive to the automobile frame is introduced. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module attached mechanically by bolts with plastic housing and the new sensor packaging were installed to aluminum channel, and the results were compared with each other. Numerical analysis was also performed to investigate the signal characteristics created by the sensors. The preliminary results showed that the pattern of the MEMS sensor signal was strongly dependent on the structural behavior of the frame where the sensors were installed, which indicated the complexity of the packaging design for proper airbag deployments.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.