• Title/Summary/Keyword: 패드 구조

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A 2.5 V 10b 120 MSample/s CMOS Pipelined ADC with High SFDR (높은 SFDR을 갖는 2.5 V 10b 120 MSample/s CMOS 파이프라인 A/D 변환기)

  • Park, Jong-Bum;Yoo, Sang-Min;Yang, Hee-Suk;Jee, Yong;Lee, Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.39 no.4
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    • pp.16-24
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    • 2002
  • This work describes a 10b 120 MSample/s CMOS pipelined A/D converter(ADC) based on a merged-capacitor switching(MCS) technique for high signal processing speed and high resolution. The proposed ADC adopts a typical multi-step pipelined architecture to optimize sampling rate, resolution, and chip area, and employs a MCS technique which improves sampling rate and resolution reducing the number of unit capacitor used in the multiplying digital-to-analog converter (MDAC). The proposed ADC is designed and implemented in a 0.25 um double-poly five-metal n-well CMOS technology. The measured differential and integral nonlinearities are within ${\pm}$0.40 LSB and ${\pm}$0.48 LSB, respectively. The prototype silicon exhibits the signal-to-noise-and-distortion ratio(SNDR) of 58 dB and 53 dB at 100 MSample/s and 120 MSample/s, respectively. The ADC maintains SNDR over 54 dB and the spurious-free dynamic range(SFDR) over 68 dB for input frequencies up to the Nyquist frequency at 100 MSample/s. The active chip area is 3.6 $mm^2$(= 1.8 mm ${\times}$ 2.0 mm) and the chip consumes 208 mW at 120 MSample/s.

A Study of the Factors Affecting User Acceptance of Smart TVs (스마트TV 사용자 수용에 영향을 미치는 요인 연구)

  • Kim, Su-Yeon;Lee, Sang Hoon;Hwang, Hyun-Seok
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.14 no.4
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    • pp.1652-1662
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    • 2013
  • As smart devices like smartphones and smart pads are prevalent recently, dramatic changes so called 'smart evolution' deployed in many socioeconomic areas. These changes lead the TV industry to develop a smart TV differentiated from a conventional TV by enabling internet connectivity and applications execution. In this study the factors affecting the acceptance of a smart TV are extracted by reviewing the previous works and the structural relationships among these factors are analyzed. Adding 'Social Influence' to consider an environmental factor and 'Innovativeness' for personal characteristics, we build an extended Technology Acceptance Model and analyzed the structural relationships among the factors in the model using Structural Equation Model. In the results we can find that the environmental factors affect the perceived characteristics. The moderating effects of gender and level of experience in smart devices have also been investigated. No difference is found between gender groups. In much-experienced group, Innovativeness affects Perceived Usefulness and acceptance of a smart TV. In less-experienced group, however, Innovativeness affects Perceived Ease of Use, Expected Enjoyment and finally acceptance of a smart TV.

Numerical Analysis for Thermal-deformation Improvement in TSOP(Thin Small Outline Package) by Anti-deflection Adhesives (TSOP(Thin Small Outline Package) 열변형 개선을 위한 전산모사 분석)

  • Kim, Sang-Woo;Lee, Hai-Joong;Lee, Hyo-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.3
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    • pp.31-35
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    • 2013
  • TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

Development of a Personal Compound Stimulus Device for Skin-care (개인용 피부미용 복합자극기 개발)

  • Lee, Jeon;Kim, Chi-Hyun;Chung, Geum-Hee
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.49 no.1
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    • pp.12-19
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    • 2012
  • Recently, the market of skin-care device has been steadily growing up. In this paper, we tried to develop a personal compound stimulus device more competitive than existing products. As the compound stimulus, biochemical stimulus of herbal extraction fluid, thermal stimulus of plate-shaped carbon fiber heater, and optical stimulus of near infrared LED were selected. By some evaluation tests, the thermal stimulation part and the optical stimulation part were found to be developed properly. Additionally, the efficacy of the mixed stimulus of thermal and optical stimulation was tested in C2C12 mouse myoblast. Through RT-PCR analysis, it was found that, by the developed compound stimulus, the expression of collagen I mRNA and collagen III mRNA increased by 4.9 and 1.3 times respectively.

Damage Status of Turnout System with Wooden Sleeper of Concrete Track on Urban Transit (도시철도 콘크리트궤도 목침목 분기기의 손상현황)

  • Choi, Jung-Youl;Han, Kyung-Sung;Bong, Jae-Gun;Jang, Cheol-Ju;Chung, Jee-Seung
    • The Journal of the Convergence on Culture Technology
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    • v.5 no.4
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    • pp.379-385
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    • 2019
  • The purpose of this study is to investigate the damage status of wood sleepers on concrete track of urban transit at different locations and to analyze the causes of damages. In addition, the turnout maintenance history during the service period of about 24 years was analyzed in conjunction with the train passing tonnage and that was to compare the current repair history. The most frequent damage components were rail, tie plate, spike and wooden sleeper. And, the damage caused by the defect of the rail fastening system such as spike and tie plate according to the deformation of the wooden sleeper was analyzed as the main type of damage. As a result, the damage of track components of turnout system was on the increase because they are directly affected by the train passing tonnage. The supplementary points of the check sheet for current turnout maintenance were derived and the improvement proposal was suggested based on the research results.

Study on Ventilation Efficiency of a Mechanically Ventilated Broiler House­(I)Summer Season (강제환기식 육계사내의 환기효율성 조사연구­(I)하절기)

  • 이인복;정문성;유병기;전종기;김경원;이승기
    • Journal of Animal Environmental Science
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    • v.9 no.2
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    • pp.103-112
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    • 2003
  • In this study, the distributions of internal climates such as air temperature, humidity, dust, ammonia gas, and air velocity were systematically measured at a mechanically ventilated broiler houses during summer season, with local weather data. The analysis was focused on the suitability, stability, and uniformity of internal climate, resulting in serious stress on chickens and decrease of productivity In the mechanically ventilated broiler house, the difference between measured and recommended air temperatures(suitability) was 10.4C in maximum during the summer time. The difference of air temperature in the house between day and night was $8.7^{\circ}C$ in maximum. And maximal hourly range of internal air temperature at 0.4m height from the floor was $3.7^{\circ}C$ suggesting it maintained thermal uniformity in the broiler house. The $NH_3$ and dust concentrations were pretty low because ventilation was fully performed. The air speed at chicken location was measured 2.2m/s and 1.7m/s, respectively without and with chicken existence.

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A UTMI-Compatible USB2.0 Transceiver Chip Design (UTMI 표준에 부합하는 USB2.0 송수신기 칩 설계)

  • Nam Jang-Jin;Kim Bong-Jin;Park Hong-June
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.5 s.335
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    • pp.31-38
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    • 2005
  • The architecture and the implementation details of a UTMI(USB2.0 Transceiver Macrocell Interface) compatible USB2.0 transceiver chip were presented. To confirm the validation of the incoming data in noisy channel environment, a squelch state detector and a current mode Schmitt-trigger circuit were proposed. A current mode output driver to transmit 480Mbps data on the USB cable was designed and an on-die termination(ODT) which is controlled by a replica bias circuit was presented. In the USB system using plesiochronous clocking, to compensate for the frequency difference between a transmitter and a receiver, a synchronizer using clock data recovery circuit and FIFO was designed. The USB cable was modeled as the lossy transmission line model(W model) for circuit simulation by using a network analyzer measurements. The USB2.0 PHY chip was implemented by using 0.25um CMOS process and test results were presented. The core area excluding the IO pads was $0.91{\times}1.82mm^2$. The power consumptions at the supply voltage of 2.5V were 245mW and 150mW for high-speed and full-speed operations, respectively.

A l0b 150 MSample/s 1.8V 123 mW CMOS A/D Converter (l0b 150 MSample/s 1.8V 123 mW CMOS 파이프라인 A/D 변환기)

  • Kim Se-Won;Park Jong-Bum;Lee Seung-Hoon
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.41 no.1
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    • pp.53-60
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    • 2004
  • This work describes a l0b 150 MSample/s CMOS pipelined A/D converter (ADC) based on advanced bootsuapping techniques for higher input bandwidth than a sampling rate. The proposed ADC adopts a typical multi-step pipelined architecture, employs the merged-capacitor switching technique which improves sampling rate and resolution reducing by $50\%$ the number of unit capacitors used in the multiplying digital-to-analog converter. On-chip current and voltage references for high-speed driving capability of R & C loads and on-chip decimator circuits for high-speed testability are implemented with on-chip decoupling capacitors. The proposed AU is fabricated in a 0.18 um 1P6M CMOS technology. The measured differential and integral nonlinearities are within $-0.56{\~}+0.69$ LSB and $-1.50{\~}+0.68$ LSB, respectively. The prototype ADC shows the signal-to-noise-and-distortion ratio (SNDR) of 52 dB at 150 MSample/s. The active chip area is 2.2 mm2 (= 1.4 mm ${\times}$ 1.6 mm) and the chip consumes 123 mW at 150 MSample/s.

Design and simulation of hydraulic system for launch vehicle holding device (우주발사체 지상고정장치 유압시스템 설계 및 해석)

  • Kim, Dae Rae;Yang, Seong Pil;Lee, Jaejun;Kim, Bum Suk;Lee, Young-Shin
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.44 no.12
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    • pp.1087-1094
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    • 2016
  • The responsibility of the vehicle holding device (VHD) is to hold the launch vehicle while it is stayed on launch pad and release the holding mechanism to allow a lift-off of launch vehicle at a moment of lift-off. During a release of the holding mechanism, in order to prevent the Ka doing a doing a doing mode which is vertical oscillation of entire liquid propellant and very severe for vehicle structure, gradual release of holding force is required. Also, a release operation of all 4 VHD should be synchronized very precisely. In this study, to comply the "gradual release and synchronized operation requirement", concept of VHD hydraulic system using an accumulator, pyro valve and orifice to control speed of hydraulic cylinder is proposed instead of using complicated hydraulic components. Then through multi-body dynamic analysis and computational hydraulic analysis, a size of orifice to meet a target speed of hydraulic cylinder is calculated. Through this study, simple and reliable VHD hydraulic system complying requirements is designed.

A Study on the Instrument Panel Design Trend for Automobile Interior (자동차 인테리어의 인스트루먼트 패널 디자인 경향 연구)

  • Cho, Kyung-Sil;Lee, Myung-Ki
    • Archives of design research
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    • v.18 no.4 s.62
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    • pp.129-138
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    • 2005
  • Until the early part of the 1990s, interior design has never been thought important by car makers. Repeated attempts have been made to systemize a technical structure, such as layout, driving method, and size, and the car's interior design has been developed by in simple comparison with the exterior design. In the 1990s, however, this trend began to change because consumers began spending more time in their cars, so the motive of the technology development became that of giving comfort and functional satisfaction to the customers. Observing how a person spends inside his or her car and considering the latest trends in car interiors have made a consumer-oriented sense of value i.e., intensifying the personality of the car's interior design and considering the emotional makeup of the consumer factor in the acquisition of a strategic brand identity. These days, car interiors assume a new concept every year due to the constant change in various factors, and the application of a high-tech design, with a sensing function and a navigation system, to achieve driverless running, is being raised as a key trend element technology for the future. Now, at the present when multilateral concept applications of design are attempted under the direct influences from other fields such as product design, fashion and furniture, I would like to lay stress on investigating and analysing the changes in car interior design varying with the background of the times and formative characteristics from the object point of view. On this study, I would like to compare the background of the times and flow of car interior design with priority given to crash pad and would like to attempt to present the direction of the future car interior design together with diversifying major technical factors.

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