• Korean Chemical Engineering Research
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• v.48 no.4
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• pp.470-474
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• 2010

In this study, we presents a simple microfluidic approach for generating uniform Poly(ethylene glycol)(PEG) microfiber. Elongated flow pattern of monomer induced by sheath flow of immiscible oil as continuous phase is generated in Y-shape junction and in situ polymerization by UV exposure. For uniform microfiber, we investigate the optimized flow condition and draw phase diagram as function of Ca and Qd. At the region for stable elongated flow pattern, the microfiber generated in microfluidic chip is very uniform and highly reproducible. Importantly, the thickness of microfibers can be easily controlled by flow rate of continuous and disperse phase. We also demonstrate the feasibility for biological application as encapsulating FITC-BSA in PEG microfiber.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.63-67
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• 2008

3D integration technology has been a major focus of the next generation of IC industries. In this study Si wafer ultra-thinning has been investigated especially for the effect of ultra-thinning on the silicon surface. Wafers were grinded down to $30{\mu}m\;or\;50{\mu}m$ thickness and then grinded only samples were compared with surface treated samples in terms of surface roughness, surface damages, and hardness. Dry polishing or wet etching treatment has been applied as a surface treatment. Surface treated samples definitely showed much less surface damages and better roughness. However, ultra-thinned Si samples have the almost same hardness as a bulk Si wafer.

• Korean Journal of Optics and Photonics
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• v.22 no.2
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• pp.96-101
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• 2011

Operational and thermal characteristics of a thin disk Yb:YAG crystal with a thickness of 0.8 mm were studied using as a pumping source a fiber-coupled 930 nm laser diode. The heat generated in the crystal was dissipated by placing both surfaces in contact with copper plates with central hole, and the dependence of the temperature change in the illuminated spot on hole size was investigated by measuring the spectral change of the lasing peaks. The slope efficiency and optical-to-optical efficiency with respect to the LD pump power were as high as 42.2% and 34.8%, respectively. The temperature at the illuminated spot increased with diode current and with increasing hole size of the copper plate. When the hole size considerably exceeded the crystal thickness, the temperature rise deviated from the linear increase at high pump power.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.424-424
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• 2009

그라핀은 밴드갭이 없어서 세미메탈의 성질을 띠므로 초고속 RF 소자에는 응용이 가능하지만, 현재 사용되는 반도체 칩에 사용하기가 불가능하다. 그러나 그라핀을 매우 좁은 리본 형태로 만들 경우 밴드갭이 생기고 이에 따라 반도체특성을 뛰게 된다. 이러한 특성은 시뮬레이션을 통해서만 이해되다가 2007년 P. Kim이 그라핀 나노리본의 밴드캡이 리본의 폭이 좁아짐에 따라 증가함을 실험적으로 최초로 발표하였다. 하지만 그라핀을 나노리본형태로 식각 방법에 대해서는 정확히 연구되지 않았다. 따라서 본 연구에서는 $O_2$ plasma ashing 방법을 이용하여 그라핀을 식각하는 방법에 대해 연구하였다. 먼저 Si기판을 initial cleaning 한 후, highly-oriented pyrolytic graphite(HOPG)를 이용하여 기존의 mechanical exfoliation 방식을 통해 그라핀을 형성하였다. Photo-lithography 방법을 통하여 패터닝한 후, 그라핀을 식각하기 위하여 Reactive Ion Etcher (RIE) system을 이용한 $O_2$ plasma ashing을 50 W에서 1 분간 실시하였다. 다시 image reverse photo-lithography 과정과 E-beam evaporator system를 통해서 Al 전극을 형성하여 graphene-FET를 제작하였고, 광학 현미경과 AFM (Atomic force microscope)을 통해 두께를 확인하였다. 본 연구를 통하여 $O_2$ plasma ashing을 이용하여 쉽게 그라 E을 식각할 수 있음을 확인 하였으며, 제작된 소자의 전기적 특성에 대해서 현재 실험중에 있다.

• Journal of Energy Engineering
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• v.12 no.1
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• pp.17-22
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• 2003

The present study was conducted to obtain the fundamental knowledge on the manufacturing and operating characteristics of a small scale CPL (Capillary Pumped Loop) heat pipe. CPL heat pipes are able to transfer heat effectively at any orientation in a gravitational field over long distances. An experimental model with an evaporator of a circular plate shape was designed and manufactured and its operating performances were tested. A Bronze powder sintered metal plate of 3 mm thick and $\Psi$ 50 mm was used as wick and ethanol was used as working fluid. An experimental apparatus was set up to ascertain the operating conditions oi CPL at different heat load and an surrounding temperature at the condenser was maintained about 13$^{\circ}C$.

• Proceedings of the Korea Information Processing Society Conference
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• 2017.04a
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• pp.1131-1134
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• 2017

본 연구는 차동 용량형 섬유 압력 센서를 개발하고, 이를 깔창에 부착하여 보행 측정에 응용하는 것을 목적으로 한다. 차동 용량형 섬유 압력 센서는 3장의 전도성 섬유 사이에 2장의 절연체를 위치시키는 형태로, $5cm{\times}5cm{\times}0.23cm$ (가로 ${\times}$ 세로 ${\times}$ 두께) 크기로 제작하였다. 커패시턴스를 측정하기 위해 커패시턴스-디지털 변환칩(AD7152), ATMega328로 구성된 시스템을 제작하였고 PC로 데이터를 전송하여 모니터링을 수행하였다. 센서의 힘-커패시턴스 변화 특성 평가를 위해 센서에 가하는 중량을 65 kg 까지 5 kg 씩 증가시켜 가며 커패시턴스 변화를 측정하였다. 실험 결과, 무게에 따라 커패시턴스가 증가하는 것을 확인하였다. 보행 측정 가능성을 평가하기 위해 센서를 깔창에 부착한 후 보행 신호를 측정하였으며, 그 결과 보행에 따라 센서의 커패시턴스 값이 변화하는 것을 확인하였다. 이로부터 제작한 차동용량형 섬유 센서는 보행 측정에 활용할 수 있는 가능성을 확인하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.12
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• pp.1118-1123
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• 2008

High voltage multilayer ceramic capacitors (MLCCs) are classified into two classes-those for temperature compensation (class I) and high dielectric constant materials (class II). We manufactured high voltage MLCC with temperature coefficient characteristics of C0G and X7R and studied the characteristics of electric properties. Also we studied the characteristics of dielectric breakdown voltage (V) as the variation of thickness in the green sheet and how to pattern the internal electrodes. The dielectric breakdown by electric field was caused by defects in the dielectric materials and dielectric/electrode interface, so the dielectric thickness increased, the withstanding voltage per unit (E) thickness decreased. To overcome this problem, we selected the special design like as floating electrode and this design affected the increasing breakdown voltage(V) and realized the constant withstanding voltage per unit thickness(E). From these results, high voltage application of MLCCs can be expanded and the rated voltage can also be develop.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2018.05a
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• pp.57-58
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• 2018

In this paper, we studied a design method for a quasi-Yagi antenna operating over a broad bandwidth covering the UHF RFID(902-928 MHz) and GNSS(1,164-1.605 MHz). The proposed antenna is composed of three elements(dipole, reflector, and director) and fed by a coplanar waveguide. To reduce its size, a balun is integrated inside the antenna, and the ends of both the dipole and reflector are bent. Broadband impedance matching was obtained by placing the director near to the dipole and loading a chip capacitor inside the antenna. The antenna, designed through simulations, was fabricated on an FR4 substrate with 0.8 mm thickness. The experiment results for the antenna characteristics agree very well with the simulation.

• Korean Chemical Engineering Research
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• v.59 no.1
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• pp.100-105
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• 2021

This paper proposes the polydimethylsiloxane (PDMS) blade coating method for fabrication of paper-based analytical device (PAD) that is able to monitor the disease diagnosis and progress without special analytical equipment. The mold that has PAD design is easily modified by using laser cutting technique. And the fabricated mold is used for hydrophobic barrier formation by blade coating. We have optimized the stable formation of PDMS hydrophobic barrier as blade coating condition, which is established by analyzing the structure of the PDMS hydrophobic barrier and change of hydrophilic channel size as thickness of the ink and contact time with the chromatography paper. Based on optimal condition, we demonstrate that PAD as biosensor can apply to detect protein, glucose, and metal ion without special analysis equipment.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.