• Proceedings of the KSME Conference
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• 2000.04b
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• pp.353-358
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• 2000

This paper presents the experimental investigation about miniature heat pipe for notebook PC. The focus of analysis is the operating temperature not to exceed $65^{\circ}C$ maximum allowable CPU surface temperature. Copper is used to heat pipe material and brass is wick material, and working fluid is selected to water. This cooling system is heat spreader method using a aluminum plate, since this method is most commonly used. According to the present study, heat for 3mm heat pipe, 8W, and for 4mm heat pipe, 10W, is found to power dissipation limit respectively, Soon after this investigation, sufficient long term life test should be followed.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.7
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• pp.351-363
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• 2001

This paper presents an experimental investigation on the heat trensfer characteristic of micro pipe (MHP) array with 38 triangular microgrooves. A heat pipe is an effective heat exchanger operating without external power. The heat pipe transfers heat by means of the latent heat of vaporization and two-phase fluid flow driven by the capillary force. The overall size of the MHP array can be put undermeath a microelectonic die and integrated into the electrronic package of a microelectronin device to dissipate the heat from the die. The MHP array is fabricated by micromachining with a silicon wafer and a glass substrate. The MHP was filled with water and sealed. The experimental results show the temperature decrease of 12.1$^{\circ}C$ at the evaporator section for the input power of 5.9 W and the improvement of 28% in the heat transfer rate.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.249-249
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• 2004

다양한 기계적인 제거 가공 공정에 있어서 발생되는 열의 냉각과 치핑 과정시의 원활한 윤활 및 칩의 효율적인 배출 작용 등을 위하여 필수적으로 적용되는 절삭유와 관련한 분야에 있어서 최근에 환경성과 경제성을 고려한 청정 생산 기술의 도입이 전 세계적으로 활성화되면서 사용량을 억제하거나 대체화하는 방식과 폐절삭유의 발생을 저감화하기 위한 수명 향상 방식 등을 위한 관련 연구들이 경쟁적으로 진행되고 있다. 그러나 현재까지 불가피하게 수용성 절삭유를 일반적으로 사용하는 국내 중소기업 형태의 영세한 생산 제조 작업 현장에 있어서는 비산, 분무되는 절삭유에 의하여 작업 환경이악화될 뿐만 아니라 점진적으로 부패되어 악취가 발생됨으로써 작업자가 기피하거나 산업 재해의 원인으로서도 작용되므로 우선적으로 절삭유의 사용량을 억제하기 위하여 최소한의 적정량만을 적용할 수 있는 기법을 채택하거나 절삭유의 수명을 극대화하기 위하여 적정한 상태를 유지할 수 있는 방식이 요구된다.(중략)

• Journal of the Korea Institute of Military Science and Technology
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• v.5 no.2
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• pp.195-206
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• 2002

The conjugate heat transfer from the simulated module in a horizontal channel with the variation of inlet air temperature is experimentally investigated. The aim of this study is to estimate temperature difference between a module and inlet air. This study is performed with the variation of parameters that are inlet air temperature(Ti=25~$55^{\circ}C), thermal resistance( $R_c$=0.05, 4.11, 158 K/W), inlet air velocity(Vi=0.1~1.5m/s), and input power(Q=3, 7 W). The results show that the effect of inlet air temperature is little, at the case of using conductive board. And input power was most effective parameter on the temperature difference between module and Inlet air.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.7
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• pp.103-110
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• 2014

Recent TSV based 3D Integrated Circuit (IC) technology needs more powerful thermal management techniques. However, because cooling cost and form factor are restricted, thermal management are emphasis on software based techniques. But in case of throttling thermal management which one of the most candidate technique, increasing bus occupation induce total performance decrease. To solve communication bottleneck issue in TSV based 3D SoC, we proposed adaptive throttling technique Experimental results show that the proposed method can improve throughput by about 72% compare with minimal path routing.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.35-39
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• 2023

ESG (Environment, Social, Governance) has become a major guideline for many companies to improve corporate value and enable sustainable management. Among them, the environment requires a technological approach. This is because technological solutions are needed to reduce or prevent environmental pollution and save energy. Semiconductor package technology has been developed to better satisfy the essential roles of semiconductor packaging: chip protection, electrical/mechanical connection, and heat dissipation. Accordingly, technologies have been developed to improve heat dissipation effect, improve electrical/mechanical properties, improve chip protection reliability, stacking and miniaturization, and reduce costs. Among them, heat dissipation technology increases thermal efficiency and reduces energy consumption for cooling. Also, technology to improve electrical characteristics has had an impact on the environment by reducing energy consumption. Technologies that recycling or reducing material consumption reduce environmental pollution. And technologies that replace environmentally harmful substances contribute to environmental improvement, in particular. In this paper, I summarize trends in semiconductor package technologies to prevent pollution and improve environment.

• Journal of Energy Engineering
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• v.12 no.1
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• pp.17-22
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• 2003

The present study was conducted to obtain the fundamental knowledge on the manufacturing and operating characteristics of a small scale CPL (Capillary Pumped Loop) heat pipe. CPL heat pipes are able to transfer heat effectively at any orientation in a gravitational field over long distances. An experimental model with an evaporator of a circular plate shape was designed and manufactured and its operating performances were tested. A Bronze powder sintered metal plate of 3 mm thick and $\Psi$ 50 mm was used as wick and ethanol was used as working fluid. An experimental apparatus was set up to ascertain the operating conditions oi CPL at different heat load and an surrounding temperature at the condenser was maintained about 13$^{\circ}C$.

• Journal of the Korean Society of Propulsion Engineers
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• v.4 no.2
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• pp.46-53
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• 2000

Hot forging of aluminum alloy has the bad machinability due to continuous chip formation caused from the ductility The bad machinability requires a labor and a high cost to produce final products after hot forging. In industrial field, T4 heat treatment is performed to improve the machinability, and the annealing and the cold sizing are followed. In this study, a series of heat treatments are introduced during hot forging operation without T4 heat treatment after forming so that it improves the machinability with reduction of the number of operations and machining cost. Instead of T4 heat treatment, water cooling and air cooling are tried and compared to find out an optimum cooling condition

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.124-130
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• 2001

The heat transfer and flow measurements were made on a cylindrical pedestal mounted on a flat plate with a turbulent impinging air jet. The heat transfer coefficient distributions on the flat plate were measured using the shroud-transient technique and liquid crystal was used to measure the surface temperature. The jet Reynolds number (Re) is 23,000, the dimensionless nozzle-to-surface distance (L/d) from 2 to 10, the dimensionless pedestal diameter-to-height (H/D) from 0 to 1.5, the dimensionless 2nd pedestal diameter-to-height ($H/D_2$) from 0 to 0.4 and the distance from the stagnation point to 2nd pedestal (p/D). The results show that for H/D = 0.5 to 1.5, the Nusselt number distributions on the plate surface exhibit a maximum between $r/d\;{\cong}\;1.0$ and 1.5. The presence of the pedestal appears to cause the flow separation and reattachment on the plate surface, which results in the maximum heal transfer coefficient. Also, for p/D = 2.5 and $H/D_2$ = 0.3, the local Nusselt number in the region corresponding to $r/d\;{\cong}\;1.1$ was increased up to 50% compared to that for $H/D_2=0$.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.241-241
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• 2010

적외선 센서는 빛의 유무에 관계없이 물체 또는 인체에서 발산하는 적외선을 감지한다. 이러한 센서를 전자 및 디스플레이 시스템과 연동하면 열영상 시스템이 되는데, 이는 전방 감시, 플랜트 감시, 보안, 방범용으로 많이 사용되며, 특히 자동차 야간 운전자 보조용으로 사용되어 최첨단, 고부가가치를 지니고 있는 핵심부품이다. 비냉각형 적외선 센서인 마이크로볼로미터는 상온에서 작동하므로 극저온 Cooler가 불필요하며, 무게와 부피가 작아 각종 시스템에 부착가능하다. 특히 볼로미터형 적외선 센서는 용량이 적은 TE cooler로 상온으로 안정화를 시키며, 진공으로 유지되는 금속 또는 세라믹 패키지를 사용하게 된다. 본 연구에서는 마이크로 볼로미터용 진공패키지를 제작하여 패키지 조립 및 측정기술에 대해 조사하였다. 패키지는 금속재질인 kovar를 사용하여 제작되었고, 내부에 TE Cooler와 장수명 진공유지를 위한 getter, 그리고 온도센서 및 볼로미터 센서 칩을 장착하여 조립하였다. 패키지 Cap ass'y와 base envelop의 솔더링 공정은 약 $200^{\circ}C$에서 수행하였으며, evacuation system을 이용하여 5일 동안 패키지 bake-out 공정을 수행하였다. 이 후 getter를 활성화시키고, seal-off 공정으로 진공 기밀을 유지하였다. 진공 패키지의 기밀성은 $6{\times}10^{-9}\;std.cm^3/sec$로 기밀성을 유지하였다. 볼로미터 센서의 반응도는 $10^2\;V/W$ 이상을 나타내었으며, 탐지도는 $2{\times}10^8\;cm-Hz^{1/2}/W$를 나타내었다.