• Proceedings of the Korean Society for Rock Mechanics Conference
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• 2008.03a
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• pp.51-68
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• 2008

When the train enters into a tunnel a high speed, pressure waves are generated inside the tunnel. The pressure waves at propagate in a form of compression wave toward the tunnel exit and a fraction of the compression waves that arrives at the exit of the tunnel are discharged to outside of the tunnel and the remainder is reflected into the tunnel as expansion waves. The compression waves emitted from the tunnel does not radiate in a specific direction but in all directions. If the amplitude of the compression wave is great, it causes noise and vibration, and it is called "Micro-Pressure Wave." "Micro-Pressure Wave" must be considered as a decision for the optimum tunnel cross-section as the amplitude of the compression wave depends on train speed, tunnel length, area of tunnel and train. Therefore, this paper introduces the case study of Micro-Pressure Wave characteristics for determination of tunnel cross section in Honam high speed railway, the pressure inside the tunnel and the micro-pressure waves at tunnel exit were measured at Hwashin 5 tunnel in Kyungbu HSR line. At the same time. a test of train operation model was performed and then the measurement results and test results were compared to verify that the various parameters used as input conditions for the numerical simulations, which were appropriate. Also a model test was performed, in order to analysis of the Micro-Pressure Wave Mitigation Performance by Type of Hood at Entrance Portal.

• Proceedings of the KSR Conference
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• 2007.11a
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• pp.480-493
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• 2007

Many railway-advanced countries are using the various types of track to reduce the track maintenance and repair cost according to the improvement of velocity. It spends on much maintenance and repair cost for ballast track due to abrasion of ballast, track irregularity and unisotropical ballast-support stiffness. The ballast track on railway bridge is accelerating the deterioration of ballast according to interaction of railway bridge and track. As continuing the deterioration, it is caused dynamic loads. Due to these effects, it increases negative loads of track and bridge. However, when designing the railway bridge, the effect of ballast track was applicate only dead load, so elastic behavior effect of ballast track is not influenced. Therefore, this paper presumes the stiffness of ballast track on railway bridge considering dynamic behavior of railway bridge, it was evaluated that effect on dynamic behaviors of railway bridge according to ballast track stiffness.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.