• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.47-51
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• 2006

Recently, CMP (Chemical Mechanical Polishing) is one of very important processing in semiconductor technology because of large integration and application of design role. CMP is a planarization process of wafer surface using the chemical and mechanical reactions. One of the most important components of the CMP system is the polishing pad. During the CMP process, the pad itself becomes smoother and glazing. Therefore it is necessary to have a pad conditioning process to refresh the pad surface, to remove slurry debris and to supply the fresh slurry on the surface. A conditioning disk is used during the pad conditioning. There are diamonds on the surface of diamond disk to remove slurry debris and to polish pad surface slightly, so density, shape and size of diamond are very important factors. In this study, we characterized diamond disk with 9 kinds of sample.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.533-534
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.555-556
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• 2007

• Proceedings of the Korean Society of Computer Information Conference
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• 2013.01a
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• pp.273-276
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• 2013

스마트 폰과 스마트 패드등 스마트 디바이스를 이용한 다양한 앱 응용 프로그램이 배포 되고 있다. 특히 위치 정보를 이용한 다양한 앱용 응용 프로그램이 많이 개발 되고 있다. 본 논문에서는 위치 기반 지역 정보 시스템에 기반된 스마트폰용 고객 마일리지 관리 시스템 구축 방법을 소개 한다. 제안 시스템은 위치 기반으로 지역에 특정 상점을 찾고 해당 상점에 방문하여 이용하면 해당 상점에서 마일리지 또는 쿠폰 등을 단순히 전화 번호 색인을 이용하여 입력하고 해당 정보와 연관하여 지속적인 고객관리를 하는 전체 구조 이다. 제안 시스템을 이용하면 상점 운영자는 종이 또는 프라스틱 카드를 이용하여 고객 관리를 할 필요가 없으며, 고객은 다양한 상점에 다양한 마일리지와 쿠폰을 관리하기 위한 카드를 보관할 필요가 없어진다. 본 논문에서는 위치기반 지역 정보 시스템을 구축하고 해당 지역 정보 시스템과 고객관리를 연결하여 효율적으로 고객을 관리하는 전체 시스템을 설명 한다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.80-83
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• 2003

본 연구에서는 고온 솔더 범프와 저온 솔더 패드를 이용하여 $140^{\circ}C$에서 1분간의 리플로 공정을 통해 접합에 성공하였다. 고온 솔더 범프로 Sn-4.0Ag-0.5Cu 솔더 볼을 사용하였고, 저온 솔더는 In-48Sn $(mp:\;117^{\circ}C)$ 솔더를 기판에 evaporation 방법으로 두께 $20\;{\mu}m$의 패드 형태로 증착하였다. $140^{\circ}C$에서 1분간의 리플로 공정을 통해 칩과 기판을 접합하였으며, 접합 단면을 관찰해 본 결과 저온 솔더가 녹아 고온 솔더에 wetting된 것을 관찰하였다. 이 시편을 상온에서 시효처리를 실시한 결과 시간의 경과에 따라 저온 솔더와 고온 솔더가 상호 확산하여 약 $40\;{\mu}m$였던 확산층의 범위가 점차 증가하는 것을 관찰할 수 있었다. 또한, 리플로 공정변수에 따른 솔더의 미세구조 변화 및 ball shear strength등의 기계적 특성에 대해 고찰하였다.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.5
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• pp.32-37
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• 2004

Polishing processes are widely used in the glass, optical, die and semiconductor industries. Chemical Mechanical Polishing (CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. CMP is conventionally carried out using abrasive slurry and a polishing pad. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. This paper introduces the basic concept and fabrication technique of the next generation CMP pad using micro-molding method to obtain uniform protrusions and pores on the pad surface.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.45-50
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• 2003

Global full 3D finite element analysis fatigue models are constructed for flip-chip BGA on system board to predict the creep fatigue life of solder joints during the thermal cycling test. The fatigue model applied is based on Darveaux's empirical equation approach with non-linear viscoplastic analysis of solder joints. The creep life was estimated the creep life as the variations of the four kinds of thermal cycling test conditions, pad structure, composition and size of solder ball. The shortest fatigue life was obtained at the thermal cycling test condition from $-65^{\circ}C$ to $150^{\circ}C$. It was increased about 3.5 times in comparison with that from $0^{\circ}C$ to $100^{\circ}C$. At the same conditions, the fatigue life of SMD structure as the change of pad structure increased about 5.7% as compared with NSMD structure. Consequently, it was confirmed that the fatigue life became short as the creep strain energy density increased in solder joint.

• Journal of the Korea Convergence Society
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• v.8 no.11
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• pp.49-56
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• 2017

Curling sweeping is one of important motion to control the position of the curling stone, and sweeping speed and applied force to the broom pad are major research subjects. In this study, a device was developed to measure the force applied to the curling broom pad in curling sweeping motion, and two load cells were mounted between the broom pad and pad holder. Analog signals generated from the load cells were sampled about 300 times per second using a micro controller, and then converted to 10-bit digital signals. Calibration of the load cell and set up of regression equations to convert the measured electrical signals into mass (force) was done by three M1 class weights, and the developed system was designed as wearable device to minimize increasing of total weight of the broom. Same force was applied to the developed system and a force plate that was using as a reference force measurement system in field of sports, and the difference between the measured values were showed about $0.909{\pm}1.375N$(mean and standard deviation). The developed system could be applied other kinds of study which required force measurement function similar to sweeping motion.

• The Journal of the Convergence on Culture Technology
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• v.8 no.6
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• pp.667-674
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• 2022

In this study, the correlation between the damage type and operating conditions of the sleepers was analyzed based on the design data and visual inspection results for the concrete sleepers of the sleeper floating track (STEDEF) that have been in operation for more than 20 years. It appeared in the form of cracks, breakages, and breaks in the concrete at the center and tie bar contact and buried areas. As a result of the numerical analysis, it was analyzed that the change in the left and right spring stiffness of the sleeper resilience pad increases the maximum stress, tensile stress, compressive stress, and displacement of the concrete sleeper, and stress concentration in the concrete at the tie bar contact area. It was proved analytically that the sleeper resilience pad can affect the damage of the concrete sleeper. Therefore, damage of concrete sleepers in the sleeper floating track in urban transit could be caused by changes in spring stiffness of sleeper resilience pads. It was reviewed that preventive maintenance such as improvement and timely replacement of sleeper resilience pads was necessary.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.4
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• pp.1210-1215
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• 2010

The probe card are test modules which are to classify the good semiconductor chips and thin film before the packaging process. In the rapid growth a technology of semiconductor, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, the technology of probe card needs narrow width and lots of probe tip. In this paper, the probe tip based on the MEMS(Micro Electro Mechanical System)technology was developed a new MEMS probe tip for vertical probe card applications. For the structural designs of probe tip were performed to mechanical characteristics and structural analysis using FEM(Finite Element Method). Also, the contact force of MEMS probe tip compared with FEM results and experimental results. Finally, the MEMS probe card was developed a fine pitch smaller than $50{\mu}m$.