• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.30.2-30.2
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• 2005

• 대한기계학회논문집B
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• 제40권11호
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• pp.755-759
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• 2016

전자 통신 분야에서 히트파이프를 활용한 방열기술은 점차 늘어나고 있다. 특히 전자 패키지 응용에서는 원형 단면 히트파이프에 비해 평판 형상의 얇은 히트파이프가 보다 더 적용하기에 용이하다. 압출 공정에 기반한 평판 히트파이프는 내벽에 사각 단면 그루브들로 이루어진 단순한 모세관 윅 구조를 갖는다. 그루브 윅이 내벽에 다수 개 설치가 된다고 하더라도 상대적으로 높은 모세관력을 달성하기는 어렵다. 본 연구에서는 그루브 윅의 모세관력 향상을 위해 와이어 다발을 적용한 평판 히트파이프의 제작 및 성능평가 실험을 수행하였다. 실험을 통해 와이어 다발을 윅으로 갖는 평판 히트파이프의 열저항 및 열전달률이 그루브 윅 평판 히트파이프에 비해 각각 3.4배와 3.8배 가량 우수한 것으로 나타났다. 본 연구를 통해 와이어 다발을 통한 모세관력 향상 효과를 실험적으로 확인하였으며, 향후 상용화를 위한 연구를 진행할 계획이다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2113-2118
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• 2007

In this study, a mathematical model for a thermal analysis of a flat heat pipe with a grooved wick structure is presented. The effects of the liquid-vapor interfacial shear stress, the contact angle, and the amount of liquid charge have been included in the proposed model. In particular, the axial variations of the wall temperature and the evaporation/condensation rates are considered by solving the one-dimensional conduction and the augmented Young-Laplace equations, respectively. In order to verify the model, the results obtained from the model are compared to existing experimental data.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 춘계학술대회
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• pp.1406-1411
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• 2004

A series of experiments was conducted to examine characteristics of a grooved flat-strip heat pipe having multiple heat sources. The inner grooves of the heat pipe have the aspect ratio of 1 to $2.5(0.42{\times}1.05$ mm) whose pitch was 0.6 mm. Four block heaters ($10{\times}20$ mm) were placed in the evaporator section at intervals of 20 mm and six different heating modes were tested. The maximum surface heat flux of 80 $W/cm^2$ was achieved while the operating temperature was kept below $100^{\circ}C$, In the nearest heating mode (from the condenser location), the heat pipe exhibited more stable temperature distribution than the far heating mode where the heaters is located furthest from the condenser.

• 대한기계학회논문집B
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• 제34권12호
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• pp.1079-1085
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• 2010

평판형 증발부를 갖는 루프히트파이프(LHP)에 대한 정상상태 해석모델을 제시하였다. 관련문헌의 고찰에 기초하여 LHP 의 주요 부분인 증발부, 액체저장조(보상챔버), 증기이송관, 액체이송관 및 응축부에서 온도와 압력을 예측할 수 있도록 계산과정을 제시하였으며, LHP 에서 유일하게 모세관 구조물을 가지는 증발부의 해석에 중점을 두었다. 증발부에서 액체 -기체 경계면 부근에서 압력과 온도의 영향을 고려하기 위해 박막이론을 사용하였으며, 수정된 기체분자운동이론에서 응축경계면 온도를 산정하는데 있어서 독특한 방법을 도입하였다. 응축부에서는 상변화 경계면을 단순화하여 처리함으로써 응축부 형상 변화에 상대적인 융통성을 구비하도록 하였다. 본 연구의 LHP 정상상태 해석 모델은 문헌 상의 실험결과에 의해 타당성이 증명되었다. 해석모델에 의한 예측치는 실험치와 비교할 때 절대온도를 기준으로 최대 상대오차 3% 이내로서 합리적으로 잘 일치하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2110-2115
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• 2008

In this study, We disigned and manufactured the Hot Chuck which can be operated until $120^{\circ}C$. Its shape is circular, wide is 300mm and depth is 15mm. Two types working fluid was used as working fluid(distilled water, 0.1%-$TiO_2$ nanofluid). The experimental results were compared to each working fluid. The effect of various working fluid, charging volume ratio was investigated. Also we investigated heat transfer rate against each working fluid. By using nanofluid, heat transfer rate can be enhanced and the wick structure can be constructed automatically on smooth surface. The experiment of 40% charged 0.1%-$TiO_2$ nanofluid showed the best performance of thermal accuracy and uniformity. To improve performance of Hot Chuck, more study is needed.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2369-2374
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• 2008

In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ${\pm}1.5%$ during heating to $120^{\circ}C$. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type(300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various liquids(aceton, FC-40, water) were used as the working fluid and charging ratio was changed($14{\sim}36\;vol.%$). Several cases were tested to improve temperature uniformity. Major working fluid to be investigated was water. Using water, various parameters such as charging ratio, wafer operation on-off time, different working fluids. In case of water, the temperature uniformity was ${\pm}1.5%$, response time of wafer were investigated.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2007년도 동계학술발표대회 논문집
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• pp.635-639
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• 2007

In this study, optimal design and test of flat-plate heat pipe were carried out in order to improve both thermal response and surface temperature uniformity of heating plate. Experimental results show that the thermal response of flat-plate heat pipe is faster than that of a conventional heating type ones along with less weight and cost. The surface temperature uniformity is also improved.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2004년도 동계학술대회 논문집
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• pp.127-127
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• 2004

• 대한기계학회논문집B
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• 제29권7호
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• pp.805-813
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• 2005

The thermal performance of a flat-strip heat pipe with inner grooves and the screen mesh cover was investigated experimentally. The heat pipes were made of 2024 aluminum alloy of which the dimensions were 30 (W) $\times$ 4 (T) $\times$ 150 (L) mm. The cross sectional dimensions of inner groove were 0.4$\times$0.9 mm and the space between grooves was 0.6 mm. To enhance the capillary force, foe screen meshes were attached to cover the grooved inner surface. In the grooved heat pipes without screen mesh cover, the maximum thermal load of 180 W (12 W/$cm^2$) was achieved for operating temperature below $130^{\circ}C$ at horizontal position. The heat pipes with screen mesh cover showed the thermal resistances less than one third of those without screen mesh cover, and showed less fluctuation in the thermal resistance values. Furthermore, the thermal performance of the former exhibited less dependence on the tilt angle and the fill charge ratio.