• Proceedings of the KSME Conference
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• 2005.11a
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• pp.30.2-30.2
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• 2005

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.11
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• pp.755-759
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• 2016

The use of heat pipes in the electronic telecommunication field is increasing. Among the various types of heat pipes, the thin flat heat pipe has relatively high applicability compared with the circular heat pipe in the electronic packaging application. The thin flat heat pipe based on extrusion fabrication has a simple capillary wick structure consisting of rectangular cross sectional grooves on the inner wall of the pipe. Although the groove serves as a simple capillary wick, and many such grooves are provided on the inner wall, it is difficult for the grooves to realize a sufficiently high capillary force. In the present study, a thin flat heat pipe with a wire bundle was developed to overcome the drawback of poor capillary force in the thin flat heat pipe with grooves, and was evaluated by conducting tests. In the performance test, the thin flat heat pipe with the wire bundle showed a lower thermal resistance of approximately 3.4 times, and a higher heat transfer rate of approximately 3.8 times with respect to the thin flat heat pipe with grooves as the capillary wick respectively. The possibility of using the wire bundle as a capillary wick in the heat pipe was validated in the present study; further study for commercializing this concept will be taken up in the future.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2113-2118
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• 2007

In this study, a mathematical model for a thermal analysis of a flat heat pipe with a grooved wick structure is presented. The effects of the liquid-vapor interfacial shear stress, the contact angle, and the amount of liquid charge have been included in the proposed model. In particular, the axial variations of the wall temperature and the evaporation/condensation rates are considered by solving the one-dimensional conduction and the augmented Young-Laplace equations, respectively. In order to verify the model, the results obtained from the model are compared to existing experimental data.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1406-1411
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• 2004

A series of experiments was conducted to examine characteristics of a grooved flat-strip heat pipe having multiple heat sources. The inner grooves of the heat pipe have the aspect ratio of 1 to $2.5(0.42{\times}1.05$ mm) whose pitch was 0.6 mm. Four block heaters ($10{\times}20$ mm) were placed in the evaporator section at intervals of 20 mm and six different heating modes were tested. The maximum surface heat flux of 80 $W/cm^2$ was achieved while the operating temperature was kept below $100^{\circ}C$, In the nearest heating mode (from the condenser location), the heat pipe exhibited more stable temperature distribution than the far heating mode where the heaters is located furthest from the condenser.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.12
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• pp.1079-1085
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• 2010

A steady-state analytical model was presented for a loop heat pipe (LHP) with an evaporator that has a flat geometry. On the basis of a series of reviews of the relevant literature, a sequence of calculations was proposed to predict the temperatures and pressures at each important part of the LHP: the evaporator, liquid reservoir (compensation chamber), liquid line, vapor line, and condenser. The analysis of the evaporator, which is the only part in the LHP that has a capillary structure, was emphasized. Thin-film theory is applied to account for the pressure and temperature in the region adjacent to the liquid-vapor interface in the evaporator. The present study introduced a unique method to estimate the liquid temperature at the interface. Relative freedom was assumed in the configuration of a condenser with a simplified liquid-vapor interface. Our steady-state model was validated by experimental results available in the literature. The relative error was within 3% on the absolute temperature scale, and reasonable agreement was obtained.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2110-2115
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• 2008

In this study, We disigned and manufactured the Hot Chuck which can be operated until $120^{\circ}C$. Its shape is circular, wide is 300mm and depth is 15mm. Two types working fluid was used as working fluid(distilled water, 0.1%-$TiO_2$ nanofluid). The experimental results were compared to each working fluid. The effect of various working fluid, charging volume ratio was investigated. Also we investigated heat transfer rate against each working fluid. By using nanofluid, heat transfer rate can be enhanced and the wick structure can be constructed automatically on smooth surface. The experiment of 40% charged 0.1%-$TiO_2$ nanofluid showed the best performance of thermal accuracy and uniformity. To improve performance of Hot Chuck, more study is needed.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2369-2374
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• 2008

In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ${\pm}1.5%$ during heating to $120^{\circ}C$. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type(300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various liquids(aceton, FC-40, water) were used as the working fluid and charging ratio was changed($14{\sim}36\;vol.%$). Several cases were tested to improve temperature uniformity. Major working fluid to be investigated was water. Using water, various parameters such as charging ratio, wafer operation on-off time, different working fluids. In case of water, the temperature uniformity was ${\pm}1.5%$, response time of wafer were investigated.

• Proceedings of the SAREK Conference
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• 2007.11a
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• pp.635-639
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• 2007

In this study, optimal design and test of flat-plate heat pipe were carried out in order to improve both thermal response and surface temperature uniformity of heating plate. Experimental results show that the thermal response of flat-plate heat pipe is faster than that of a conventional heating type ones along with less weight and cost. The surface temperature uniformity is also improved.

• Proceedings of the SAREK Conference
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• 2004.11a
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• pp.127-127
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• 2004

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.7 s.238
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• pp.805-813
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• 2005

The thermal performance of a flat-strip heat pipe with inner grooves and the screen mesh cover was investigated experimentally. The heat pipes were made of 2024 aluminum alloy of which the dimensions were 30 (W) $\times$ 4 (T) $\times$ 150 (L) mm. The cross sectional dimensions of inner groove were 0.4$\times$0.9 mm and the space between grooves was 0.6 mm. To enhance the capillary force, foe screen meshes were attached to cover the grooved inner surface. In the grooved heat pipes without screen mesh cover, the maximum thermal load of 180 W (12 W/$cm^2$) was achieved for operating temperature below $130^{\circ}C$ at horizontal position. The heat pipes with screen mesh cover showed the thermal resistances less than one third of those without screen mesh cover, and showed less fluctuation in the thermal resistance values. Furthermore, the thermal performance of the former exhibited less dependence on the tilt angle and the fill charge ratio.