• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.273-274
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• 2011

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.3
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• pp.53-60
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• 2004

We have developed and manufactured an experimental ultrasonic polishing machine with frequency of 20kHz at the power of vibration 1.7㎾ for effective ultrasonic polishing in processing of high hardness material. Design of the horn is performed by the FEM analysis. The following conclusions were empirically deduced through experimental results to clarify the major elements which affect the surface roughness during the ultrasonic process by following the experimental plans. The ultrasonic polishing machine has been developed in parts of structure part, ultrasonic generator, vibrator. We were able to process the high hardness material without difficulty as a result of ultrasonic polishing by utilizing the groove added step-type horn. Through analyzing by applying the experimental plans, the rotating speed of the horn was determined to be the major factor in influencing the surface roughness. In the case of ceramic, wafer, we were able to obtain good surface roughness when the feed rate and the ultrasonic output were higher. Because the load on slurry particle increases when the ultrasonic output is higher, the processed surface becomes worse in the case of optical glass.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.1
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• pp.109-115
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• 2004

Polishing process has been applied to get extremely fine surfaces, e.g., mirror surfaces such as optical mirrors, lens, molds and etc. Nowadays not only fine surface quality but also submicron order of dimensional accuracy is required for many applications. To meet the requirements polishing process should be provided with an active control of polishing pressure especially for automation of polishing process. In this paper a study on development of an active polishing pressure control system has been presented. A new type of tool assembly has been developed to facilitate the control. The tool is attached to an axis of a polishing machine with a coil spring and control of the polishing pressure is done by the position control of the axis, which needs no additional actuator. The polishing pressure is successfully measured by the measurement of the spring deformation. Control specifications were quantitatively considered by weighting functions and a controller was designed by using loop-shaping technique based on the no synthesis. Some experiments have been executed on a polishing machine with a PC-NC controller. It is shown that the results were coincident well with the theoretical analyses and satisfied the design specifications.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.6
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• pp.48-54
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• 2012

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon. However, for many companies, it is hard to produce 400mm or 450mm wafers, because of excesive funds for exchange the equipments. Therefore, it is necessary to investigate 300mm wafer to obtain a better efficiency and a good property rate. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This research investigated the surface characteristics that apply variable machining conditions and Taguchi Method was used to obtain more flexible and optimal condition. In this study, the machining conditions have head speed, oscillation speed and polishing time. By using optimum condition, it achieves a ultra precision mirror like surface.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.1-6
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• 2008

In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very important. However, most of these investigation was experiment less than 300mm diameter. Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study reports the machining variables that has major influence on the characteristic of wafer polishing. It was adapted to polishing pressure, machining speed, and the slurry mix ratio, the optimum condition is selected by ultra precision wafer polishing using load cell and infrared temperature sensor. The optimum machining condition is selected a result data that use a pressure and table speed data. By using optimum condition, it achieves a ultra precision mirror like surface.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.11a
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• pp.211-212
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• 2023

Polishing tiles among porcelain tiles are more durable and aesthetic than ceramic tiles, so their demand has recently increased. In particular, since polishing tiles have a very low absorption rate, organic adhesives with chemical bonds are mainly used. However, organic adhesives have low economic efficiency and some volatile organic compounds (TVOCs). Therefore purpose of this study was to evaluate the performance of polishing tile adhesion by developing organic-inorganic adhesives, which have chemical bonds and mechanical bonds. As a result, since the amorphous chain and chemical bonds of the polymer in the tile adhesives, both tensile and shear adhesion strength were satisfied with the KS L 1592, KS L 1593, and the rate of length change itself in the thermal cycling was lower than organic adhesives. So it is thought that it is possible to replace some organic adhesives.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.24-28
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• 1996

Mirror-like polishing system of hemisphericall high-speed precision bearing for digital VTR drum was developed. Mechamism of the polishing process was analyzed in the view point of polishing contact range and contact length between the tool and the workpiece surface. It was suggested that the two stage polishing process adoptiong the diamond grinding wheel and polishing tool instead of multistage lapping processes, which enables the mass production of the bearing by reduction of polishing time.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.5
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• pp.218-223
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• 2001

The chemical-mechanical polishing process was carried out for 2"-dia. sapphire wafer grown by horizontalBridgman method on the urethane lapping pad with the silica sol. The polished wafer shows the full-width at halfmaximum of 200~400 arcsec in double-crystal X-ray diffraction, indicating that the slicing, grinding and lapping processes before the polishing process affected the crystalline structural property of the wafer surface by the mechanical residual stress. For the inclusion of surface treatments after chemical-mechanical polishing such as the thermal annealing at the temperature of $1,200^{\circ}C$for 4 hrs. and chemical etching, the crystalline quality was sigdicantly enhanced with the reduced full-width at half maximum up to 8.3 arcsec.arcsec.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

• The Science & Technology
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• v.32 no.2 s.357
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• pp.86-87
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• 1999

98년 10월 27일부터 3일간 미국 세인트루이스에서 제13차 미국정밀학회 연례학술회의가 열렸다. 유럽ㆍ한국ㆍ일본 등 각국에서 3백여명이 참석한 이번 학술대회에서 강원대 장인배교수 연구팀은 자기부상을 이용한 초정밀 직선운동 테이블에 대한 연구를 4년째 발표하여 많은 찬사를 받았다. 이번 학회는 렌즈가공을 주 대상으로 한 연삭 및 폴리싱 등의 가공방법에 대한 연구가 주종을 이루었다.