• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.5
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• pp.784-789
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• 2012

Ultrasonic Cutting which uses a tuned blade resonant in a longitudinal mode, has been used to cut a range of materials from confectionery, baked products and frozen foods, to wood, bone, foams and composites. The Blade design typically uses finite element analysis, and it could be predicted vibration mode, gain and amplitude uniformity of the blade tip at resonant frequency. In this paper, FEA used to predict the vibration characteristic of the blade, and then the results were verified by analysis system of resonant frequency using the processed blade. The crack of the blade which is predicted from FEA was compared with the crack occurred by cutting experiment of rubber materials using the processed blade.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.12
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• pp.261-267
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• 2020

The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent flowability is needed for DAF for successful die attachment without voids. For DAF with high flowability, two-step curing is often required to reduce a cure crack, but one-step curing is needed to reduce the processing time. In this study, DAF composition was categorized into three groups: cure (epoxy resins), soft (rubbers), hard (phenoxy resin, silica) component. The effect of the composition on a cure crack was examined when one-step curing was applied. The die-attach void and flowability were also assessed. The cure crack decreased as the amount of hard components decreased. Die-attach voids also decreased as the amount of hard components decreased. Moreover, the decrease in cure component became important when the amount of hard component was small. The flowability was evaluated using high-temperature storage modulus and bleed-out. A decrease in the amount of hard components was critical for the low storage modulus at 100℃. An increase in cure component and a decrease in hard component were important for the high bleed-out at 120℃(BL-120).

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.04a
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• pp.500-501
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• 2013

• Proceedings of the KWS Conference
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• 1996.10a
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• pp.92-94
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• 1996

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.10a
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• pp.111-112
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• 2013

• Journal of the Korea Academia-Industrial cooperation Society
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• v.5 no.1
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• pp.65-68
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• 2004

When a monolithic component of piston and rebound is produced by sintering process, some technical problems such as clogging of holes during post-machining, dimensional change around the holes, and cracking of the component edges due to concentration of mechanical stress during machining are frequently encountered. To solve these problems, we systematically evaluated and investigated the density of green compacts and sintered parts, the microstructural change around the holes, and the attenuation and durability of the sintered parts in this study. By doing so, it was able to solve above problems.

• Journal of Power System Engineering
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• v.6 no.1
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• pp.61-67
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• 2002

15Cr-5Ni 석출강화 스테인리스강 3종류의 피로균열 발생과 성장 특성 및 파괴인성에 대하여 노치함수로서 연구하였다. 3종류강의 열처리 조건은 $482\;^{\circ}C,\;579\;^{\circ}C$ 및 $621\;^{\circ}C$이다. $621\;^{\circ}C$에서 4시간동안 열처리한 시험편 C는 약 $280\;MPa\;\sqrt{m}$의 가장 높은 파괴인성을 보였으며, 3종류에서 피로균열 성장이 가장 늦었다. $482\;^{\circ}C$에서 1시간 열처리한 시험편 A에서, 피로균열발생한계, ${\Delta}k{\rho}$, 는 노치반경0.3 mm에서 약 $280\;MPa\;\sqrt{m}$의 가장 높은 값을 보였다. 시험편 A는 시험편 B와 C보다 피로균열 성장이 빨랐지만, 피로균열 발생이 늦었다. 예 하중에 의한 노치선단의 압축잔류응력은 노치 시험편의 피로강도 향상에 유용한 방법이었다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.2
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• pp.213-218
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• 2013

Ultrasonic machining (USM) is a new method used in metal cutting. This process does not involve heating or any electrochemical effects, causes low surface damage, has small residual stress, and does not rely on the conductivity of the workpiece. These characteristics are suitable for the machining of brittle materials such as glass or ceramics. However, the use of USM for brittle materials generates cracks on the workpiece. Therefore, in this study, Taguchi's method was used to optimize the processing conditions of micro holes drilled in glass and ceramics. This method was used to successfully reduce the number of cracks at the entrance and the exit of the micro holes.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.8
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• pp.965-970
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• 2010

Bolts and nuts are widely used to fasten mechanical parts together in machines and structures. The primary role of a nut is to maintain the axial force of a bolt. In this paper, a new type of a lock nut that uses a spring is studied. To have a spring within a nut, a cocking process to narrow the top of the nut is adopted, but cracking occurred in the process. In this study, strain of an initial model is measured using the finite element analysis program, MSC/Marc. The occurrence of the crack was studied by comparing the maximum observed strain of a model with the maximum strain indicated by an accurate stress-strain diagram of 1020 steel. Then, the structure of the lock nut was optimized by response surface analysis to prevent cracking. The prototype of the lock nut was manufactured on the basis of the optimization result, and cracking did not occur.