• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.61-66
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• 2012

Chemical Mechanical Planarization (CMP) is a polishing process used in the microelectronic fabrication industries to achieve a globally planar wafer surface for the manufacturing of integrated circuits. Pad conditioning plays an important role in the CMP process to maintain a material removal rate (MRR) and its uniformity. For metal CMP process, highly acidic slurry containing strong oxidizer is being used. It would affect the conditioner surface which normally made of metal such as Nickel and its alloy. If conditioner surface is corroded, diamonds on the conditioner surface would be fallen out from the surface. Because of this phenomenon, not only life time of conditioners is decreased, but also more scratches are generated. To protect the conditioners from corrosion, thin organic film deposition on the metal surface is suggested without requiring current conditioner manufacturing process. To prepare the anti-corrosion film on metal conditioner surface, vapor SAM (self-assembled monolayer) and FC (Fluorocarbon) -CVD (SRN-504, Sorona, Korea) films were prepared on both nickel and nickel alloy surfaces. Vapor SAM method was used for SAM deposition using both Dodecanethiol (DT) and Perfluoroctyltrichloro silane (FOTS). FC films were prepared in different thickness of 10 nm, 50 nm and 100 nm on conditioner surfaces. Electrochemical analysis such as potentiodynamic polarization and impedance, and contact angle measurements were carried out to evaluate the coating characteristics. Impedance data was analyzed by an electrical equivalent circuit model. The observed contact angle is higher than 90o after thin film deposition, which confirms that the coatings deposited on the surfaces are densely packed. The results of potentiodynamic polarization and the impedance show that modified surfaces have better performance than bare metal surfaces which could be applied to increase the life time and reliability of conditioner during W CMP.

• Journal of Sensor Science and Technology
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• v.5 no.5
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• pp.21-29
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• 1996

A piezoresistive silicon acceleration sensor with 8 beams, utilized by an unique silicon micromachining technique using porous silicon etching method which was fabricated on the selectively diffused (111)-oriented $n/n^{+}/n$ silicon subtrates. The width, length, and thickness of the beam was $100\;{\mu}m$, $500\;{\mu}m$, and $7\;{\mu}m$, respectively, and the diameter of the mass paddle (the region suspended by the eight beams) was 1.4 mm. The seismic mass on the mass paddle was formed about 2 mg so as to measure accelerations of the range of 50g for automotive applications. For the formation of the mass, the solder mass was loaded on the mass paddle by dispensing Pb/Sn/Ag solder paste. After the solder paste is deposited, Heat treatment was carried out on the 3-zone reflow equipment. The decay time of the output signal to impulse excitation of the fabricated sensor was observed for approximately 30 ms. The sensitivity measured through summing circuit was 2.9 mV/g and the nonlinearity of the sensor was less than 2% of the full scale output. The output deviation of each bridge was ${\pm}4%$. The cross-axis sensitivity was within 4% and the resonant frequency was found to be 2.15 KHz from the FEM simulation results.

• Journal of the Korea institute for structural maintenance and inspection
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• v.25 no.4
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• pp.83-91
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• 2021

In this study, to improve the connection performance between the existing reinforced concrete (R/C) frame and the strengthening member, we proposed a new H-section steel frame with elastic pad (HSFEP) system for seismic rehabilitation of existing medium-to-low-rise reinforced concrete (R/C) buildings. This HSFEP strengthening system exhibits an excellent connection performance because an elastic pad is installed between the existing structure and reinforcing frame. The method shows a strength design approach implemented via retrofitting, to easily increase the ultimate lateral load capacity of R/C buildings lacking seismic data, which exhibit shear failure mechanism. Two full-size two-story R/C frame specimens were designed based on an existing R/C building in Korea lacking seismic data, and then strengthened using the HSFEP system; thus, one control specimen and one specimen strengthened with the HSFEP system were used. Pseudodynamic tests were conducted to verify the effects of seismic retrofitting, and the earthquake response behavior with use of the proposed method, in terms of the maximum response strength, response displacement, and degree of earthquake damage compared with the control R/C frame. Test results revealed that the proposed HSFEP strengthening method, internally applied to the R/C frame, effectively increased the lateral ultimate strength, resulting in reduced response displacement of R/C structures under large scale earthquake conditions.

• Tribology and Lubricants
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• v.28 no.1
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• pp.7-11
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• 2012

In this paper, the results of finite element(FE) analysis of chemical mechanical polishing(CMP) process using 2-dimensional elements were discussed. The objective of this study is to find the generation mechanism of microscratches on a wafer surface during the process. Especially, a FE model with a particle inside pad pore was considered to observe how such a contact situation could contribute to microscratch generation. The results of the finite element simulations revealed that during CMP process the pad-particle mixture could be formed and this would be a major factor leading to microscratch generation.

• Electronics and Telecommunications Trends
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• v.31 no.3
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• pp.32-41
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• 2016

2008년부터 smart phone과 같은 휴대기기의 무선충전을 목표로 지속적인 발전을 거듭해온 무선충전 기술은 2015년 마침내 smart phone에 기본으로 장착되기에 이르렀으며, 특히 최근 스마트워치 등의 웨어러블 기기의 등장으로 기술발전과 다양화가 한층 더 가속화되고 있다. 최근 무선충전 기술은 기존의 2차원 패드 구조에서 벗어나 더욱 높은 자유도와 안전성을 부여하기 위한 노력을 하고 있고, 유선충전에서 적용되고 있는 고속 충전 기술을 무선충전에 적용하기 위한 기술개발을 병행하고 있다. 본고에서는 이러한 무선충전기술의 발전 동향과 표준화 동향을 소개하고, 향후 무선충전기술의 발전 방향에 대해 논하고자 한다.

• The Journal of the Acoustical Society of Korea
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• v.12 no.1
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• pp.12-19
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• 1993

진동시험 동안 구조물은 진동시험기로부터 높은 진동에너지를 받게 되는데 공급되는 에너지를 시험물에 전달하기 위해서는 시험물에 따라 다양한 종류의 진동시험치구가 필요하게 된다. 이중에서 T-형상 진동시험치구는 진동시험축에 대해 3방향으로 시험물을 설치할 수 있고, 형상이 간단하며, 또한 값이 저렴하므로 많은 설계자들은 T-형상 치구를 설계하여 사용한다. 그러나 이 치구는 수직판이 어떤 주파수에서 평판처럼 공진현상을 일으키기 때문에 동역학적으로 설계하기가 어렵다. 본 논문에서는 진동시험치구의 기능을 향상시키기 위해 모우드 시험(Model Testing)기법을 사용하는 방법과 시험결과를 근거로 설계변경을 위해 수직보강판, 수평보강판, 그리고 천연 고무패드를 사용하여 이것들이 치구의 동특성에 미치는 영향을 기술하며 그 결과를 치구설계 때 응용 가능하도록 한다.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.975-978
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• 2003

본 논문에서는 비디오 신호 인터페이스를 위해 10비트 50MHz ADC 를 설계하였으며 DCL(digital-error correction logic)을 갖는 3-3-3-4 구조의 파이프라인 방식을 사용하였다. SHA(sample and hold amplifier)와 MDAC (multiplying digital-to-analog converter)에 쓰이는 증폭기는 높은 이득을 갖도록 gain-boosting 기법을 적용하였으며, 전력소모와 면적을 줄이기 위해 capacitor scaling 기법을 적용하였다. 본 ADC 는 0.35 μm double-poly four-metal n-well CMOS 공정으로 설계 및 제작하였으며, 전체 회로는 3.3V 단일 전원 전압에서 동작하도록 설계하였다. 측정 결과 5MHz 의 입력을 인가하였을 때 SNDR 은 56.7dB, 전체 전력 소모는 112mW 이며, 입출력 단의 패드를 포함한 전체 칩 면적은 2.6mm×2.6mm이다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.251-255
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• 2003

탄화규소 반도체에 대한 오옴성 금속 접촉 성질을 조사하기 위해 3종류의 금속 (Ni, Co, Cu)을 세척한 탄화규소 반도체 위에 직접 증착하여 전기적 성질을 조사 비교하였다. 이들 금속에 대한 오옴성 성질은 금속종류 뿐만 아니라 열처리조건에 대해서도 크게 좌우됨을 알 수 있었다. 열처리는 급속열처리 장치를 이용한 진공상태 및 환원 분위기에서 2-step 방법으로 시행하였다. 접합비 저항은 TLM 구조를 만들었으며 면저항$(R_s)$, 접촉저항$(R_c)$, 이동거리$(L_T)$, 패드간거리(d), 저항$(R_T)$ 값을 구하면 접합비저항$(\rho_c)$ 값을 구하여 알려진 계산식에 의해 추정하였다. 가장 양호한 결과는 Cu 금속에 의한 접촉 결과이었으며 접합비저항$(\rho_c)$은 $1.2\times10^{-6}{\Omega}cm^2$의 낮은 값을 얻을 수 있었다. 열처리는 진공보다 환원분위기에서 수행한 시편이 양호한 전기적 성질을 가짐을 알 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.759-762
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• 2005

A tray inserting machine is developed for automation of inserting plastic mold tray into a cardboard box. Plastic mold tray is used for protecting breakdown of glass bottles. In this paper, two types of processes to divide the plastic mold tray are proposed. As a result, adhesion method by vacuum pad is accepted. And also, static and modal analysis for the machine are carried out to check the machine design using the commercial software, CATIA V5.

• Proceedings of the KIPE Conference
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• 2015.11a
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• pp.165-166
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• 2015

본 논문에서는 기존에 각국에서 제정된 인체에 대한 여러 EMI규격을 제시하고, EV 모델 및 패드의 페라이트 배치 구조에 따라 측정 포인트에서 발생하는 EMI의 값을 비교하여 기존 규격에 적합한 페라이트의 배치를 제안한다.