• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.74-78
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• 2002

Ultra-Precision CNC polishing system including on-machine measurement system, a corrective polishing algorithm is developed. The unit removal profiles for various polishing tools and analyzed and tested and dwell time distributions and residual errors for a target removal shape are calculated. The corrective polishing algorithm is tested with various workpieces. This result will be used for the software development of the CNC polishing system.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.2 no.1
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• pp.15-21
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• 2003

The ultrasonic polishing machine was developed to get super finishing that consist of machine part that can rotate and travel the main shaft with power 1.5kW, ultrasonic generator with frequency 20kHz. By using this machine we were investigated the characteristics of ultrasonic polishing for three different ceramics, and so could be obtained following results. First, we could be obtained the excellent surface for hard-ta-difficult cutting materials. Second, the effect of surface roughness for the feed rate could be shown that the more the feed rate Increases, the more the value of surface roughness increases. Third, owing to the characteristics being progressed brittle fracture in $Al_2O_3$ polishing with this machine, the value of surface roughness is larger than other ceramics. Forth, because the ultrasonic polishing can be smoother than the existing grinding in discharging the chips, it could be possible to improve the surface roughness about up to 15%.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1014-1020
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• 2003

We have developed the ultrasonic polishing system to get super finishing that consist of machine part that can rotate and travel the main shaft with power 1.5kW, ultrasonic generator with frequency 20kHz. By using this system we were investigated the characteristics of ultrasonic polishing and deduced the major facters which affect the surface roughness by the experimental plans for three different materials such as ceramic, glass, and wafer, and so could be obtained following results. We could be obtained the excellent surface for hard-to-difficult cutting materials. The rotating speed could be found to be major factor influencing the surface roughness. In the case of ceramic and wafer, we were able to obtain good surface roughness when the feed rate and ultrasonic output is higher. In the case of glass, the surface roughness becames worse when ultrasonic output is higher because of increasing of load affacting on the particles in slurry.

• Journal of the Korean Society for Precision Engineering
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• v.6 no.4
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• pp.11-20
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• 1989

마이크로 일렉트로닉스(Microelectronics)를 중심으로 하는 산업혁명이 진행되고 있는 시점에서 전자, 광학 또는 신소재 부품에 대한 형상과 치수 또는 표면거칠기에 대한 정확도와 정밀도가 엄격하게 요구되고 있다. 예를 들어 경취 재료인 반도체의 웨이화( w-afer), 수정진동자 자기헷트, 비구면렌즈 또는 연질 금속의 레이저빔(Laser Beam) 프린터 용 포리곤 밀러(Polygon Mirror), 자기디스크, 복사기용 드럼(drum), 레저기기용 반사밀러 등 가공정밀도를 향상시키기 위해서는 과거의 가공기술을 대치할 수 있는 새로운 초정밀가공 기술의 도입이 활발하게 진행되고 있다. 경취성 재료의 초정밀가공은 지금까지는 랩핑(lappi- ng), 폴리싱(polishing)의 가공기술이 주체였으나, 최근의 엄격한 부품정밀도에 대응하기 위하여 전가공을 초정밀 연삭가공으로 평면도,표면거칠기, 가공변질층을 향상시키고 다듬질 가공은 폴리싱으로 하여 표면거칠기를 향상시켜야 하는 가공기술이 보급되고 있다. 일반연질 금속의 다듬질가공은 유리지립을 이용하는 랩핑이나 폴리싱으로 다듬질 가공을 진행하고 있었 으나 형상정도와 표면정밀도를 동시에 얻는다는 것이 어렵고 또 가공시간이 너무 길어서 매우 고가인 것이 되고 말았다. 그러나 유리에서 연질금속으로 재료를 전환시키고 저가격화, 양산 화의 요구, 정밀도 향상과 부품의 안정화 등등 여러 이유로서 다아아몬드(Diamond) 공구로 mirror surface 를 만드는 초정밀 경면연삭 가공기술(precision turning with diamond)의 발달 로 이제는 완전히 새로운 가공기술로 대치되고 말았다. 다이아몬드에 의한 초정밀절삭은 공구 끝이 매우 예리하고 마모가 매우 적은 단결정 다이아몬드를 이용하고 절삭가공 기계는 운동정도 를 피가공물에 정확히 전사 시키는 방법이며 따라서 가공기계는 고도의 운동정밀도가 요구되며 그외에 강성, 진동, 열변이, 제어면에서 엄격한 검도가 있어야 한다.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.34-42
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• 2004

A new polishing technique for three dimensional micro/meso-scale parts is suggested using a micro quill and a magnetic chain structure. The principle of this method is to polish the target surface with the collected magnetic brushes at a micro tool by the non-uniform magnetic field generated around the tool. In a typical magnetic abrasive finishing process magnetic particles and abrasive particles are unbonded each other. But, to finish the three dimensional small parts bonded magnetic abrasive have to be used. Bonded magnetic abrasives are made from direct bonding, and their polishing characteristics are also examined. Alumina, silicon carbide and diamond micro powders are used as abrasives. Base metal matrix is carbonyl iron powder. It is found that bonded magnetic abrasives are superior to unbonded one by experiment. finally, the polished surface roughness is evaluated by atomic force microscope.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.92-96
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• 2004

In this paper, polishing method using bonded magnetic abrasive particle has been applied to the micro mold polishing. Through process control using the Run-to-Run control, it tried to form the surface roughness In order to grasp the influence of the surface roughness which is reached by selection of control factor and the factor, a design of experiment was been processed. The study is processed with a purpose of to embody and to maintain the surface roughness of nano scale by the basis of an influence between a control factor and the factors which has been selected in this way. As a result, the result of the process control converged at a target value of surface roughness Ra 10nm and Rmax 50nm

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1836-1839
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• 2003

This paper describes the surface polishing characteristics of a flat and free surface ferromagnetic substance(SM45C) that magnetic abrasive polishing processed. The effects of the various working factors on the surface roughness are clarified by experiments respectively, such as magnetic flux density. rotation speed of magnetic head. working gap, feed rate of workpiece. diameter of magnetic abrasives. and shape of workpiece. On the basis of these experiments, the polishing mechanism is discussed and the characteristics of the polishing process are described. In addition, it is found experimentally that die ＆ mold surfaces are also polished precisely by this process

• Journal of the Korean Society for Precision Engineering
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• v.30 no.2
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• pp.148-153
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• 2013

This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.21-28
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• 2008

The final polishing process is based on slurry, pad, conditioner, equipment. Therefore, the concept of wafer final polishing is also necessary for repeatability of results between polished wafers. In this study, the machining conditions have a pressure, table speed, machining time and slurry ratio. This research investigated the surface characteristics that apply variable machining conditions and response surface methodology was used to obtain more flexible and optimumal condition base on Taguchi method. On the base of estimated response surface curvature from the equation and results of Taguchi method, combined design of experiment was considered to lead to optimumal condition. Finally, polished wafer was obtained mirror like surface.