• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.6
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• pp.1465-1468
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• 2010

The wet etching is a process using chemical solution and occurring chemical reaction on substrate surface. when we do wet etching process, we have to consider stoichiometry, etching time and temperature of etchant for good resolution. In this experiment, we used Cr, Al andIndium-tin-oxide (ITO) metal and we deposited them with DC sputtering machine. The Cr thin film metal thickness is about $1300{\AA}$, ITO films show a low electrical resistance and high transmittance in the visible range of an optical spectrum and Ai film is used for signal line. We measured and analysed wet etching properties on the metal thin films.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.226.1-226.1
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• 2014

이온빔 소스는 반도체 및 디스플레이 공정에 있어, 표면 에칭 및 증착 등 여러 응용 분야에 활발히 이용되고 있다. 본 연구에 사용된 원형 이온빔 소스는 선형 이온빔 소스의 가장자리에서의 특성 분석을 위해 제작되었으며, 높은 직류전압과 자기장 공간에서 플라즈마를 방전시키고 발생된 이온들을 가속시켜 높은 에너지의 이온빔을 발생시킨다. 이온빔 특성 분석을 위해 전위지연 탐침과 패러데이 탐침을 개발하였다. 전위지연 탐침은 격자판에 전압을 인가하여 선택적으로 이온을 수집하고, 이온의 에너지분포함수를 측정한다. 패러데이 탐침은 이온 수집기와 가드링으로 구성되어 수집기 표면에 일정한 플라즈마 쉬스를 형성하여 정확한 이온전류밀도를 측정한다. 본 연구에서는, 아르곤 기체를 이용하여 기체유량(8~12 sccm) 및 방전전압(1~2 kV)에 따라 방전전류 16~54 mA, 소모전력 16~108 mW의 특성을 보였다. 운전압력은 0.4~0.54 mTorr이며, 이온소스로부터 18 cm 거리에서 이온전류밀도와 이온에너지분포를 측정하였다. 또한, 중공음극선을 이용하여 인위적으로 전자를 이온 소스에서 발생된 플라즈마에 공급하고 이온빔 및 플라즈마의 특성 변화를 위 시스템에서 분석하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.24-24
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• 2018

One of the challenges in tissue engineering is the design of optimal biomedical scaffolds, which can be governed by topographical surface characteristics, such as size, shape, and direction. Of these properties, we focus on the effects of nano - to micro - sized hierarchical surface. To fabricate the hierarchical surface structure on poly(${\varepsilon}$-caprolactone) (PCL) film, we employed a nano/micro-casting technique (NCT) and modified plasma process. The micro size topography of PCL film was controlled by sizes of the micro structures on lotus leaf. Also, the nano-size topography and hydrophilicity of PCL film were controlled by modified plasma process. After the plasma treatment, the hydrophobic property of the PCL film was significantly changed into hydrophilic property, and the nano-sized structure was well developed, as increasing the plasma exposure time and applied power. The surface properties of the modified PCL film were investigated in terms of initial cell morphology, attachment, and proliferation using osteoblast-like-cells (MG63). In particular, initial cell attachment, proliferation and osteogenic differentiation in the hierarchical structure were enhanced dramatically compared to those of the smooth surface.

• Journal of the Korean institute of surface engineering
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• v.27 no.3
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• pp.158-165
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• 1994

Cu-Cr alloy thin film requires good quality of etching be used for TAB technology. The etched cross sec-tion was clean enough when the etching was performed in 0.1M $FeCl_3$ solution at $50^{\circ}C$. The etching rate was increased with the amount of $KMnO_4$. For enhanced profile of cross section and rate, the spray etchning was found to be superior compared to the immersion etching. A series of experiments were performed to improve the uniformity of the current distribution in electrodeposition onto the substrate with lithographic patterns. Copper was electrodeposited from quiescent-solution, paddle-agitated-solution, and air-bubbled-solution to in-vestigate the effect of the fluid flow. The thickness profile of the specimen measured by profilmetry has the non uniformity at feature scale in quiescent-solution, because of the longitudinal vortex roll caused by the natural convection. However, uniform thickness profile was achieved in paddle-agitated or air bubbled solu-tion.

• ETRI Journal
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• v.13 no.4
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• pp.10-24
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• 1991

본 연구에서는 기상 성장법 (VPE : vapor phase epitaxy) 으로 성장된 $n^+(Si:2X10^18cm^-3)$/$n(Si:1x10^17cm^-3)$구조의 시편 위에 SiN 과 감광막 등 식각 선택비가 서로 다른 두 물질로 보호된 소스와 드레인 사이의 게이트 형성 영역을 건식식각과 습식식각방법으로 리세스 에칭을 하여 형성한 후, 게이트를 자기정렬하여 형성시킬 수 있는 이중 리세스공정 기술을 개발하였고, 이를 통하여 전력용 MESFET 소자를 제작하였다.게이트 형성부분의 wide recess 폭은 건식식각으로 SiN을 측면식각(lateral etch) 함으로써 조절하였는데, 이 방법을 사용하여 MESFET 소자의 임계전압을 조절할 수 있고, 동시에 소스-드레인 항복전압을 30V 까지 향상시킬 수 있었다. 소스-드레인 항복전압은 wide recess 폭이 증가함에 따라, 그리고 게이트 길이가 길어짐에 따라 증가하는 경향을 보여주었다. 이 방법으로 제작한 여러종류의 MESFET 중에서 게이트 길이가 $2\mum$이고 소스-게이트 간격이 $3 \mum$인 MESFET의 전기적 특성은 최대 트랜스컨덕턴스가 120 mS/mm, 게이트 전압이 0.8V 일 때 포화드레인전류가 170~190mA/mm로 나타났다. 제작된 MESFET이 ($NH_4$)$_2$$S_x$ 용액에 담금처리될때 , 공기중에 노출된 게이트-드레인 사이의 n-GaAs층의 표면이 유황으로 보호되어 공기노출에 의한 표면 재산화막의 형성이 억제되었기 때문으로 사료된다.

• Journal of the Korean institute of surface engineering
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• v.26 no.3
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• pp.149-157
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• 1993

In the study of TAB(Tape Automated Bonding)technologies, Cu-Cr sputtered seed layer has been used to improve the adhesion between Polyimide and Cu film and electrical properties. But the Cu electrodeposit on Cu-Cr film had poor adhesion or powder-like form due to the surface Cr oxides on the Cu-Cr film. By means of activating the Cu-Cr film with the oxalic acid and phosphoric acid, the Cu film with the improved adhesion could be coated on the Cu-Cr sputtered film in CuSO4 solution. The etching rate was compared with increasing the Cr content of the sputtered Cu-Cr film, and anodic polarization curve in FeCl3 solution was investigated. With increasing the Cr content, the etching rate was reduced. The clean etching cross section could be obtained with increasing the concentration of FeCl3 solution. But above the 13 w/o Cr content, Cu-Cr sputtered film could not bed etched cleanly only with FeCl3 solution and additives were needed.

• Elastomers and Composites
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• v.35 no.1
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• pp.53-62
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• 2000

Zinc plated steel tire cords were treated with RF plasma polymerization coating of acetylene or butadiene in order to enhance adhesion to rubber compounds. Plasma polymerization was carried out as a function of plasma power, treatment tune and gas pressure. In order to maximize adhesion, argon plasma etching was performed, with carrier gas such as argon, nitrogen and oxygen, while the adhesion of tire cords was evaluated via TCAT. Best results were obtained from a combination treatment of argon etching (90 W. 10 min, 30 mTorr) and acetylene plasma polymerization coating (10 W, 30 sec, 30 mTorr) with argon carrier gas (25/5:acetylene/argon). These samples exhibited a pull out force of 285N which is comparable to that obtained from the brass plated tire cords (290N).

• Journal of the Korean Magnetics Society
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• v.14 no.2
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• pp.59-64
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• 2004

We investigated the soft magnetic properties of nanocrystalline Fe-Al-O film as etching the oxide film with ion beam etching method. It is thought that the grain size of Fe-Al-O film increases as the thickness decreases. The coercivity and squareness increase with decreasing thickness. The surface curvature of Am images increases when the etching experiment proceeds. This phenomena could be due to the grain growth which occurs during sputtering. This grain growth could be assisted by the the plasma energy during sputtering. Therefore proper thickness should be searched to acquire the good soft magnetic properties for the nanocrystalline film material. Good soft magnetic properties of Fe-Al-O film was acquired at the thickness of more than 900 nm.

• Applied Chemistry for Engineering
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• v.9 no.4
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• pp.463-468
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• 1998

When sulfuric acid was added in HCl etching solution, corrosion of aluminum metal was inhibited by the chemical adsorption of sulfate ions. In the presence of $SO_4^{-2}$, cyclic voltammetry showed that the protective oxide film was formed on the inner surfaces of etch pits and, pit density was increased by nucleation on both the aluminum surface and the pits inside. Structure and distribution of etch pits found in AC etching of aluminum were strongly influenced by the concentration of $SO_4^{-2}$ and the amount of cathodic pulse charging. Below $0.8mC/cm^2$ of cathodic pulse charging, oxide films formed inside actively dissolving pits indicated the higher resistance to pit nucleation as the concentration of $SO_4^{-2}$ increases. However, the structural change of oxide films occurred above the $0.8mC/cm^2$ charging and the effect of $SO_4^{-2}$ was minimized, and it resulted in the rapid formation of etch pits.

• Elastomers and Composites
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• v.34 no.2
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• pp.128-134
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• 1999

Steel tire cords were coated via RF plasma polymerization of acetylene and butadiene gas in order to enhance adhesion to rubber compounds. Adhesion of tire cords was measured by TCAT and T-test as a function of type of gas, plasma powder, treatment time, gas pressure and Ar gas etching. Some samples were subjected to aging study in distilled water at $80^{\circ}C$ for a period of 7 days. After testing, tire cords were analysed by SEM to elucidate the adhesion mechanism. The highest adhesion values were obtained at 20W, 2min and 25mtorr for acetylene plasma polymerization, and l0W, 4min, 25mtorr for butadiene plasma polymerization. However, Ar plasma etching did not affect adhesion, while the adhesion of tire cords increased rather than decreased, contrary to expectations. It was not possible to elucidate failure mode by SEM, owing to the rough surface of the tire and the thin plasma polymer coating layer.