• Title/Summary/Keyword: 표면에칭

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A Study on the Characteristics of Stiction and Friction of Texture Surface (표면 구조 변화에 따른 응착과 마찰 특성에 관한 연구)

  • Yang, Ji-Cheol;Kim, Dae-Eun
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.7
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    • pp.51-58
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    • 2002
  • In this paper, the characteristics of silicon wafer surface which is textured by KOH anisotropic etching method and mechanical polishing are investigated from the viewpoint of stiction and friction. It was found that the characteristics of stiction and friction of each textured surface are dependent on the contact area characterized by surface parameters such as bearing length ratio and peak count. To find the mechanism of the variation of stiction and friction in textured surface, OTS SAM coated wafer was used. In this case, the variation of stiction and friction was diminished, Therefore, it is concluded that the reason of variation of stiction and friction on textured surface is mainly caused by capillary which in turn is affected by the surface topography

The Influence of Electrolytic Condition on Tunnel Etching and Capacitance Gain of High purity Aluminium Foil on capacitor (전해조건이 고순도 알루미늄 박 콘덴서의 터널에칭과 정전용량에 미치는 영향)

  • 이재운;이병우;김용현;이광학;김흥식
    • Journal of the Korean institute of surface engineering
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    • v.30 no.1
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    • pp.44-56
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    • 1997
  • Influence of electrochemical etching conditions on capacitance gain of aluminium electrolytic on capacitor foil has been investigated by etching cubic textured high purity aluminum foil in dilute hydrochloric acid. Uniformly distributed etch pit tunnels on aluminum surface have been obtained by pretreatment aluminium foil in 10% NaOH solution for 5 minutes followed by electrochemical etching. Electrostatic capacitance of etched aluminium foil anodized to high voltage increased with the increase of current density, total charge, temperature and concentration of electrolyte up to maximum CV-value and then deceased. Election optical observation of the etched foil revealed that the density of etch of etch pits increased with the increase of current density and concentration of electrolyte. this increase of etch pit density enlarged of the increase of capacitance. However, abnormal high current density and high electrolyte concentration induced the local dissolution of the foil surface which resulted the decrease of foil capacitance.

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나노스케일 절삭현상의 분자동역학적 시뮬레이션

  • 성인하;김대은;장원석
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.129-129
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    • 2004
  • 본 연구에서는 나노스케일 절삭가공(nanometric cutting process)시에 미세 팁과 가공표면사이에서 발생하는 현상들에 대하여 분자동역학적 시뮬레이션을 통하여 살펴보았다 본 연구의 목적은 실험적으로는 파악하기 어려운 극미세 가공에서 발생하는 나노트라이볼로지적 현상을 이해하고, 이를 토대로 기계적 가공에 기반하여 개발된 '기계-화학적 나노리소그래피(Mechano-Chemical Scanning Probe Lithography)' 공정을 개선, 발전시키는데 있다. 기계-화학적 나노리소그래피 기술은 극초박막의 리지스트(resist)를 미세탐침을 이용하여 기계적 가공으로 제거하고 이로인해 표면으로 드러난 모재부분을 화학적 에칭에 의해 추가로 가공하여 원하는 패턴형상을 얻어내는 기술이다.(중략)

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Fabrication of flexible printed circuit board(FPCB) using metal-micro-pattern(MMP) technique (연성인쇄회로기판(FPCB)대체 금속미세회로(MMP) 제조기술)

  • Kim, Man;Choe, Seung-Hoe;Lee, Sang-Yeol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.103.1-103.1
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    • 2018
  • 기존의 연성인쇄회로기판(FPCB)은 top down방식에 의한 에칭기술이 일반화되어 있으나, 고가의 장비를 사용한 제조방식과 복잡한 공정으로 인하여 품질수준은 높은 편이나 제조단가가 매우 비싼 편이다. 기존의 값비싼 top down방식을 대체하여 저렴한 가격으로 FPCB를 대체하려는 기술들이 지속적으로 연구되고 있다. 그중에서 가장 기술개발이 활발한 분야가 인쇄(잉크젯 혹은 레이저)방식이지만 아직 인쇄노즐의 크기와 잉크의 전도도에 한계가 있어 사용에 많은 제약이 있다. 그러나 금속미세회로(MMP)기술은 도금방식에 의한 bottom up기술로 회로의 정밀도와 전도도가 높으면서 연속제조방식에 의한 대량생산이 가능하므로 저렴하게 생산할 수 있어, 기존의 FPCB제조공정을 대체할 기술로 각광받고 있다.

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Fabrication Processes of Interconnection Systems for Bare Chip Burn-In Tests Using Epitaxial Layer Growth and Etching Techniques of Silicon (실리콘 에피층 성장과 실리콘 에칭기술을 이용한 Bare Chip Burn-In 테스트용 인터컨넥션 시스템의 제조공정)

  • 권오경;김준배
    • Journal of the Korean institute of surface engineering
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    • v.28 no.3
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    • pp.174-181
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    • 1995
  • Multilayered silicon cantilever beams as interconnection systems for bare chip burn-in socket applications have been designed, fabricated and characterized. Fabrication processes of the beam are employing standard semiconductor processes such as thin film processes and epitaxial layer growth and silicon wet etching techniques. We investigated silicon etch rate in 1-3-10 etchant as functions of doping concentration, surface mechanical stress and crystal defects. The experimental results indicate that silicon etch rate in 1-3-10 etchant is strong functions of doping concentration and crystal defect density rather than surface mechanical stress. We suggested the new fabrication processes of multilayered silicon cantilever beams.

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Electorchemical Etching of Anode Foil for Aluminum electorlytic Capacitors (알루미늄 전해 콘덴서용 양극박 전해 에칭)

  • 이중선;유연철
    • Journal of the Korean institute of surface engineering
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    • v.26 no.5
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    • pp.271-279
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    • 1993
  • Experiments on electorchemical etching of aluminum foils with high cubic textures were carried out in this study. Etching behaviours and pit shapes with respect to various conditions of eletrochemical etching were in-vestigated. When HCl and NaCl solutions were used as electrolytes, the highest capacitanes were observed in solutions of 1MHCl and 5M NaCl. It was foundd that capacitance was improved by addition of H2SO4 to HCl so-lution which is considered to be due to the suppression of oxide film formation on the aluminum surface. The homogeneous distribution of each pits obtained in the HCl solution, while the degree of weight loss was lowest in the Nacl solution. The best etching properties in 1M HCl solution were obtained at the etching condi-tions of 0.15 A/$\textrm{cm}^2$, 150sec and$ 90^{\circ}C$.

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Recovery of Pure Alumina Powder from the Wasted Aluminum Etching Solution by Precipitation Method (알루미늄 에칭폐액으로부터 침전법에 의한 순수 알루미나분말의 회수)

  • 김기호;강병철
    • Journal of the Korean institute of surface engineering
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    • v.25 no.3
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    • pp.150-157
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    • 1992
  • A recovery process of pure alumina powder from the wasted aluminum etching solution of electrolytic condenser works was studied. The possibility of this process was considered in the basis of thermodynamic data nad physico-chemical properties for the recovered materials were tested. In order to obtain pure alumina, Fe3+ and Cu2+ in the solution as impurities were solvent-extracted, respectively, and then, Al3+ was precipitated by changing the pH of the solution. As the results, more than 99.9% of Al3+ in the solution was recovered by the precipitation method. The weight of the precipitate was reduced to about 65 wt.% of the original one by calcination and the sizes of the recovered powders were in order of 3-5$\mu\textrm{m}$. The precipitates were transformed to $\alpha$-Al2O3 at the calcination temperature about 120$0^{\circ}C$.

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Second Harmonic Generation on the Surface of Porous Silicon Superlattice (초격자 다공질규소 표면에서 제 2고조파 발생)

  • Cho, Chang-Ho;Park, Jong-Dae
    • The Journal of Natural Sciences
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    • v.12 no.1
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    • pp.31-39
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    • 2002
  • Second harmonic generation was measured in porous silicon superlattices surface which were made by changing and anodization current density and the anodization time periodically in the process of obtaining porous silicon. The technique of second harmonic generation is used as a probe to the surface of porous silicon superlattice by using Nd:YAG laser. We have investigated the surface structure and nonlinear-optics properties of porous silicon superlattice.

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화학복필름접착을 위한 최적화된 플라즈마 조건 확립

  • Park, Pyeong-Gyu;Choe, Yeong-Deok;Kim, Ui-Yong;Go, Jae-Seon;Yun, Byeong-Seon
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.59.2-59.2
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    • 2009
  • 화학보호복은 독성이 있는 화학물질 및 미세분진등에 대해 공기를 차단하며 완전 밀폐형으로 공기호흡기 및 에어라인 같은 호흡보호장치와 함께 착용하여 신체부위를 보호한다. 그 예로 생물/화학보호복은 유독하고 해로운 생물/화학물질로 부터 인체를 보호해준다. 이들 보호복은 다양한 환경이 노출되어 장시간 작업을 위해서 오랜시간 보호성능을 유지해야한다. 특히, 이런 원단의 구성은 플라스틱과 고무류의 다층구조로 구성되어있다. 플라스틱류(폴리에틸렌, PTFE 등)는 표면장력이 너무 낮아 접착하는데 어려운 점이 많이 대두된다. 일반적인 표면처리방법은 크게 물리화학적 방법으로 4가지로 분류한다. 화학적산화, 불꽃처리, 플라즈마처리, UV 방사법 등이 있다. 이들 중에서 가장 간단한 산화처리는 플라즈마처리다. 이처리는 상온/상압하에서 대기 중 또는 가스내에 방전에 의해 플라즈마를 형성하고 이 플라즈마가 대상물의 표면분자와 격렬히 반응하게 하여 표면의 분자구조를 변화시킴에 따라 소수성의 표면에 Carboxyl, hydroxyl과 carbonyl과 같은 친수성으로 변하여 결합능력을 증가 시켜 표면장력을 높여주는 가장 효과적인 방법이다. 플라즈마 표면처리를 하고 나면 육안으로 표면의 변화를 감지할 수 없지만 접착, 잉크, 코팅을 잘 받아들이는 결과를 가져온다. 플라즈마 표면처리의 효과는 주로 부도체의 필름이나 합성수지 계열의 인쇄성과 접착성을 향상시키고자 많이 활용되고 있는 실정이다. 특히, 화학보호복과 같은 플라스틱류인 다양한 고분자 합성수지(Polyethylene, polypropylene, nylon, vinyl, PVC, PET 등)에 적용가능하다. 본 연구에서는 플라즈마처리조건에 영향을 주는 변수들을 고려하여 실험계획법(DOE, RSM)을 이용하여 최적화된 플라즈마 공정을 향상시키고자한다.

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Fabrication of Aluminum Powder Disk by a Template Method and Its Etching Condition for an Electrode of Hybrid Supercapacitor (Template 방법을 이용한 Hybrid Supercapacitor 전극용 알루미늄 분말 디스크 제조와 에칭 조건 연구)

  • Jin, Chang-Soo;Lee, Yong-Sung;Shin, Kyung-Hee;Kim, Jong-Huy;Yoon, Soon-Gil
    • Journal of the Korean Electrochemical Society
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    • v.6 no.2
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    • pp.145-152
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    • 2003
  • Capacitance of a hybrid capacitor that has characteristics of both electrolyte capacitor and supercapacitor is determined by anode surface covered with oxide layer. In this study, optimal condition processes for anode to fabricate a high voltage hybrid capacitor was investigated. We mixed aluminum powder having mean particle size of $40{\mu}m$ with NaCl powders at weight ratio of 4 : 1 and prepared a disk type electrode after annealing at various temperature. After dissolving NaCl in $50^{\circ}C$ distilled water, heat treatment, eletropolishing, chemical treatment, and the first and the second etching of Al disk were conducted. In each process, capacitances and resistances of the disk measured by ac-impedance analyzer were compared to find its optimum treatment condition. Also, the surface morphology of treated disks were observed and compared by SEM. After the second etching, the Al disk was anodized at 365V to make an anode of hybrid supercapacitor that can be operated at 300V, Capacitance and resistance of the anodized Al disk electrode was compared with those of commercialized conventional aluminum electrolytic capacitor at different frequencies.