• Journal of the Korean Society for Nondestructive Testing
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• v.4 no.1
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• pp.11-22
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• 1984

In the straight beam inspection of ultrasonic wave, the method for evaluating flaw size by AVG diagram is useful as a method for the quantitative evaluation of results of ultrasonic flaw detection. This study was carried out the measure the size of circular flat flaw with the inclination by straight beam inspection and could be decreased the error of application due to the inclination of flaw by AVG diagram in consideration of correction coefficient. From the result of the experiment, the error by means of the application of experimental values to AVG diagram was increased as the inclination angle grows. Also, it n s increased the error of application as the detecting frequency and diameter of flaw grows in the same inclination angle. In case of diameter of flaw 6mm, AVG diagram could be applied to the inclination angle $3^{\circ}$ for 5 MHz, $7^{\circ}$ for 2.25 MHz, $15^{\circ}C$ for 1 MHz in the range of 20% error and the theory was concided with the experiment to $5^{\circ}C$ for 5 MHz, $10^{\circ}C$ for 2.25 MHz, $15^{\circ}C$ for 1 MHz in the range of 10% error by correction eq. (45) due to the inclination angle. Therefore, it is considered that the results obtained from this study will be somewhat helpful informations for the size evaluation of circular flat flaw with the inclination.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.3
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• pp.259-267
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• 2004

A finite element method is used to simulate interaction of laser-based ultrasounds with surface breaking tracks in elastic media. The laser line source focused on the surface of semi-infinite medium is modeled as a shear dipole in 2-D plane strain finite elements. The shear dipole-finite clement model is found to give correct directivity patterns for generated longitudinal and shear waves. The interaction of surface waves with surface breaking cracks (2-D machined slot) is considered in two ways. Both the source and receiver are fixed with respect to the cracks in the first case, while the source is moving in another case. It is shown that the crack depth tested in the range of 0.3-5.0mm $({\lambda}_R/d=0.21{\sim}3.45)$ can be measured using the corner reflected waves produced by the fixed laser source. The moving laser source is found to cause a large amplitude change of reflected waves near crack, and the crack whose depth is one order lower than the wavelength ran be detected from this change.

• Journal of the korean academy of Pediatric Dentistry
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• v.26 no.4
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• pp.636-643
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• 1999

Ectodermal dysplasia is a genetic birth defect in which at least abnormally develop two structures derived from the ectoderm. It is usually inherited in autosomal dominant or autosomal recessive pattern. Oral manifestations are oligodontia, anodontia, dysmorphic teeth(conical shape), decreased occlusal vertical dimension and alveolar bone. Extraoral signs may include decreased or absent sweat glands, sparse and fine hair, saddle nose, hearing loss and decreased production of body fluids including saliva. Most affected children require extensive dental treatment to restore their appearance and help the development of a positive self image. The patient's overclosed profile was due to a decreased vertical dimension. The use of overdenture is to preserve erupted teeth, to accomodate the newly constructed occlusal plane, to improve retention and stability of denture and to maintain the remaining alveolar bone. The restoration of vertical dimension improved the child's speech, swallowing, and eating. Growth continue until the age of approximately 18. As child grows, replacement dentures will have to be fabricated primarily to accomodate increasing vertical dimension and changing dentition. Implants may be indicated later if the alveolar bone is adequate. Periodic recall visits are advised, to monitor the dentures during periods of growth and development, and eruption of the permanent teeth.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.25-29
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• 2022

Recently, the importance of electronic packaging technology has been attracting attention, and heterogeneous integration technology in which chips are stacked out-of-plane direction is being applied to the electronic packaging field. The 2.5D integration circuit is a technology for stacking chips using an interposer including TSV, and is widely used already. Therefore, it is necessary to make the interposer mechanically reliable in the packaging process that undergoes various thermal processes and mechanical loadings. Considering the structural characteristics of the interposer on which several thin films are deposited, thermal stress due to the difference in thermal expansion coefficients of materials can have a great effect on reliability. In this study, the mechanical reliability of the metal pad for wire bonding on the silicon interposer against thermal stress was evaluated. After heating the interposer to the solder reflow temperature, the delamination of the metal pad that occurred during cooling was observed and the mechanism was investigated. In addition, it was confirmed that the high cooling rate and the defect caused by handling promote delamination of the metal pads.

• Journal of IKEEE
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• v.27 no.3
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• pp.345-349
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• 2023

In this paper, we propose a study on the development of deep learning structure for defective pixel detection of next-generation smart LED display board using imaging device. In this research, a technique utilizing imaging devices and deep learning is introduced to automatically detect defects in outdoor LED billboards. Through this approach, the effective management of LED billboards and the resolution of various errors and issues are aimed. The research process consists of three stages. Firstly, the planarized image data of the billboard is processed through calibration to completely remove the background and undergo necessary preprocessing to generate a training dataset. Secondly, the generated dataset is employed to train an object recognition network. This network is composed of a Backbone and a Head. The Backbone employs CSP-Darknet to extract feature maps, while the Head utilizes extracted feature maps as the basis for object detection. Throughout this process, the network is adjusted to align the Confidence score and Intersection over Union (IoU) error, sustaining continuous learning. In the third stage, the created model is employed to automatically detect defective pixels on actual outdoor LED billboards. The proposed method, applied in this paper, yielded results from accredited measurement experiments that achieved 100% detection of defective pixels on real LED billboards. This confirms the improved efficiency in managing and maintaining LED billboards. Such research findings are anticipated to bring about a revolutionary advancement in the management of LED billboards.