• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.3
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• pp.16-23
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• 2017

For most machine tools, it is necessary to remove chips and coolant oil because it they will continue to be created during the manufacture of workpieces. Existing products that are in use are installed and used as they reflect depending on the characteristics of each device separately. This study proposes a method to remove the security chip as well as developing an integrated system capable of reducing coolant damage. The Leverage AutoCAD and CATIA program was used for 2D and 3D design, shapes were identified by utilizing the KeyShot program, and the load and displacement analysis of the development apparatus was performed utilizing the ANSYS program. After the prototype underwent sufficient design review, the mixed oil separation device had a complete sensor control program using the LabVIEW program. The chip design process for transferring experiments and experiments on the mixed oil cooling device were developed for performance tests of the product. The final product resulted in an increase in space utilization during commercialization, reduced installation costs, and caused social effects such as pulmonary flow reduction, which, through the economic costs, reduces pollution, resulting in various benefits to the industry, such as deceased errors in the workplace decreases.

• Journal of KIISE:Computer Systems and Theory
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• v.35 no.12
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• pp.540-551
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• 2008

Today's microprocessor designs are not free from temperature as well as power consumption. As processor technology scales down, an on-chip circuitry increases power density, which incurs excessive temperature (hotspot) problem. To tackle thermal problems cost-effectively, Dynamic Thermal Management (DTM) has been suggested: DTM techniques have benefits of thermal reliability and cooling cost. However, they require trade-off between thermal control and performance loss. This paper proposes a dual integer register file structure to minimize the performance degradation due to DTM invocations. In on-chip thermal control, the most important functional unit is an integer register file. It is the hotspot unit because of frequent read and write data accesses. The proposed dual integer register file migrates read data accesses by adding an extra register file, thus reduces per-unit dynamic power dissipation. As a result, the proposed structure completely eliminates localized hotspots in the integer register file, resulting in much less performance degradation by average 13.35% (maximum 18%) improvement compared to the conventional DTM architecture.

• The Journal of the Acoustical Society of Korea
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• v.39 no.6
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• pp.568-575
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• 2020

Ultrasound has been widely used in various industrial fields. One of challenging application areas is cooling microelectronics. Ultrasonic cooling systems can work with air, argon (Ar) and nitrogen (N₂) instead of conventional refrigerant such as freon gas, which can cause global warming. Furthermore, ultrasonic systems do not have moving parts, thus high durability can be obtained. So it is necessary to develop ultrasonic cooling systems due to environmental issues and durability points. In this paper, the design and fabrication processes are explained. When designing the system, a feasibility test was performed with a prototype cooler. Based on the result, finite element analysis with ANSYS software was performed. The predicted anti-resonance frequency for a piezoelectric actuator was 34.8 kHz, which was in good agreement with the experimental result of 34.6 kHz with 0.6% error. In addition, the predicted anti-resonance frequency for the ultrasonic waveguide was 39.4 kHz, which also agreed well with the experimental value of 39.8 kHz with 1.0% error. Based on these results, the developed ultrasonic waveguide might be applicable in microchip cooling.

• Journal of the Korea Society of Computer and Information
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• v.16 no.7
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• pp.1-11
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• 2011

Many researchers have studied on the methods to improve the processor performance. However, high integrated semiconductor technology for improving the processor performance causes many problems such as battery life, high power density, hotspot, etc. Especially, as hotspot has critical impact on the reliability of chip, thermal problems should be considered together with performance and power consumption when designing high-performance processors. To alleviate the thermal problems of processors, there have been various researches. In the past, mechanical cooling methods have been used to control the temperature of processors. However, up-to-date microprocessors causes severe thermal problems, resulting in increased cooling cost. Therefore, recent studies have focused on architecture-level thermal-aware design techniques than mechanical cooling methods. Even though architecture-level thermal-aware design techniques are efficient for reducing the temperature of processors, they cause performance degradation inevitably. Therefore, if the mechanical cooling methods can manage the thermal problems of processors efficiently, the performance can be improved by reducing the performance degradation due to architecture-level thermal-aware design techniques such as dynamic thermal management. In this paper, we analyze the cooling efficiency of high-performance multicore processors according to mechanical cooling methods. According to our experiments using air cooler and liquid cooler, the liquid cooler consumes more power than the air cooler whereas it reduces the temperature more efficiently. Especially, the cost for reducing $1^{\circ}C$ is varied by the environments. Therefore, if the mechanical cooling methods can be used appropriately, the temperature of high-performance processors can be managed more efficiently.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.5-9
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• 2015

Thermal management becomes serious in 3D stacked IC because of higher heat flux, increased power generation, extreme hot spot, etc. In this paper, we reviewed the recent developments of thermal management for 3D stacked IC which is a promising candidate to keep Moore's law continue. According to experimental and numerical simulation results, Cu TSV affected heat dissipation in a thin chip due to its high thermal conductivity and could be used as an efficient heat dissipation path. Other parameters like bumps, gap filling material also had effects on heat transfer between stacked ICs. Thermal aware circuit design was briefly discussed as well.

• Journal of the Korea Society of Computer and Information
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• v.19 no.4
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• pp.1-8
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• 2014

As cores in multi-core processors are integrated in a single chip, power density increased considerably, resulting in high temperature. For this reason, many research groups have focused on the techniques to solve thermal problems. In general, the approaches using mechanical cooling system or DTM(Dynamic Thermal Management) have been used to reduce the temperature in the microprocessors. However, existing approaches cannot solve thermal problems due to high cost and performance degradation. However, floorplan scheme does not require extra cooling cost and performance degradation. In this paper, we propose the diverse floorplan schemes in order to alleviate the thermal problem caused by the hottest unit in multi-core processors. Simulation results show that the peak temperature can be reduced efficiently when the hottest unit is located near to L2 cache. Compared to baseline floorplan, the peak temperature of core-central and core-edge are decreased by $8.04^{\circ}C$, $8.05^{\circ}C$ on average, respectively.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2000.04a
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• pp.39-39
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• 2000

열간단조후 절삭가공하여 냉간 성형가공하는 알루미늄 제품은 열간단조하면 재료가 연화되어 있어 절삭가공시 연속적인 칩이 발생하여 공구와 피삭재를 감고 회전함으로서 가공면 손상, 공구파손 및 작업자의 안전을 초래함에 따라 가공이 어려워 단지 절삭성 개선 목적만을 위해 중간공정으로 T4 열처리하여 절삭가공하고 다시 어닐링처리하여 냉간성형을 하고 최종열처리를 한다. 따라서 본 연구는 열간단조후 제품을 급냉시키면 용제화처리의 효과를 얻어 재료가 경화됨으로써 절삭성이 개선될 수 있다는 이론에 근거하여 T4 열처리를 대체할 수 있는 후처리 방법에 대해 연구하였다. 최적의 후처리방법을 구하기 위해 열간단조후 수냉과 공냉처리를 비교 분석하였고, 열간단조후 냉각처리까지 지연된 시간과 수냉과정에서의 유지시간에 따른 분석을 통해 최적의 작업조건을 선정하였다.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.12
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• pp.198-203
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• 1999

In this study, chip-tool friction and shear characteristics of cold drawn free machining steels in turning were assessed. To do this, a newly developed equivalent oblique cutting model was adopted. And for comparison with those of free machining steels, chip-tool friction and shear characteristics of conventional carbon steels were also investigated. The Pb-S free machining steel shows superior machinability to others. In case of the Bi-S free machining steel, the shear stress and the specific friction energy are relatively lower than those of conventional carbon steels, but its shear strain is relatively high, so it does not show any remarkable improvement of machinability.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1918-1920
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• 2001

초소형 히트파이프는 고집적 반도체 소자에서 발생되는 열을 효과적으로 소산하기 위한 열교환 장치이다. 초소형 히트파이프는 작동유체가 상 변화 잠열을 이용한 칩 레벨의 냉각 장치이다. 작동유체는 진공으로 밀봉된 공간내에서 외부 동력 없이 모세관력에 의하여 이동한다. 본 논문에서는 실리콘보다 열전도도가 우수하여 발생되는 열을 더욱 빠르게 소산시킬 수 있는 구리 모재의 초소형 히트파이프를 제작한다. 특히, 모세관력은 히트파이프의 성능을 좌우하는 요소이다. 모세관력 향상을 위해서 구리 전기도금으로 이용하여 홈(groove)부분을 제작한다. 윅(wick) 제작, 구리판 접합, 작동유체 충전등으로 초소형 히트파이프를 제작한 후, 성능 실험한 결과를 보여준다.

• Journal of computational fluids engineering
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• v.18 no.2
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• pp.9-16
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• 2013

The heat transfer enhancement of heat sink with mist flow is studied numerically by solving the conservation equations for mass, momentum and energy in the continuous and dispersed phases. A Lagrangian method is used for tracing dispersed water droplets in the heat sink and an Eulerian species transport model for air and steam mixture. The continuous and dispersed phases are interacted with the drag and evaporation source terms. The computed results show that addition of evaporating mist droplets enhances the cooling performance of heat sink significantly.