• Elastomers and Composites
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• v.52 no.2
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• pp.114-130
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• 2017

Enhancing the properties of rubber, such as the tensile strength, modulus, and wear abrasion, by the addition of carbon black and silica as fillers is very important for improving the performance of rubber products. In this review, we summarize the general features of 'the reinforcement of rubber by fillers' and the equations for representing the reinforcement phenomena. The rubber reinforcement was attributed to enhancement of the following: the rubber, bound rubber, formation of networks, and combination between rubber chains and silica followed by entanglement. The reinforcement capability of silica species with different surface and networked states demonstrated the importance of the connection between the silica particles and the rubber chains in achieving high reinforcement. The model involving combination followed by entanglement can provide a plausible explanation of the reinforcement of rubber by carbon black and silica because the combination facilitates the concentration of rubber chains near the filler particles, and entanglement of the rubber chains around the filler particles enforces the resistance against deformation and breakage of rubber compounds, resulting in high reinforcement.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.343-343
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• 2015

고종횡비의 실리콘 관통전극(TSV)은 반도체 3차원 적층을 실현하기 위한 핵심적인 기술이다. TSV의 충전은 주로 전해도금을 이용하는데 무결함 충전을 위해서 도금액에 몇 가지 첨가제(억제제, 가속제, 평탄제)가 포함된다. 본 연구에서는 첨가제 유무 따른 비아 충전 양상 및 무결함 충전에 대한 연구를 진행하였다. 비아 충전 공정을 위해서 직경 10 um, 깊이 50 um의 TSV가 패터닝된 웨이퍼를 준비하였으며 도금 후 단면을 관찰하여 도금의 양상을 비교하였다. 도금액에 첨가제가 포함되지 않는 조건, 억제제와 가속제만 포함된 조건, 세 가지 첨가제가 모두 포함된 조건으로 비아 충전을 실행하였으며 최종적으로 무결함 충전이 되는 첨가제 조건을 찾을 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.51-63
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• 1999

The effects of high filler loading technique on the reliability of epoxy molding compound (EMC) as a microelectronic encapsulant was investigated. The method of high filler loading was established by the improvement of maximum packing fraction using the simplified packing model proposed by Ouchiyama, et al. With the maximum packing fraction of filler, the viscosity of EMC wart lowered and the flowability was improved. As the amount of filler in EMC increased, several properties such as internal stress and moisture absorption were improved. However, the adhesive strength with the alloy 42 leadframe decreased when the filler content was beyond the critical value. It was found that the appropriate content of filler was important to improve the reilability of EMC, and the optimum filler combination should be selected to obtain high reliable EMC filled with high volume fraction of filler.

• Elastomers and Composites
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• v.46 no.2
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• pp.138-143
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• 2011

EPDM compounds and vulcanizates containing inorganic filler such as talc, calcium carbonate, or clay as well as carbon black were prepared, and the influence of inorganic filler on properties of the EPDM compounds and vulcanizates were investigated. The bound rubber contents did not significantly increase even though the inorganic filler was added. There were big aggregates in the EPDM samples with high loading inorganic filler. By adding the inorganic filler, the cure times tended to increase and the delta torque decreased. The modulus were on the whole decreased, whereas the elongation at break, tensile strength, and tear strength were increased by adding the inorganic filler. The decreased modulus and increased elongation at break can be explained with the decreased delta torque, the increases of tensile strength and tear strength can be explained with the increased elongation at break. By adding the inorganic filler, level of reinforcing in the EPDM compounds did not increase and the crosslink density decreased.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.80-80
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• 2018

실리콘 관통전극 (Through Silicon Via, TSV)는 메모리 칩을 적층하여 고밀도의 집적회로를 구현하는 기술로, 기존의 와이어 본딩 (Wire bonding) 기술보다 낮은 소비전력과 빠른 속도가 특징인 3차원 집적기술 중 하나이다. TSV는 일반적으로 도금 공정을 통하여 충전되는데, 고종횡비의 TSV에 결함 없이 구리를 충전하기 위해서 3종의 유기첨가제(억제제, 가속제, 평탄제)가 도금액에 첨가되어야 한다. 이러한 첨가제 중 결함 발생유무에 가장 큰 영향을 주는 첨가제는 평탄제이기 때문에, 본 연구에서는 이미다졸(imidazole) 계열, 이민(imine) 계열, 디아조늄(diazonium) 계열 및 피롤리돈(pyrrolidone) 계열과 같은 평탄제(leveler)의 작용기에 따라 TSV 충전 성능을 조사하였다. TSV 충전 시 관능기의 거동을 규명하기 위해 QCM (quartz crystal microbalance) 및 EQCM (electrochemical QCM)을 사용하여 흡착 정도를 측정하였다. 실험 결과, 디아조늄 계열의 평탄제는 TSV를 결함 없이 충전하였지만 다른 작용기를 갖는 평탄제는 TSV 내 결함이 발생하였다. QCM 분석에서 디아조늄 계열의 평탄제는 낮은 흡착률을 보이지만 EQCM 분석에서는 높은 흡착률을 나타내었다. 즉, 디아조늄 계열의 평탄제는 전기 도금 동안 전류밀도가 집중되는 TSV의 상부 모서리에서 국부적인 흡착을 선호하며 이로 인하여 무결함 충전이 달성된다고 추론할 수 있다.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.7 no.5
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• pp.29-35
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• 1993

본 논문에서는 에폭시 수지에 충전제 SiO2의 함량(0, 50, 100, 150w%)에 따라 제작한 에폭시 복합재료에 대한 충전제 함량, 온도, 두께, 충격전압에 따른 절연파괴강도의 온도의존성과 계면처리효과에 대한 절연파괴특성에 대하여 연구하였다. 연구결과로, 임펄스 전압인가에 따른 절연파괴강도의 온도의존성은 저온영역에서는 ∂EBD/∂T 0의 경향을 나타내며, 절연파괴기구로서는 전자사태파괴를 생각할 수 있다. 고온 영역에서는 ∂EBD/∂T〈0의 경향을 확인하였다. 계면처리효과에 따른 절연파괴강도의 온도의존성은 충전제함량이 적은 경우(충전제함량 50wt%이하)는 모든 영역에서는 계면처리시료의 절연파괴강도가 상승하였으나, 고온영역에서는 충전제 함량이 증가할수록(100wt%이상) 계면처리효과가 저하하였다.

• Applied Chemistry for Engineering
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• v.9 no.7
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• pp.961-967
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• 1998

In order to improve the optical properties and printability of paper, various fillers are used in papermaking. This study was performed to investigate several fillers-precipitated calcium carbonate(PCC), ground calcium carbonate(GCC), and blends(PCC/talc or micro-talc(MVP) and GCC/talc or micro-talc(MVP)-for their effects on various newsprint properties. Results obtained from the study were summarized as follows ; 1) PCC treatment gave about 16.8% higher retention than GCC treatment at the filler level of 5% and the retention of filler in the handsheet increased as average particle size of mixed filler was increasing($PCC{\leq}GCC<MVP<talc$). 2) PCC treatment kept opacity more highly than no filler treatment and opacity decreased as average particle size of mixed filler was increasing. 3) Independent treatment of PCC kept tear strength more effectively than GeC did, and tear strength increased as average particle size of mixed filler was increasing. 4) Independent treatment of pee kept tensile strength more highly than other treatments and Gee treatment kept tensile strength highly than pee treatment under mixed filler treatment. 5) Burst strength under PCC treatments decreased linearly as average particle size of mixed filler was increasing. 6) Compared "With non-filler treatment, filler treatment gave much better printability.

• Polymer(Korea)
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• v.38 no.3
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• pp.397-405
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• 2014

To manufacture of high-performance semi-structural double-sided adhesive tape, 2-ethylhexyl acrylate (2-EHA) and acrylic acid (AAC) were used, and the syrup was prepared by UV irradiation in this study. The effects of the thickness, various inorganic filler contents, and filler types on the semi-structural properties of acrylic double-sided adhesive tape were investigated. The peel strength increased with increasing thickness and wetting time. In case of the thin thickness (under $250{\mu}m$) with decreasing true density of inorganic filler, the peel strength increased with increasing wetting time. The initial peel strength showed a higher value at a big size of inorganic filler, and the filler's size in adhesive tapes was confirmed by SEM images. The peel strength and dynamic shear strength increased as a proportional relationship with various inorganic fillers and contents, and these inorganic fillers in $0.1{\mu}m$ thickness indicated more effect on the dynamic shear strength of double-sided adhesive tape. From these results the thin acrylic double-sided adhesive tape determined to be use for applications as a high-performance semi-structural.

• Conservation Science in Museum
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• v.27
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• pp.91-102
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• 2022

Silica-based inorganic fillers for restoration of iron objects have been used for the reduction of thermal expansivity and the improvement of melt flow index. However, the higher the amount of filler is applied, the more degradation of mechanical properties and the yellowing occur, which could cause retreatment of the objects with adding stress to them. Thus, research on not only the quantification of a mixture of resin and filler but also the yellowing should be emphasized. Experiments on mechanical properties were carried out with a silica-based light filler, Micro Shell as a comparison group. The results of the experiment showed Micro Shell reduced the number of occurrences of the yellowing by 34% compared to existing fillers. The value of adhesion and specific gravity was also improved depending on the filler amount. The results of this research indicate the possibility of using Micro Shell as a new filler.

• Journal of the Korean Society of Propulsion Engineers
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• v.20 no.4
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• pp.50-58
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• 2016

Korean Space Launch Vehicle (KSLV-II) Propellant Supply System charges liquid oxygen and kerosene to each propellant tank for the stages. To charge the launch vehicle propellant tank safety, the propellant charge flow rates and scenarios should be defined. First, the Propellant Supply System was modeled with 1D flow analysis program. The control valve capacity and orifice size were calculated by performing the 1D steady state simulation. Second, the 1D transient simulation was performed by using the steady state simulation results. As propellants were being charged at the each tank, the increased tank liquid level decreases the charge flow rate. Consequently, the proposed supply system satisfies the required design charging conditions.